EE PLD, 12ns, CMOS, PQFP208, PLASTIC, QFP-208
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Altera (Intel) |
| 零件包装代码 | QFP |
| 包装说明 | FQFP, |
| 针数 | 208 |
| Reach Compliance Code | compli |
| 其他特性 | LABS INTERCONNECTED BY PIA; 16 LABS; 2 EXTERNAL CLOCKS |
| 最大时钟频率 | 62.5 MHz |
| JESD-30 代码 | S-PQFP-G208 |
| JESD-609代码 | e0 |
| 长度 | 28 mm |
| 湿度敏感等级 | 3 |
| 专用输入次数 | |
| I/O 线路数量 | 160 |
| 端子数量 | 208 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 0 DEDICATED INPUTS, 160 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 12 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.1 mm |
| 最大供电电压 | 5.25 V |
| 最小供电电压 | 4.75 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 28 mm |
| EPM7256EQC208-12 | EPM7256EQI208-20 | EPM7256EQC208-15 | EPM7256EQC208-20 | |
|---|---|---|---|---|
| 描述 | EE PLD, 12ns, CMOS, PQFP208, PLASTIC, QFP-208 | EE PLD, 20ns, CMOS, PQFP208, PLASTIC, QFP-208 | EE PLD, 15ns, CMOS, PQFP208, PLASTIC, QFP-208 | EE PLD, 20ns, CMOS, PQFP208, PLASTIC, QFP-208 |
| 厂商名称 | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| 零件包装代码 | QFP | QFP | QFP | QFP |
| 包装说明 | FQFP, | FQFP, | FQFP, | FQFP, |
| 针数 | 208 | 208 | 208 | 208 |
| Reach Compliance Code | compli | unknown | compliant | compli |
| 其他特性 | LABS INTERCONNECTED BY PIA; 16 LABS; 2 EXTERNAL CLOCKS | LABS INTERCONNECTED BY PIA; 16 LABS; 2 EXTERNAL CLOCKS | LABS INTERCONNECTED BY PIA; 16 LABS; 2 EXTERNAL CLOCKS | LABS INTERCONNECTED BY PIA; 16 LABS; 2 EXTERNAL CLOCKS |
| 最大时钟频率 | 62.5 MHz | 40 MHz | 50 MHz | 40 MHz |
| JESD-30 代码 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 | S-PQFP-G208 |
| JESD-609代码 | e0 | e3 | e0 | e0 |
| 长度 | 28 mm | 28 mm | 28 mm | 28 mm |
| I/O 线路数量 | 160 | 160 | 160 | 160 |
| 端子数量 | 208 | 208 | 208 | 208 |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C |
| 组织 | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O | 0 DEDICATED INPUTS, 160 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FQFP | FQFP | FQFP | FQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 12 ns | 20 ns | 15 ns | 20 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.1 mm | 4.1 mm | 4.1 mm | 4.1 mm |
| 最大供电电压 | 5.25 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.75 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | MATTE TIN | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 28 mm | 28 mm | 28 mm | 28 mm |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 |
| 湿度敏感等级 | 3 | - | 3 | 3 |
| 峰值回流温度（摄氏度） | 245 | - | 245 | 245 |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
