1
2
3
4
5
6
7
8
LOGO
1.5 0.3
6.5 0.5
A
A
10.0 REF.
A
A
PRODUCT NO. 54601 X 06 XXX WP LF
TELEJACK PCB SERIES
LEAD FREE
*SPECIAL CODE
WP-WITHOUT PROJECTION
BLANK-WITH PROJECTION
13.20
B
B
5.08 0.05
1.016 TYP
9.90
0.1 B
WELD AREA
NOTE-2
CAVITY NO.
PLATING
SEE VIEW A
B
A
2-0.08µ Au SELECTIVE MIN.
6-0.8µ Au SELECTIVE MIN.
7-Au FLASH SELECTIVE MIN.
8-1.27µ Au SELECTIVE MIN.
9-0.38µ Au SELECTIVE MIN.
6.85
3.75 0.50
11.50
8.50
NO.OF POS
06-6 POL INSULATOR
CONTACTS LOADED
BLANK-CTS. LOADED IN ALL POS.
001-CTS. LOADED IN 3 &4 POS.
002-CTS. LOADED IN 2,3,4 &5 POS.
0
1.75
-1.75
NOTE-2
C
TECHNICAL SPECIFICATION:
Insulation Resistance - 500 M Ohms min.
Dielectric Strength - 1000 V rms , 60 Hz.
Contact Resistance - 20 to 30 m Ohms. max.
Current Rating - 2.0 amp DC
Maximum Total Mating Force - 20 N
Retention Force Between Plug & Jack-22.5 N min.
Durability - 250 mating cycles
MATERIAL
Housing: THERMOPLASTIC-UL94 V0 BLACK
Contact:
0.46 COPPER ALLOY ROUND WIRE
Material:
The housing will withstand exposure to 260-265'C for
5 seconds in a wavesoldering application.Use protective
adhesive tape (Kapton or Teflon) or protective metallic devices
on the areas which are directly exposed to wave soldering
as it is used in classical leaded wave soldering.
Contact:
0.46mm Copper Alloy
C
1.73 0.05
3.50
4.06
6.60
10.16
7.88
6.35
8.89
SECTION
A-A
SCALE 4:1
1.27
0.254 X Y
2.10
Y
D
D
WIRE POSITION NO.
P.C.B HOLE PATTERN VIEWED FROM TOP
2.54 TYP.
1.91
0.76
POS.NO.6
POS.NO.5
POS.NO.4
Plating:
Active zone: Gold over nickel on contact area
Termination zone : SnPb over Nickel (Leaded vesion)
: Matte Tin over nickel (Lead Free version)
8.89
E
POS.NO.2
POS.NO.1
6.35
POS.NO.3
X
18.00
3.25 0.10
*OPTIONAL-NOTE 3
SEE SPECIAL CODE
Copyright FCI.
1.LF Products meet European Union Directives and other country
Regulations as described in GS-22-008.
2.The Housing will withstand exposure to 260' peak temperature for
5 sec in a wave solder applicotion with a 1.6mm Min thick circuit board
Slight deformation of snap pegs may occur at 260-265'c which will not
affect the function of the product.
3.Lead Free or ROHS Directive labelling to be provided as per GS-14-920
for Lead Free version.
E
2.50
NOTES:
10.16
surface
-
tolerance std
ISO 406
ISO 1101
projection
SCALE
12.70
3:1
Dr
rev
E
F
G
ecn no
I08-0023
I08-0081
I09-0169
-
-
-
-
dr
NG
-
-
-
-
date
2008-07-02
-
-
-
-
Eng
Chr
Appr
HVN 2008-05-19
NPM 2009-08-19
www.fciconnect.com
NEBU P.M
NEBU P.M
NEBU PM
SUDHIR V
title
IS0 1302
mm
Scale
4:1
TOLERANCES UNLESS OTHERWISE SPECIFIED
F
dwg no
1. CONTACT WIRE SHOULD NOT TO BE EXPOSED IN THE WELD AREA.
AND WELD FLASH NOT TO EXCEED 0.30 ABOVE -A-
2. ALL WIRES MUST BE CONTAINED IN THE SHELF.
3. OPTIONAL PROJECTION ADDED TO INCREASE OVERALL HEIGHT OF CONNECTOR.
SEE ORDERING INFORMATION.
2008-05-19
2008-05-19
2009-08-19
2009-08-19
ANGULAR
0
2
0.X
0.3
0.15
0.05
size
LINEAR
0.XX
0.XXX
A2
ECN
F
Rev.
I09-0169
Product family
MODJACK Spec ref
VIEW A
-
-
-
-
6 POL HOUSING
TELEJACK
-
C-BMJ-0082
CUSTOMER COPY
sheet
1 of 1
G
catalog no
REV F - 2006-04-17
1
2
3
4
5
6
7
PDM: Rev:G
STATUS:
Released
8
Printed: Aug 21, 2009
.
Microchip MCU
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