1 Func, 4MHz, Hybrid, MODULE-8/5
| 参数名称 | 属性值 |
| 厂商名称 | Engineered Components Co |
| 零件包装代码 | DMA |
| 包装说明 | SOL, |
| 针数 | 5 |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | SQUARE |
| JESD-30 代码 | R-XDMA-L5 |
| 功能数量 | 1 |
| 端子数量 | 5 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 最大输出频率 | 4 GHz |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | SOL |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | HYBRID |
| 温度等级 | COMMERCIAL |
| 端子形式 | L BEND |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 9.525 mm |
| SSFGSWG-TTL-4T | SSFGSWG-TTL-4.5T | SSFGSWG-TTL-50T | SSFGSWG-TTL-5.5T | SSFGSWG-TTL-60T | SSFGSWG-TTL-2.5T | SSFGSWG-TTL-3.5T | SSFGSWG-TTL-35T | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 1 Func, 4MHz, Hybrid, MODULE-8/5 | 1 Func, 4.5MHz, Hybrid, MODULE-8/5 | 1 Func, 50MHz, Hybrid, MODULE-8/5 | 1 Func, 5.5MHz, Hybrid, MODULE-8/5 | 1 Func, 60MHz, Hybrid, MODULE-8/5 | 1 Func, 2.5MHz, Hybrid, MODULE-8/5 | 1 Func, 3.5MHz, Hybrid, MODULE-8/5 | 1 Func, 35MHz, Hybrid, MODULE-8/5 |
| 零件包装代码 | DMA | DMA | DMA | DMA | DMA | DMA | DMA | DMA |
| 包装说明 | SOL, | SOL, | SOL, | SOL, | SOL, | SOL, | SOL, | SOL, |
| 针数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| JESD-30 代码 | R-XDMA-L5 | R-XDMA-L5 | R-XDMA-L5 | R-XDMA-L5 | R-XDMA-L5 | R-XDMA-L5 | R-XDMA-L5 | R-XDMA-L5 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 最大输出频率 | 4 GHz | 4.5 GHz | 50 GHz | 5.5 GHz | 60 GHz | 2.5 GHz | 3.5 GHz | 35 GHz |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | SOL | SOL | SOL | SOL | SOL | SOL | SOL | SOL |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | L BEND | L BEND | L BEND | L BEND | L BEND | L BEND | L BEND | L BEND |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 9.525 mm | 9.525 mm | 9.525 mm | 9.525 mm | 9.525 mm | 9.525 mm | 9.525 mm | 9.525 mm |
| 厂商名称 | Engineered Components Co | Engineered Components Co | - | - | Engineered Components Co | Engineered Components Co | Engineered Components Co | Engineered Components Co |
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