TA-I
1. Scope :
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
( Lead-Free for CN35 Series)
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TCN-35OS007G
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This specification applies for the CN35 series of thick film chip resistor networks made by TA-I.
2. Construction , Dimensions , Schematic :
2.1 Construction :
Conductor:
(Lead-free or with lead)
Over Coat
Resistive Element
Plating
Ni + Sn
Ceramic Substrate
2.1.1 Chip Resistor Networks :
CN35
2.2 Dimension :
UNIT:mm
Type
CN35
L
3.2
±
0.2
W
1.6
±
0.15
t
0.5
±
0.1
P
0.64
±
0.05
a
0.35
±
0.1
b
0.3
±
0.2
c
0.3
±
0.2
TA-I TECHNOLOGY CO., LTD
TA-I
2.3 Schematic
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
( Lead-Free for CN35 Series)
No
page
TCN-35OS007G
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R102
R TYPE
S102
S TYPE
102
D TYPE
3. Type Designation:
3.1 Chip Resistor Networks
CN
Product Code
35
size
Power Rating
J
Tolerance
TN
Packaging
R
Circuit
103
Nominal
Resistance
35-0603*5
J-±5%
T- Paper Tape
R-10P8R 5.10 com
s-10P8R 1.6 com
D-9P8R
10 com
3 digits ex. :
(E-24)103 = 10KΩ
N :
Lead-free
Note :
TN : Lead-Free products packaged by paper tape
TA-I TECHNOLOGY CO., LTD
TA-I
Power
Rating
at 70℃
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
( Lead-Free for CN35 Series)
No
page
TCN-35OS007G
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4. Ratings & Characteristics :
Type
Rating
Voltage
Max.
Working
Voltage
Max.
Over Load
Voltage
Operating
Temp.
(℃)
Resistance
Tolerance
(%)
Resistance
Range
(Ω)
Temp
Co-efficient
PPM/℃
CN35
1/16W
Refer 4.2
25V
50V
-55
∫
+125℃
±5%
56Ω~1MΩ
±200
4.1 Derating Curve :
For resistors operated at ambient temperature over 70℃ , power rating shall be derated in
accordance with figure 1.
P max.
100
Power ratio ( % )
50
0
-55
50
Figure 1
70
100
125
Ambient
Temp. (
°C
)
4.2 Rated Voltage:
The rated voltage is calculated by the following formula:
E= P * R
E=
Rated Voltage(V)
P=
Rated Power(W)
R=
Resistance Value
(Ω)
E.G. : What is CN35JTNR102 the rated voltage ?
CN35JTNR102 P:1/16W ; R:102 = 1KΩ = 1000Ω
E=
0.0625(W) * 1000(Ω)
=
7.9 (V)
TA-I TECHNOLOGY CO., LTD
TA-I
Test Items
Temperature
Resistance
Coefficient
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
( Lead-Free for CN35 Series)
No
page
TCN-35OS007G
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5. Reliability Tests:(As specified in JIS C 5202)
Reference
standard
of
JIS-C5202-5.2
Condition of Test
-55〜 +125
℃
Test Limits
Refer 4.0
±(2.0%+0.1Ω)
Short Time Overload
JIS-C5202-5.5
2.5 X rated voltage for 5 sec
0Ω : 50 mΩ or less
Intermittent Overload
JIS-C5202-5.8
2.5X rated voltage or Max Overloading Voltage ,
1 sec “ON” 25 sec “OFF” , 10000 cycles
±(5.0%+0.1Ω)
0Ω :
50mΩ or less
Load Life
JIS-C5202-7.10
1000 hours at rated voltage , 70℃ , 1.5hours
“ON “, 0.5hour “OFF”
±(3.0%+0.1Ω)
0Ω :100 mΩ or less
Load Life with Humidity
JIS-C5202-7.9
1000 hours at rated voltage , 40±2℃,
90~95% RH 1.5hours “ON “, 0.5hour “OFF”
±(3.0%+0.1Ω)
0Ω :100 mΩ or less
±(1.0%+0.05Ω)
Rapid Change of Temperature
JIS-C5202-7.4
-55℃ (30 min. ) / +155
℃(30
min. ) 5 cycles
0Ω :50 mΩ or less
Solderability
JIS-C5202-6.11
245±5℃ solder, 2±0.5 sec dwell.
Solder : Sn96.5 / Ag3.0 / Cu0.5
At least 95% of surface area
of electrode shall be covered
with new solder.
Core body
Without mechanical damage
JIS C-5202-6.1.4 Pressure 1.0 kgf a R0.5 pressure rod for 10 sec such as breaks. Electrical
characteristics shall be satisfied
Dielectric
Withstanding
JIS-C5202-5.7
Voltage (Voltage Proof)
Applying voltage 100V for 1 minute.
No abnormalities such as
flashover,
burning
dielectric
breakdown shall appear.
Resistance to Solder Heat
JIS-C5202-6.10
270
±5℃
solder , 10
±1
sec dwell .
±(2.0%+0.1Ω)
0Ω:
50mΩ or less
TA-I TECHNOLOGY CO., LTD
TA-I
Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
( Lead-Free for CN35 Series)
No
page
TCN-35OS007G
5
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10
Component , Lead-Free Soldering part 8 :
Solder Heat Resistance Test for SMD. Lead-
Free Soldering “
Temp. Cycles :
-55℃(30 min.) / +155℃(30 min. )
Testing duration : 500±4 hours
Temp. Humidity Chambers:
Temperature : 85℃
Humidity : 85% RH
Testing duration : 500±4 hours
Whisker
SONY
SS-00254-8
Whisker formation :
50 um or less .
.
Component , Lead-Free Soldering part 5 :
Solder Heat Resistance Test for SMD. Lead-
Free Soldering “
Flow Solder :
Pre – heat : 100 to 105
℃
30±5 sec
Temperature : 260±3℃ 10 +1/ -0 sec
The entire sample shall be dipped in solder.
The specimen shall be stored at standard
atmospheric conditions for 1 hour .
Iron Solder :
Bit temperature : 350
±10℃
Application time of soldering iron : 3 +1/- 0sec
Apply the soldering iron to the electrode .
The specimen shall be stored at standard
atmospheric conditions for 1 hour , after
which the measurements shall be made
Resistance to Solder Heat
SONY
SS-00254-5
Electrical characteristics shall be
Satisfied .
Without distinct deformation in
appearance
Note* : RCWV : Rated continuous working voltage
.
6.Marking
6.1
±5%(E24)
Resistance value is expressed by 3 digits, the first two digits represent the
significant figures of nominal resistance value inΩ, and the third digit
represents exponent for base of 10.
E.G.
6.2
472 = 47×10
2
= 4700Ω = 4.7KΩ
±1%
(E96 )
Resistance value is expressed by 3 digits, the first three digits represent the
significant figures of nominal resistance value inΩ, and the fourth digit
represents exponent for base of 10.
E.G.
4701 = 470×10
1
= 4700Ω = 4.7kΩ
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