SnapTac Series
Miniature Circular
Connectors for Future
Combat Soldier
•
HyperSpring
®
spring loaded contacts, self cleaning
wiping action
•
7, 13, 19 ways
•
Combine robust environmental performance with
compact size and light weight
•
Easy and fast snap on locking mechanism
•
Full line EMI shielding
•
IP67 sealing when mated and unmated
•
Different hardware coding to avoid mismatching
•
Overmolding solutions
•
Upgrade commercial high speed Fast Ethernet, USB,
IEEE 1394 interconnect to Mil Spec performances
•
High-reliability commercial and military interconnect
applications: Tactical Computers, Field Radios,
Dismounted Soldier, Weapon Interconnect, Battery
Chargers, Missiles, Helmet Breakaway System,
Commercial Airframe Sensors, Autosport, Diagnostics
•
Protection cap available on request
Technical Characteristics
General
HyperSpring Contact Number
Receptacle Contact Termination
Plug Contact Termination
Cable Diameter Range
7,13,19
Solder Cup, Dip Solder
Solder Cup
Max 6 mm (7 ways)
Max 7.5 mm (13 ways)
Max 8.5 mm (19 ways)
28-24
Max 1.5 N
Max 40 N
Max 40 N
Shock
Weight (Plug + Receptacle)
EIA364.27 Condition G
9 g (7 ways)
14 g (13 ways)
16 g (19 ways)
AWG Contact
Hyperspring force (single contact)
Connector Mating Force
Connector Unmating Force
Electrical and mechanical characteristics
EMI Shielding
Current Rating
Test Voltage (dc) Contact to contatct
Materials and Plating
Housing
- Material
- Plating
Overmolding (Plug)
Contact Plating
- Material
- Plating
Environmental Characteristics
Temperature Range
Salt Spray
Humidity
IP Level
Aluminium Alloy
ZnCo conductive - RoHS compliant
Thermoplastic hotmelt
Brass, CuBe
Gold
Yes
3A@25°C
300 V
Dielectric Withstanding Voltage
(between contacts)
500 V
Contact Resistance (low level)
<15 m Ohm
Insulation Resistance
5000 MOhm @ 500V d.c.
(EIA364.21)
Vibration
EIA364.28 Condition III
-65°C +80°C
EIA364.26 Condition A
mated connectors
EIA364.31 Method IV
67 mated and unmated
MAY
2008
1
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