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CY7C1360C-225AJXC

产品描述Cache SRAM, 256KX32, 2.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-100
产品类别存储    存储   
文件大小415KB,共31页
制造商Cypress(赛普拉斯)
标准
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CY7C1360C-225AJXC概述

Cache SRAM, 256KX32, 2.8ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, PLASTIC, TQFP-100

CY7C1360C-225AJXC规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Cypress(赛普拉斯)
零件包装代码QFP
包装说明LQFP, QFP100,.63X.87
针数100
Reach Compliance Codecompli
ECCN代码3A991.B.2.A
最长访问时间2.8 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)225 MHz
I/O 类型COMMON
JESD-30 代码R-PQFP-G100
JESD-609代码e3
长度20 mm
内存密度8388608 bi
内存集成电路类型CACHE SRAM
内存宽度32
湿度敏感等级3
功能数量1
端子数量100
字数262144 words
字数代码256000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织256KX32
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP100,.63X.87
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源2.5/3.3,3.3 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.03 A
最小待机电流3.14 V
最大压摆率0.25 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

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PRELIMINARY
CY7C1360C
CY7C1362C
9-Mbit (256K x 36/512K x 18) Pipelined SRAM
Features
Supports bus operation up to 225 MHz
Available speed grades are 225, 200, and 166 MHz
Registered inputs and outputs for pipelined operation
3.3V core power supply
2.5V/3.3V I/O operation
Fast clock-to-output times
— 2.8 ns (for 225-MHz device)
— 3.0 ns (for 200-MHz device)
— 3.5 ns (for 166-MHz device)
Provide high-performance 3-1-1-1 access rate
User-selectable burst counter supporting Intel
®
Pentium
®
interleaved or linear burst sequences
Separate processor and controller address strobes
Synchronous self-timed writes
Asynchronous output enable
Single Cycle Chip Deselect
Offered in Lead-Free 100-pin TQFP, 119-ball BGA and
165-Ball fBGA packages
TQFP Available with 3-Chip Enable and 2-Chip Enable
IEEE 1149.1 JTAG-Compatible Boundary Scan
“ZZ” Sleep Mode Option
Functional Description
[1]
The CY7C1360C/CY7C1362C SRAM integrates 262,144 x 36
and 524,288 x 18 SRAM cells with advanced synchronous
peripheral circuitry and a two-bit counter for internal burst
operation. All synchronous inputs are gated by registers
controlled by a positive-edge-triggered Clock Input (CLK). The
synchronous inputs include all addresses, all data inputs,
address-pipelining Chip Enable (CE
1
), depth-expansion Chip
Enables (CE
2
and CE
3[2]
), Burst Control inputs (ADSC, ADSP,
and ADV), Write Enables (BW
X
, and BWE), and Global Write
(GW). Asynchronous inputs include the Output Enable (OE)
and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when either Address Strobe Processor (ADSP) or
Address Strobe Controller (ADSC) are active. Subsequent
burst addresses can be internally generated as controlled by
the Advance pin (ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed Write cycle.This part supports Byte Write
operations (see Pin Descriptions and Truth Table for further
details). Write cycles can be one to two or four bytes wide as
controlled by the Byte Write control inputs. GW when active
LOW causes all bytes to be written.
The CY7C1360C/CY7C1362C operates from a +3.3V core
power supply while all outputs may operate with either a +2.5
or +3.3V supply. All inputs and outputs are JEDEC-standard
JESD8-5-compatible.
Logic Block Diagram – CY7C1360C (256K x 36)
A0, A1, A
ADDRESS
REGISTER
2
A
[1:0]
MODE
ADV
CLK
Q1
ADSC
ADSP
BW
D
DQ
D ,
DQP
D
BYTE
WRITE REGISTER
DQ
C ,
DQP
C
BYTE
WRITE REGISTER
DQ
B ,
DQP
B
BYTE
WRITE REGISTER
DQ
A ,
DQP
A
BYTE
WRITE REGISTER
BURST
COUNTER
CLR
AND
Q0
LOGIC
DQ
D
,DQP
D
BYTE
WRITE DRIVER
DQ
C ,
DQP
C
BYTE
WRITE DRIVER
DQ
B ,
DQP
B
BYTE
WRITE DRIVER
DQ
A ,
DQP
A
BYTE
WRITE DRIVER
BW
C
MEMORY
ARRAY
SENSE
AMPS
OUTPUT
REGISTERS
OUTPUT
BUFFERS
E
BW
B
DQs
DQP
A
DQP
B
DQP
C
DQP
D
BW
A
BWE
GW
CE
1
CE
2
CE
3
OE
ENABLE
REGISTER
PIPELINED
ENABLE
INPUT
REGISTERS
ZZ
SLEEP
CONTROL
Notes:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
2. CE
3
is for A version of TQFP (3 Chip Enable option) and 165 fBGA package only. 119 BGA is offered only in 2 Chip Enable.
Cypress Semiconductor Corporation
Document #: 38-05540 Rev. *B
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised November 1, 2004

 
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