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STPCELITE: 产品描述X86 Core General Purpose PC Compatible System - on - Chip; 文件大小960KB，共87页; 制造商ST(意法半导体); 官网地址http://www.st.com/

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STPCELITE概述

X86 Core General Purpose PC Compatible System - on - Chip

STPCELITE相似产品对比

	STPCELITE	STPCE1HEBI	STPCE1HEBC	STPCE1HDBC	STPCE1HDBI	STPCE1EEBI	STPCE1EDBI	STPCE1EEBC	STPCE1EDBC
描述	X86 Core General Purpose PC Compatible System - on - Chip	X86 Core General Purpose PC Compatible System - on - Chip	X86 Core General Purpose PC Compatible System - on - Chip	X86 Core General Purpose PC Compatible System - on - Chip	X86 Core General Purpose PC Compatible System - on - Chip	X86 Core General Purpose PC Compatible System - on - Chip	X86 Core General Purpose PC Compatible System - on - Chip	X86 Core General Purpose PC Compatible System - on - Chip	X86 Core General Purpose PC Compatible System - on - Chip
是否Rohs认证	-	符合	符合	不符合	不符合	不符合	-	不符合	-
零件包装代码	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	-	BGA,	BGA,	PLASTIC, BGA-388	PLASTIC, BGA-388	PLASTIC, BGA-388	PLASTIC, BGA-388	BGA, BGA388,26X26,50	PLASTIC, BGA-388
针数	-	388	388	388	388	388	388	388	388
Reach Compliance Code	-	compli	compli	_compli	_compli	_compli	compli	_compli	compli
其他特性	-	-40 TO 115 C OPERATING CASE TEMPERATURE	-40 TO 115 C OPERATING CASE TEMPERATURE	-	-40 TO 115 C OPERATING CASE TEMPERATURE	-	-40 TO 115 C OPERATING CASE TEMPERATURE	-	-40 TO 115 C OPERATING CASE TEMPERATURE
地址总线宽度	-	32	32	32	32	32	32	32	32
边界扫描	-	YES	YES	YES	YES	YES	YES	YES	YES
总线兼容性	-	PCI; ISA	PCI; ISA	PCI; ISA	PCI; ISA	PCI; ISA	PCI; ISA	PCI; ISA	PCI; ISA
最大时钟频率	-	14.318 MHz	14.318 MHz	14.318 MHz	14.318 MHz	14.318 MHz	14.318 MHz	14.318 MHz	14.318 MHz
外部数据总线宽度	-	32	32	32	32	32	32	32	32
JESD-30 代码	-	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388	S-PBGA-B388
长度	-	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm
I/O 线路数量	-	16	16	16	16	16	-	16	-
端子数量	-	388	388	388	388	388	388	388	388
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	-	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
封装形状	-	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	-	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	-	2.38 mm	2.38 mm	2.38 mm	2.38 mm	2.38 mm	2.38 mm	2.38 mm	2.38 mm
最大供电电压	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.75 V	2.7 V	2.75 V
最小供电电压	-	2.45 V	2.45 V	2.45 V	2.45 V	2.45 V	2.25 V	2.45 V	2.25 V
标称供电电压	-	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	-	YES	YES	YES	YES	YES	YES	YES	YES
技术	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	-	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	-	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	-	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm	35 mm

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