Analog Circuit, BIPolar, CDFP16,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Linfinity Microelectronics |
Reach Compliance Code | unknow |
模拟集成电路 - 其他类型 | ANALOG CIRCUIT |
JESD-30 代码 | R-XDFP-F16 |
JESD-609代码 | e0 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC |
封装代码 | DFP |
封装等效代码 | FL16,.3 |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
认证状态 | Not Qualified |
表面贴装 | YES |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
SG5524F | SG5524J/883C | SG5524J/883B | SG5524J | SG5524F/883B | |
---|---|---|---|---|---|
描述 | Analog Circuit, BIPolar, CDFP16, | Analog Circuit, BIPolar, CDIP16, | Analog Circuit, BIPolar, CDIP16, | Analog Circuit, BIPolar, CDIP16, | Analog Circuit, BIPolar, CDFP16, |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics | Linfinity Microelectronics |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknow |
模拟集成电路 - 其他类型 | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT | ANALOG CIRCUIT |
JESD-30 代码 | R-XDFP-F16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDFP-F16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DFP | DIP | DIP | DIP | DFP |
封装等效代码 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | YES | NO | NO | NO | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
筛选级别 | - | MIL-STD-883 Class C | 38535Q/M;38534H;883B | - | 38535Q/M;38534H;883B |
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