Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Data Delay Devices |
| 零件包装代码 | SOIC |
| 包装说明 | SMT-14 |
| 针数 | 14 |
| Reach Compliance Code | compli |
| 其他特性 | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. |
| 系列 | HC/UH |
| JESD-30 代码 | R-XDSO-G14 |
| 长度 | 19.812 mm |
| 逻辑集成电路类型 | ACTIVE DELAY LINE |
| 功能数量 | 1 |
| 抽头/阶步数 | 5 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 可编程延迟线 | NO |
| 认证状态 | Not Qualified |
| 座面最大高度 | 7.112 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | GULL WING |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 总延迟标称(td) | 250 ns |

| SMD-99C-5250MC2 | SMD-99C-5050MC2 | SMD-99C-5150MC2 | SMD-99C-5175MC2 | SMD-99C-5125MC2 | SMD-99C-5100MC2 | SMD-99C-5060MC2 | SMD-99C-5075MC2 | SMD-99C-5200MC2 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 | Active Delay Line, 1-Func, 5-Tap, True Output, CMOS, SMT-14 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices | Data Delay Devices |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SMT-14 | SOP, | SMT-14 | SMT-14 | SMT-14 | SOP, | SMT-14 | SMT-14 | SMT-14 |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant | compli | compli |
| 其他特性 | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. | MEETS MIL-D-23859; TEMP. COEFF. SPECIFIED OVER 0 TO 70 DEG. CEL. |
| 系列 | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH | HC/UH |
| JESD-30 代码 | R-XDSO-G14 | R-XDSO-G14 | R-XDSO-G14 | R-XDSO-G14 | R-XDSO-G14 | R-XDSO-G14 | R-XDSO-G14 | R-XDSO-G14 | R-XDSO-G14 |
| 长度 | 19.812 mm | 19.812 mm | 19.812 mm | 19.812 mm | 19.812 mm | 19.812 mm | 19.812 mm | 19.812 mm | 19.812 mm |
| 逻辑集成电路类型 | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE | ACTIVE DELAY LINE |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 抽头/阶步数 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 可编程延迟线 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 7.112 mm | 7.112 mm | 7.112 mm | 7.112 mm | 7.112 mm | 7.112 mm | 7.112 mm | 7.112 mm | 7.112 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 总延迟标称(td) | 250 ns | 50 ns | 150 ns | 175 ns | 125 ns | 100 ns | 60 ns | 75 ns | 200 ns |
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