Electrical / Environmental
Surface Mount Common Mode Chokes
Ro
p
H
t
S
losr
n f
om lia
C
‘LF’ M
ode
•
•
•
•
Operating Temperature Range
Ambient Temperature, Maximum
Temperature Rise, Maximum
Dielectric Withstanding Voltage
-40°C to +125°C
85°C
40°C
300Vdc
Schematic
Specifications
Common Mode Inductance
@100 kHz - 0.1 V
(1-4 or 2-3)
Inductance Leakage
@100 kHz - 0.1 Vrms
(1-4)
(1)
Typ.
Rated
Current
mA
1000
500
500
500
500
500
500
400
200
200
DCR
(2)
Max.
m
Ω
7.2
5.8
9.8
7.2
9.4
8.2
9.4
8.2
9.8
403
Part
Number
HM67-B5R0
HM67-B110
HM67-S250
HM67-B510
HM67-S510
HM67-B471
HM67-B102
(3)
HM67-B222
(3)
HM67-B472
(3)
HM67-10510
Notes:
Terminals
1-4, 2-3
1-4, 2-3
1-4, 2-3
1-4, 2-3
1-4, 2-3
1-4, 2-3
1-4, 2-3
1-4, 2-3
1-4, 2-3
1-4, 2-3
µH
µH
5.0 ±30%
11.0 ±30%
25.0 ±30%
51.0 ±30%
51.0 ±30%
470.0 ±30%
1000.0 +50%, -30%
2200.0 +50%, -30%
4700.0 +50%, -30%
51.0 ±30%
0.08
0.10
1.60
1.90
2.80
0.80
0.16
0.16
0.24
2.40
Marking
Code
A
B
C
D
E
F
G
H
I
0510
Figure
1
1
1
1
1
1
1
1
1
2
(1) Leakage inductance is measured with pin 2 & 3 shorted.
(2) DC resistance is measured at 25°C.
(3) Maximum operating temperature is +85°C.
Packaging
Standard:
Embossed Tape & Reel
Reel:
Diameter:
Capacity:
Figure 1 & 2
Figure 1
Figure 2
=
=
=
13” (330.2mm)
400 Units
2000 Units
Ordering Information
Model Series
HM67
B
110
LF
TR13
Winding Type:
B = Bifilar
S /10= Sector
TR13 = Tape & 13” Reel
(Standard)
No code used for tubes
Inductance Code:
First 2 digits are significant.
Last digit denotes the number of trailing zeros.
For values below 10µH, “R” denotes the decimal point.
Lead-Free Option
LF = Lead-Free
(No code used for non lead-free part)
2006 EDITION MAGNETIC COMPONENTS SELECTOR GUIDE
www.bitechnologies.com
We reserve the right to change specifications without prior notice
33
(Inch / mm)
Outline Dimensions (Inch/mm)
Figure 1
Side View
.024
0.60 Typ.
.155
3.9 Max.
Figure 2
Bottom View
.138
3.50 Max.
.004/0.10MAX
Seating Plane
.197
5.00 Max.
Top View
.37
Max.
9.4
Top View
Marking Location
Side View
1
4
.10±.004
2.5±0.1
.236 Max.
6.0
2
.140 Max.
3.55
3
.138
3.5
Max.
Marking
(Refer to Specifications Table)
Recommended Solder Pad Layout
Recommended Solder Pad Layout
.098
2.5
.047
1.2
.177
4.5
.40
10.2
.067
1.7
.087
2.2
.232
5.9
.090
2.3
34
MAGNETIC COMPONENTS SELECTOR GUIDE 2006 EDITION
We reserve the right to change specifications without prior notice.
www.bitechnologies.com
Electrical Characteristies @ 25°C
(A) Attenuation vs. Frequency Graphs
HM67-B5R0
HM67-S250
HM67-B110
HM67-B510
HM67-B110
2006 EDITION MAGNETIC COMPONENTS SELECTOR GUIDE
www.bitechnologies.com
We reserve the right to change specifications without prior notice
35
Electrical Characteristies @ 25°C (Cont’d)
HM67-S510
HM67-B102
HM67-B471
HM67-B222
HM67-B222
HM67-B472
36
MAGNETIC COMPONENTS SELECTOR GUIDE 2006 EDITION
We reserve the right to change specifications without prior notice.
www.bitechnologies.com
Electrical Characteristies @ 25°C (Cont’d)
(B) Insertion Loss vs. Frequency Graph
HM67-10510
Common Mode
Insertion Loss (dB)
Common Mode
Differential Mode
Differential Mode
Frequency (MH
z
)
(C) Current Derating Curve
HM67-10510
I
o/p
/
I
Rated
Ambient Temperature (
0
C)
2006 EDITION MAGNETIC COMPONENTS SELECTOR GUIDE
www.bitechnologies.com
We reserve the right to change specifications without prior notice
37
FPGA/CPLD
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