IC,LCD DISPLAY DRIVER,7-SEG,0-BP,CMOS,DIP,16PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | _compli |
| ECCN代码 | EAR99 |
| 显示模式 | SEGMENT |
| JESD-30 代码 | R-XDIP-T16 |
| 底板数 | 0-BP |
| 区段数 | 7 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 最大压摆率 | 0.6 mA |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 5962-01-181-4860 | 5962-01-228-8768 | CD4543BF3A | CD4543BEX98 | CD4543BEX | CD4543BFX | CD4543BE98 | |
|---|---|---|---|---|---|---|---|
| 描述 | IC,LCD DISPLAY DRIVER,7-SEG,0-BP,CMOS,DIP,16PIN,CERAMIC | IC,LCD DISPLAY DRIVER,7-SEG,0-BP,CMOS,DIP,16PIN,CERAMIC | CD4543BF3A | CD4543BEX98 | CD4543BEX | CD4543BFX | CD4543BE98 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | _compli | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 显示模式 | SEGMENT | SEGMENT | SEGMENT | SEGMENT | SEGMENT | SEGMENT | SEGMENT |
| JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
| 底板数 | 0-BP | 0-BP | 0-BP | 0-BP | 0-BP | 0-BP | 0-BP |
| 区段数 | 7 | 7 | 7 | 7 | 7 | 7 | 7 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C | 125 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C | -55 °C | -40 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V | 5/15 V |
| 最大压摆率 | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA | 0.6 mA |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | MILITARY | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | Renesas(瑞萨电子) | - | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) |
| 包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | - | - | DIP, DIP16,.3 | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | - | Not Qualified |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 |
| JESD-609代码 | - | - | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
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