Comparator, 2 Func, 3000uV Offset-Max, BIPolar,
| 参数名称 | 属性值 |
| 厂商名称 | Signal Processing Technologies |
| Reach Compliance Code | unknown |
| 放大器类型 | COMPARATOR |
| 最大平均偏置电流 (IIB) | 20 µA |
| 25C 时的最大偏置电流 (IIB) | 20 µA |
| 最大输入失调电压 | 3000 µV |
| JESD-30 代码 | X-XUUC-N16 |
| 负供电电压上限 | -6 V |
| 标称负供电电压 (Vsup) | -5.2 V |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 25 °C |
| 最低工作温度 | 25 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装等效代码 | DIE OR CHIP |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 电源 | 5,-5.2 V |
| 认证状态 | Not Qualified |
| 最大压摆率 | 36 mA |
| 供电电压上限 | 6 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | OTHER |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| HCMP96870SCU/A | HCMP96870SIJ/A | HCMP96870SIN/A | HCMP96870SID/A | HCMP96870SIC/A | HCMP96870SIP/A | |
|---|---|---|---|---|---|---|
| 描述 | Comparator, 2 Func, 3000uV Offset-Max, BIPolar, | Comparator, 2 Func, 3000uV Offset-Max, 2ns Response Time, BIPolar, CDIP16, | Comparator, 2 Func, 3000uV Offset-Max, 2ns Response Time, BIPolar, PDIP16, | Comparator, 2 Func, 3000uV Offset-Max, 2ns Response Time, BIPolar, CDIP16, | Comparator, 2 Func, 3000uV Offset-Max, 2ns Response Time, BIPolar, CQCC20, | Comparator, 2 Func, 3000uV Offset-Max, 2ns Response Time, BIPolar, PQCC20, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 放大器类型 | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR | COMPARATOR |
| 最大平均偏置电流 (IIB) | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA |
| 25C 时的最大偏置电流 (IIB) | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA | 20 µA |
| 最大输入失调电压 | 3000 µV | 3000 µV | 3000 µV | 3000 µV | 3000 µV | 3000 µV |
| JESD-30 代码 | X-XUUC-N16 | R-CDIP-T16 | R-PDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | S-PQCC-J20 |
| 负供电电压上限 | -6 V | -6 V | -6 V | -6 V | -6 V | -6 V |
| 标称负供电电压 (Vsup) | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 20 | 20 |
| 最高工作温度 | 25 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | 25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| 封装主体材料 | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DIE | DIP | DIP | DIP | QCCN | QCCJ |
| 封装等效代码 | DIE OR CHIP | DIP16,.3 | DIP16,.3 | DIP16,.3 | LCC20,.35SQ | LDCC20,.4SQ |
| 封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | UNCASED CHIP | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER |
| 电源 | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V | 5,-5.2 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 36 mA | 36 mA | 36 mA | 36 mA | 36 mA | 36 mA |
| 供电电压上限 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | J BEND |
| 端子位置 | UPPER | DUAL | DUAL | DUAL | QUAD | QUAD |
| 厂商名称 | Signal Processing Technologies | - | - | Signal Processing Technologies | Signal Processing Technologies | Signal Processing Technologies |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 标称响应时间 | - | 2 ns | 2 ns | 2 ns | 2 ns | 2 ns |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Base Number Matches | - | 1 | 1 | 1 | 1 | - |
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