Power Supply Support Circuit, Fixed, CMOS, PDSO16, 0.300 INCH, SOIC-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e3 |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.642 mm |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.6745 mm |
| MAX714EWE+ | MAX714EWE-T | MAX714CWE+ | MAX714CWE-T | MAX715CNG-T | MAX715ENG-T | |
|---|---|---|---|---|---|---|
| 描述 | Power Supply Support Circuit, Fixed, CMOS, PDSO16, 0.300 INCH, SOIC-16 | Power Supply Support Circuit, Fixed, CMOS, PDSO16, 0.300 INCH, SOIC-16 | Power Supply Support Circuit, Fixed, CMOS, PDSO16, 0.300 INCH, SOIC-16 | Power Supply Support Circuit, Fixed, CMOS, PDSO16, 0.300 INCH, SOIC-16 | Power Supply Support Circuit, Fixed, CMOS, PDIP24, PLASTIC, DIP-24 | Power Supply Support Circuit, Fixed, CMOS, PDIP24, PLASTIC, DIP-24 |
| 是否Rohs认证 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | DIP | DIP |
| 包装说明 | SOP, | SOP, | SOP, | SOP, | DIP, | DIP, |
| 针数 | 16 | 16 | 16 | 16 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T24 | R-PDIP-T24 |
| JESD-609代码 | e3 | e0 | e3 | e0 | e0 | e0 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 24 | 24 |
| 最高工作温度 | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | SOP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | 240 | 260 | 240 | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.642 mm | 2.642 mm | 2.642 mm | 2.642 mm | 4.572 mm | 4.572 mm |
| 表面贴装 | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.6745 mm | 7.6745 mm | 7.6745 mm | 7.6745 mm | 7.62 mm | 7.62 mm |
| 厂商名称 | Maxim(美信半导体) | Maxim(美信半导体) | - | - | Maxim(美信半导体) | Maxim(美信半导体) |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | - | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
