Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16,
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | RCA |
包装说明 | SOP, SOP16,.25 |
Reach Compliance Code | unknow |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
JESD-30 代码 | R-PDSO-G16 |
JESD-609代码 | e0 |
信道数量 | 8 |
功能数量 | 1 |
端子数量 | 16 |
最大通态电阻 (Ron) | 225 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOP |
封装等效代码 | SOP16,.25 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
电源 | 5,GND/-5 V |
认证状态 | Not Qualified |
最大信号电流 | 0.025 A |
最大供电电流 (Isup) | 0.16 mA |
表面贴装 | YES |
最长接通时间 | 55 ns |
切换 | BREAK-BEFORE-MAKE |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 1.27 mm |
端子位置 | DUAL |
CD74HCT4051M | CD74HC4051H | CD54HC4051H | CD54HC4051F/3A | CD74HC4051M96 | |
---|---|---|---|---|---|
描述 | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, CDIP16, | Single-Ended Multiplexer, 1 Func, 8 Channel, CMOS, PDSO16, |
包装说明 | SOP, SOP16,.25 | , DIE OR CHIP | , DIE OR CHIP | DIP, DIP16,.3 | SOP, SOP16,.25 |
Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
信道数量 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
最大通态电阻 (Ron) | 225 Ω | 225 Ω | 270 Ω | 270 Ω | 225 Ω |
最高工作温度 | 85 °C | 85 °C | 125 °C | 125 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -55 °C | -55 °C | -40 °C |
封装等效代码 | SOP16,.25 | DIE OR CHIP | DIE OR CHIP | DIP16,.3 | SOP16,.25 |
电源 | 5,GND/-5 V | 2/6,GND/-6 V | 2/6,GND/-6 V | 2/6,GND/-6 V | 2/6,GND/-6 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大信号电流 | 0.025 A | 0.025 A | 0.025 A | 0.025 A | 0.025 A |
最长接通时间 | 55 ns | 225 ns | 45 ns | 45 ns | 45 ns |
切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY | INDUSTRIAL |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 |
厂商名称 | RCA | - | - | RCA | RCA |
JESD-30 代码 | R-PDSO-G16 | - | - | R-XDIP-T16 | R-PDSO-G16 |
JESD-609代码 | e0 | - | - | e0 | e0 |
端子数量 | 16 | - | - | 16 | 16 |
封装主体材料 | PLASTIC/EPOXY | - | - | CERAMIC | PLASTIC/EPOXY |
封装代码 | SOP | - | - | DIP | SOP |
封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | - | - | IN-LINE | SMALL OUTLINE |
最大供电电流 (Isup) | 0.16 mA | 0.32 mA | 0.32 mA | - | - |
表面贴装 | YES | - | - | NO | YES |
端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | - | - | THROUGH-HOLE | GULL WING |
端子节距 | 1.27 mm | - | - | 2.54 mm | 1.27 mm |
端子位置 | DUAL | - | - | DUAL | DUAL |
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