NICHIA STS-DA1-3280 <Cat.No.141015>
SPECIFICATIONS
(1) Absolute Maximum Ratings
Item
Forward Current
Pulse Forward Current
Allowable Reverse Current
Power Dissipation
Operating Temperature
Storage Temperature
Junction Temperature
Symbol
I
F
I
FP
I
R
P
D
T
opr
T
stg
T
J
Absolute Maximum Rating
700
1000
85
2.87
-10~85
-40~100
130
Unit
mA
mA
mA
W
°C
°C
°C
* Absolute Maximum Ratings at T
S
=25°C.
* I
FP
conditions with pulse width
≤10ms
and duty cycle
≤10%.
(2) Initial Electrical/Optical Characteristics
Item
Forward Voltage
Radiant Flux
Peak Wavelength
Spectrum Half Width
Thermal Resistance
* Characteristics at T
S
=25°C.
* Radiant Flux value as per CIE 127:2007 standard.
* R
θJS
is Thermal Resistance from junction to T
S
measuring point.
* It is recommended to operate the LEDs at a current greater than 10% of the sorting current to stabilize the LED characteristics.
Symbol
V
F
Φ
e
λ
p
Δλ
R
θJS
Condition
I
F
=500mA
I
F
=500mA
I
F
=500mA
I
F
=500mA
-
Typ
3.6
275
375
9.0
11.2
Max
-
-
-
-
12.6
Unit
V
mW
nm
nm
°C/W
1
NICHIA STS-DA1-3280 <Cat.No.141015>
RANKS
Item
M2
Forward Voltage
Lk2
Lk1
K2
P5
P4
P3
Radiant Flux
P2
P1
P0
Pz
Peak Wavelength
* Ranking at T
S
=25°C.
* Forward Voltage Tolerance: ±0.05V
* Radiant Flux Tolerance: ±6%
* Peak Wavelength Tolerance: ±3nm
* LEDs from the above ranks will be shipped.
The rank combination ratio per shipment will be decided by Nichia.
U375
Rank
Min
3.9
3.6
3.3
3.1
430
360
300
255
215
180
150
370
Max
4.1
3.9
3.6
3.3
510
430
360
300
255
215
180
380
nm
mW
V
Unit
2
NICHIA STS-DA1-3280 <Cat.No.141015>
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
1 to 5°C per sec
Pre-heat
180 to 200°C
60sec Max
Above 220°C
120sec Max
260°CMax
10sec Max
●
Recommended Soldering Pad Pattern
4.1
0.6
3.5
(単½ Unit: mm)
* This LED is designed to be reflow soldered on to a PCB. If dip soldered or hand soldered,
Nichia cannot guarantee its reliability.
* Reflow soldering must not be performed more than twice.
* Avoid rapid cooling. Ramp down the temperature gradually from the peak temperature.
* Nitrogen reflow soldering is recommended. Air flow soldering conditions can cause optical degradation,
caused by heat and/or atmosphere.
* Since the silicone used in the encapsulating resin is soft, do not press on the encapsulant resin.
Pressure can cause nicks, chip-outs, encapsulant delamination and deformation, and wire breaks, decreasing reliability.
* Repairing should not be done after the LEDs have been soldered.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
* When soldering, do not apply stress to the LED while the LED is hot.
* When using a pick and place machine, choose an appropriate nozzle for this product. Using a pick-and-place nozzle
with a smaller diameter than the size of the LED's emitting surface will cause damage to the emitting surface
and may also cause the LED not to illuminate.
* The recommended soldering pad pattern is designed for attachment of the LED without problems.
When precise mounting accuracy is required, such as high-density mounting, ensure that the size and shape of the pad
are suitable for the circuit design.
* When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner
where the flux will come in contact with the LEDs.
* Make sure that there are no issues with the type and amount of solder that is being used.
4
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