2 pounds applied force, Method 211, MIL-STD-202, Test condition A
Method 301, MIL-STD-202
In accordance with MIL-PRF-21038
At 250 Vdc using method 302, test condition B, MIL-STD-202
Tested using FIGURE 3 with resulting FIGURE 1 waveform.
Tested using FIGURE 3 with resulting FIGURE 1 waveform.
Tested using FIGURE 3 with resulting FIGURE 1 waveform.
See Respective ELECTRICAL CHARACTERISTICS TABLE
Tested using FIGURE 2.
Tested using FIGURE 3 with resulting FIGURE 1 waveform.
See respective ELECTRICAL CHARACTERISTICS TABLE
See respective ELECTRICAL CHARACTERISTICS TABLE
oz (gm)
lbs
Vrms
Hrs
M Ohm
µs
V
ns
db
°C
%
Ohm
Ohm
0.175 (5) max
2
100
10,000 min
1,000 min
2
<1
45 min
-55 to +130
20 max
CONFIGURATION A
1
2
3
4
5
6
7
8
3
2
1
0.625 MAX
(15.88)
TOP VIEW
8
7
6
5
4
0.625
MAX
(15.88)
CIRCUIT DIAGRAM FOR
DASH NUMBERS -01,
-02, -03, -10 AND -26
1
2
3
5
4
6
8
7
(See
Table) A
CIRCUIT DIAGRAM FOR
DASH NUMBER -04
0.375
MIN
(9.53)
0.500
(12.70)
0.100 4PL
(2.54)
AWG
#24
0.200
4PL
(5.08)
Notes:
(1) Dimensions are in inches (mm).
(2) Unless otherwise specified, tolerance is ±0.010 inches (0.25mm)
BETA
P/N
B-2202
B-2203
B-2204
B-2205
B-2385
B-3226
DESC P/N
M-21038/27-01
M-21038/27-02
M-21038/27-03
M-21038/27-04
M-21038/27-10
M-21038/27-26
TURNS
RATIO
TABLE 2. ELECTRICAL CHARACTERISTICS - CONFIGURATION A
OUTPUT RISETIME
DC RESISTANCE
“A”
PRIMARY SECONDARY
(MAX)
Ω
(MAX)
(max)
1-3
1-3
1-3
1-3
1-3
1-3
1-3
1-3
4-8
5-7
1-3
1-3
4-8
5-7
4-8
5-7
4-8
5-7
4-8
5-7
1-3
1-3
4-8
5-7
0.300
0.250
0.250
0.300
0.250
0.250
1-3 3.0
4-8 3.0
1-3 3.5
4-8 3.0
1-3 3.2
4-8 3.0
1-3
4-8
1-3
4-8
1-3
4-8
1.2
3.0
1.0
3.0
1.0
3.5
150 ns
150 ns
150 ns
150 ns
200 ns
250 ns
IMPEDANCE
Ω
(MIN)
(1-3)
4,000
(1-3)
7,200
(1-3)
4,000
(5-7)
3,000
(4-8)
4,000
(4-8)
4,000
1:1 ±3%
1:0.707 ±3%
1.4:1 ±3%
2:1 ±3%
1.25:1 ±3%
1.66:1 ±3%
2.3:1 ±3%
3.2:1 ±3%
2.12:1 ±3%
1.5:1 ±3%
1:2.5 ±3%
1:1.79 ±3%
Note:
Wave soldering method shall preheat leads to a temperature of 100° C minimum and 140° C maximum at a rate of 2° C per second. Solder wave temperature to be 245° C
nominal, 265° C maximum, with a nominal dwell time of 3 seconds and a maximum dwell time of 5 seconds.
(2) Unless otherwise specified, tolerance is ±0.010 inches (0.25mm)
TABLE 3. ELECTRICAL CHARACTERISTICS - CONFIGURATION B
BETA P/N
B-2207
B-2208
B-2209
B-2210
B-3228
B-3229
B-3230
DESC P/N
M-21038/27-06
M-21038/27-07
M-21038/27-08
M-21038/27-09
M-21038/27-28
M-21038/27-29
M-21038/27-30
TURNS RATIO
1:1 ±3%
1:1.41 ±3%
1:1.66 ±3%
1:2 ±3%
1:1.5 ±3%
1:1.79 ±3%
1:2.5 ±3%
PRIMARY
1-5
1-5
1-5
1-5
1-5
1-5
1-5
SECONDARY
2-6
2-6
2-6
2-6
2-6
2-6
2-6
DC RESISTANCE
Ω
(MAX)
1-5 2.5
2-6 2.8
1-5 2.2
2-6 2.7
1-5 1.5
2-6 2.4
1-5 1.3
2-6 2.6
1-5 0.90
2-6 2.5
1-5 0.90
2-6 2.5
1-5 1.0
2-6 2.8
OUTPUT RISETIME
(MAX)
150 ns
150 ns
150 ns
200 ns
150 ns
150 ns
250 ns
IMPEDANCE
Ω
(MIN)
(1-5)
3,000
(2-6)
3,000
(2-6)
3,000
(2-6)
3,000
(2-6)
3,000
(2-6)
3,000
(2-6)
3,000
Note:
Wave soldering method shall preheat leads to a temperature of 100° C minimum and 140° C maximum at a rate of 2° C per second. Solder wave temperature to be 245° C
nominal, 265° C maximum, with a nominal dwell time of 3 seconds and a maximum dwell time of 5 seconds.
(2) Unless otherwise specified, tolerance is ±0.010 inches (0.25mm)
TABLE 4. ELECTRICAL CHARACTERISTICS - CONFIGURATION C
BETA P/N
B-2206
DESC P/N
M-21038/27-05
TURNS RATIO
1:1.41 ±3%
PRIMARY
1-2
SECONDARY
3-4
DC RESISTANCE
Ω
(MAX)
1-2 2.2
3-4 2.7
OUTPUT RISETIME
(MAX)
150 ns
IMPEDANCE
Ω
(MIN)
(3-4)
3,000
Note:
Wave soldering method shall preheat leads to a temperature of 100° C minimum and 140° C maximum at a rate of 2° C per second. Solder wave temperature to be 245° C
nominal, 265° C maximum, with a nominal dwell time of 3 seconds and a maximum dwell time of 5 seconds.
(2) Unless otherwise specified, tolerance is ±0.010 inches (0.25mm)
TABLE 5. ELECTRICAL CHARACTERISTICS - CONFIGURATION D
BETA P/N
B-2386
B-2387
B-2388
B-2389
B-2390
B-3227
DESC P/N
M-21038/27-11
M-21038/27-12
M-21038/27-13
M-21038/27-14
M-21038/27-15
M-21038/27-27
TURNS RATIO
1:1 ±3%
1:0.707 ±3%
1.4:1 ±3%
2:1 ±3%
1.25:1 ±3%
1.66:1 ±3%
2.3:1 ±3%
3.2:1 ±3%
2.12:1 ±3%
1.5:1 ±3%
1:2.5 ±3%
1:1.79 ±3%
PRIMARY
1-3
1-3
1-3
1-3
1-3
1-3
4-8
5-7
4-8
5-7
1-3
1-3
SECONDARY
4-8
5-7
4-8
5-7
4-8
5-7
1-3
1-3
1-3
1-3
4-8
5-7
DC RESISTANCE
Ω
(MAX)
1-3 3.0
4-8 3.0
1-3 3.5
4-8 3.0
1-3 3.2
4-8 3.0
1-3 1.2
4-8 3.0
1-3 1.0
4-8 3.0
1-3 1.0
4-8 3.5
OUTPUT RISETIME
(MAX)
150 ns
150 ns
150 ns
150 ns
200 ns
250 ns
IMPEDANCE
Ω
(MIN)
(1-3)
4,000
(1-3)
7,200
(1-3)
4,000
(5-7)
3,000
(4-8)
4,000
(4-8)
4,000
Note:
1) These transformers have been classified as Level 5A per IPC-9503 and must be processed accordingly. To ensure product integrity and maintain the product warranty,
these transformers require a 24 hour bake at +125° C prior to any solder reflow processing. Dried transformers must be reflowed within 24 hours. J-STD-033 precondition-
ing (dry-pack) can be provided by Beta upon request. Reflow process must not cause the peak body temperature of the device to exceed 225° C and must not expose the
device to temperatures above 183° C for more than 90 seconds.
2) By providing surface mount parts that have been dried per IPC-9503 (Moisture Sensitivity Classification for Non-IC components) and Dry-Packed in accordance with J-
STD-033 (Standard for handling, packing, shipping and use of Moisture /Reflow sensitive surface mount devices), Beta has significantly reduced the possibility of moisture
sensitivity/reflow induced “Pop-corning” or Bulging during customer’s reflow soldering process. Experiments performed by Beta and data provided by manufacturers of simi-
lar devices indicate that post reflow visual/mechanical anomolies can be reduced by more than 90%. Since customer reflow profiles and CCA Density can vary, Beta recom-
mends that the customer verify solder process compatibility and yield assessment of these devices.