4N55*, 5962-87679, HCPL-553X, HCPL-653X,
HCPL-257K, HCPL-655X, 5962-90854, HCPL-550X
Hermetically Sealed, Transistor Output Optocouplers
for Analog and Digital Applications
Data Sheet
*See matrix for available extensions.
Description
These units are single, dual and quad channel, hermetically
sealed optocouplers. The products are capable of operation
and storage over the full military temperature range and
can be purchased as either standard product or with full
MIL-PRF-38534 Class Level H or K testing or from the ap-
propriate DLA Drawing. All devices are manufactured and
tested on a MIL-PRF-38534 certified line and are included
in the DLA Qualified Manufacturers List QML-38534 for
Hybrid Microcircuits.
Features
Dual Marked with Device Part Number and DLA
Drawing Number
Manufactured and Tested on a MIL-PRF-38534 Certified
Line
QML-38534, Class H and K
Five Hermetically Sealed Package Configurations
Performance Guaranteed over Full Military
Temperature Range: -55°C to +125°C
High Speed: Typically 400 kBit/s
9 MHz Bandwidth
Open Collector Output
2-18 Volt V
CC
Range
1500 Vdc Withstand Test Voltage
High Radiation Immunity
6N135, 6N136, HCPL-2530/2531,
Function Compatibility
Reliability Data
Applications
Military and Space
High Reliability Systems
Vehicle Command, Control, Life Critical Systems
Line Receivers
Switching Power Supply
Voltage Level Shifting
Analog Signal Ground Isolation
(see Figures 7, 8, and 13)
Isolated Input Line Receiver
Isolated Output Line Driver
Logic Ground Isolation
Harsh Industrial Environments
Isolation for Test Equipment Systems
The connection of a 0.1 μF bypass capacitor between V
CC
and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Each channel contains a GaAsP light emitting diode which
is optically coupled to an integrated photon detector.
Separate connections for the photodiodes and output
transistor collectors improve the speed up to a hundred
times that of a conventional phototransistor optocoupler
by reducing the base-collector capacitance.
These devices are suitable for wide bandwidth analog
applications, as well as for interfacing TTL to LSTTL or
CMOS. Current Transfer Ratio (CTR) is 9% minimum at I
F
= 16 mA. The 18 V V
CC
capability will enable the designer
to interface any TTL family to CMOS. The availability of
the base lead allows optimized gain/ bandwidth adjust-
ment in analog applications. The shallow depth of the
IC photodiode provides better radiation immunity than
conventional phototransistor couplers.
These products are also available with the transistor base
node not connected to improve common mode noise
immunity and ESD susceptibility. In addition, higher CTR
minimums are available by special request.
Package styles for these parts are 8 and 16 pin DIP through
hole (case outlines P and E respectively), 16 pin DIP flat
pack (case outline F), and leadless ceramic chip carrier
(case outline 2). Devices may be purchased with a variety
of lead bend and plating options, see Selection Guide Table
for details. Standard Microcircuit Drawing (SMD) parts are
available for each package and lead style.
Because the same functional die (emitters and detectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operating conditions, electrical specifications, and perfor-
mance characteristics shown in the figures are identical
for all parts. Occasional exceptions exist due to package
variations and limitations and are as noted. Additionally,
the same package assembly processes and materials are
used in all devices. These similarities give justification for
the use of data obtained from one part to represent other
part’s performance for die related reliability and certain
limited radiation test results.
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
Output
L
H
Functional Diagram
Multiple Channel Devices Available
V
CC
V
B
V
O
GND
2
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
16 Pin DIP
Through Hole
2
8 Pin DIP
Through Hole
1
8 Pin DIP
Through Hole
2
16 Pin Flat Pack
4
20 Pad LCCC
2
Unformed Leads Surface Mount
None
4N55
(1)
4N55/883B
HCPL-257K
Gold Plate
Option 200
None
HCPL-5500
HCPL-5501
HCPL-550K
Gold Plate
Option 200
V
CC
GND
HCPL-5530
HCPL-5531
HCPL-553K
Gold Plate
Option 200
V
CC
GND
HCPL-6550
HCPL-6551
HCPL-655K
Gold Plate
None
HCPL-6530
HCPL-6531
HCPL-653K
Solder Pads *
Avago Part No. and Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
Solder Dipped *
Butt Joint/Gold Plate
Gull Wing/Soldered*
Class H SMD Part #
Prescript for all below
Gold Plate
Solder Dipped*
Butt Joint/Gold Plate
Butt Joint/Soldered*
Gull Wing/Soldered*
Option 100
Option 300
5962-
8767901EC
8767901EA
8767901UC
8767901UA
8767901TA
Option 100
Option 300
5962-
9085401HPC
9085401HPA
9085401HYC
9085401HYA
9085401HXA
Option 100
Option 300
5962-
8767902PC
8767902PA
8767902YC
8767902YA
5962-
8767904FC
87679032A
5962-
8767902XA
5962-
8767906KPC
8767906KPA
8767906KYC
8767906KYA
5962-
8767908KFC
8767907K2A
5962-
Class K SMD Part #
Prescript for all below
Gold Plate
Solder Dipped *
Butt Joint/Gold Plate
Butt Joint/Soldered*
Gull Wing/Soldered*
1. JEDEC registered part.
* Solder contains lead
5962-
8767905KEC
8767905KEA
8767905KUC
8767905KUA
5962-
9085401KPC
9085401KPA
9085401KYC
9085401KYA
8767905KTA
9085401KXA
8767906KXA
3
8 Pin Ceramic DIP Single Channel Schematic
2
ANODE
+
V
F
CATHODE
-
3
5
GND
I
F
I
CC
I
B
I
O
8
V
CC
7
V
B
6
V
O
Note, base is pin 7.
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
V
B1
V
CC1
V
O1
GND
16
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
16
20 Pad LCCC
Surface Mount
2 Channels
15 14
V
CC2
19
20
V
B2
V
O2
GND
2
V
O1
GND
1
V
CC1
V
B1
7
8
13
12
1
2
3
15
V
CC
V
B
V
OUT
8
1
V
CC
V
O1
V
O2
8
2
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
2
14
7
6
2
3
7
3
3
4
13
6
4
13
2
3
10
9
4
5
V
B2
V
CC2
GND
V
O2
12
GND
5
4
GND
5
5
12
6
7
11
10
6
7
11
10
8
9
8
9
Note: 8 pin DIP and flat pack devices have common V
CC
and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated
channels with separate V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
8.13 (0.320)
MAX.
4.45 (0.175)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4
Leaded Device Marking
Avago DESIGNATOR
Avago P/N
DLA SMD*
DLA SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE*
Leadless Device Marking
Avago DESIGNATOR
Avago P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX 50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD*
DLA SMD*
Avago CAGE CODE*
Outline Drawings
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.85 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.02 (0.355)
8.76 (0.345)
0.31 (0.012)
0.23 (0.009)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
1.78 (0.070)
2.03 (0.080)
0.20 (0.008)
0.33 (0.013)
1.52 (0.060)
2.03 (0.080)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
5
嵌入式系统
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
