Data Sheet
March 2008
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Features
RoHS Compliant
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Compatible with RoHS EU Directive 200295/EC
Compatible in Pb- free or SnPb reflow environment
Small size: 51 mm x 28 mm x 12 mm
(2.0 in. x 1.1 in. x 0.46 in.)
Optimized for use with high-frequency dc-to-dc
power modules
Printed-circuit board mountable
Operating case temperature range:
–40 °C to +100 °C
UL*
60950 Recognized,
CSA
†
C22.2 No. 60950-00
Certified; VDE 0805 (IEC60950) Licensed
CE mark meets 73/23/EEC and 93/68/EEC
directives
‡
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The FLTR100V10 Filter Module is encapsulated in a small,
nonconductive plastic case.
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Application
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Common-mode and differential-mode filtering of
power supply dc input and output lines
Computer applications
Communications equipment
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Options
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Short pin: 2.8 mm (o.110 in.)
Short pin: 3.7 mm (0.145 in.)
Short pin: 4.6 mm (0.180 in.)
Description
The FLTR100V10 Filter Module is designed to reduce the conducted common-mode and differential-mode
noise on input or output lines of high-frequency switching power supplies. The module has a maximum current
rating of 10 A. It provides high insertion loss throughout the frequency range regulated by the U.S. Federal
Communications Commission (FCC) and the International Special Committee on Radio Interference (CISPR)
for conducted emissions.
The module is 51 mm long, 28 mm wide, and 12 mm high (2.0 in. x 1.1 in. x 0.46 in.) and mounts on a PC board
in a natural convection or forced-air environment.
*
UL
is a registered trademark of Underwriters Laboratories, Inc.
†
CSA
is a registered trademark of Canadian Standards Assn.
‡ This product is intended for integration into end-use equipment. All the required procedures for CE marking of end-use equipment should
be followed. (The CE mark is placed on selected products.)
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Data Sheet
March 2008
Introduction
High-density power modules are usually designed to operate at a high switching frequency to reduce the size of
the internal filter components. The small EMI filters internal to the modules are often inadequate to meet stringent
international EMI requirements. Many high-density electronic packaging techniques can increase the noise con-
ducted onto the modules’ input and output lines. For example, the close proximity of switching components to the
input pins increases internal noise coupling; and planar transformers, designed to handle high-power levels in low-
profile packages, have high interwinding capacitance that can increase common-mode current levels. Also, metal
substrates used to facilitate heat transfer from the power train components to an external heat sink add to com-
mon-mode noise because of the large capacitance between switching components and the metal substrate.
Many international agencies specify conducted and radiated emissions limits for electronic products. Included
among these are CISPR, FCC, VCCI, and the new CE specifications. Most agency-conducted noise limits apply
only to noise currents induced onto the ac power lines in finished products. European Telecommunication Standard
Instructions (ETSI) are an exception, applying CE requirements to dc supplies with cables over three meters long.
Although not required to do so by agency standards, some system designers apply the conducted emissions
requirements to subassemblies within the product to reduce internal interference between subsystems and to
reduce the difficulty of meeting overall system requirements.
To meet these requirements, external filtering of the power module is often required. When used in conjunction with
the recommended external components and layout, the
Lineage Power
filter module will significantly reduce the
conducted differential and common-mode noise returned to the power source. CISPR and FCC class B require-
ments can be met by using the filter as described in the following sections.
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
Parameter
Input Voltage:
Continuous
Transient (100 ms)
Voltage from GND to Either Input Lead (1 minute)
Operating Case Temperature
Storage Temperature*
Symbol
V
I
V
I, trans
—
T
C
T
stg
Min
—
—
—
–40
–55
Max
75
100
1500
100
125
Unit
Vdc
V
Vdc
°C
°C
* For the processing, handling and storage (module not powered), the filter module can handle -55°C to 125°C exposure.
2
Lineage Power
Data Sheet
March 2008
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage and temperature conditions.
Parameter
Resistance per Leg
Maximum Average Current
(T
A
= 60 °C, 2.03 m/s (400 lfm) air)
Maximum Average Current
(T
A
= 60 °C, natural convection)
Common-mode Insertion Loss
(50
Ω
circuit, 500 kHz)
Differential-mode Insertion Loss
(50
Ω
circuit, 500 kHz)
Symbol
R
I
max
I
max
—
—
Min
—
—
—
—
—
Typ
—
—
—
36
44
Max
14
10
6.5
—
—
Unit
mΩ
A
A
dB
dB
Characteristics
0
COMMON-MODE INSERTION LOSS (dB)
12
10
8
6
4
2
0
20
400 LFM
-20
-40
-60
NC
200 LFM
-80
30
40
50
60
70
80
90
-100
0.1
1.0
FREQUENCY (MHz)
10
8-1326b
Figure 1. Derating output current vs. Local
ambient temperature and Airflow (Vin =
48Vdc)
Figure 2. Typical Common-Mode Insertion Loss in
a 50
Ω
Circuit
Lineage Power
3
Data Sheet
March 2008
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Table 2:
amb
temp
20
30
40
50
60
70
80
Failure Rate in FITs:
10A
24.248
38.244
58.588
87.415
127.327
181.441
253.416
8
11.679
18.925
29.736
45.433
67.671
98.481
140.302
6A
6.89
11.388
18.227
28.336
42.899
63.394
91.632
Characteristics
(continued)
DIFFERENTIAL-MODE INSERTION LOSS (dB)
0
-20
-40
-60
-80
Internal Schematics
1.0
FREQUENCY (MHz)
8-1327b
-100
0.1
10
Figure 3. Typical Differential-Mode Insertion Loss
in a 50
Ω
Circuit
IN
OUT
GND
8-1324b
MTBF (T)
1•108
I
I
= 6 A
I
I
= 8 A
I
I
= 10 A
Figure 5. Internal Schematic
5•107
20
30
40
50
60
70
AMBIENT TEMPERATURE (˚C)
80
1-0324
Figure 4. MTBF vs Ambient temperature for 6A, 8A,
and 10A Input Current
Table 1:
amp
temp
20
30
40
50
60
70
80
4
MTBF in Hours:
10A
4.124•10
7
2.615•10
7
1.707•10
7
1.144•10
7
7.854•10
6
5.511•10
6
3.946•10
6
8A
8.563•10
7
5.284•10
7
3.363•10
7
2.201•10
7
1.478•10
7
1.015•10
7
7.127•10
6
6A
1.451•10
8
8.781•10
7
5.486•10
7
3.529•10
7
2.331•10
7
1.577•10
7
1.091•10
7
Lineage Power
FLTR100V10 Filter Module
75 Vdc Input Maximum, 10 A Maximum
Data Sheet
March 2008
The GND pin of the filter module is attached to Y caps
within the module. This pin should be tied to a quiet
chassis ground point away from the power modules.
GND of the filter module should not be tied to the
CASE pin of the power module since this is a noisy
node and will inject noise into the filter, increasing the
input common-mode noise.
If no quiet grounding point is available, it is best to
leave the filter module GND pin unattached. Each
power system design will be different, and some exper-
imentation may be necessary to arrive at the best con-
figuration.
Figure 6 shows a typical schematic of a power module
with filter module and recommended external compo-
nents. Figure 7 is a proposed layout. More than one
power module may be attached to a single filter module
as long as input current does not exceed 10 A. Figure 8
shows the recommended schematic for two power
modules attached to a single filter.
In applications where the addition of input to output
capacitors is undesirable, do not use C3 and C4 shown
in Figures 6 and 7, and do not use C3, C4, C8, and C9
shown in Figure 8.
In –48 V applications where the shield plane and the
power module case must be tied to a signal, remove
C1 in Figures 6 and 7, remove C1 and C6 in Figure 8,
and connect the shield plane and CASE pin to the V
I
(+)
plane.
In +48 V applications where the shield plane and the
power module case must be tied to a signal, remove
C2 in Figures 6 and 7, remove C2 and C7 in Figure 8,
and connect the shield plane and CASE pin to the V
I
(–)
plane.
Application
Conducted noise on the input power lines can occur as
either differential-mode or common-mode noise cur-
rents. Differential-mode noise is measured between the
two input lines, and is found mostly at the low-
frequency end of the spectrum. This noise shows up as
noise at the fundamental switching frequency and its
harmonics. Common-mode noise is measured
between the input lines and ground and is mostly
broadband noise above 10 MHz. The high-frequency
nature of common-mode noise is mostly due to the
high-speed switching transitions of power train compo-
nents. Either or both types of noise may be covered in
a specification, as well as a combination of the two. An
approved measurement technique is often described,
as well.
Differential-mode noise is best attenuated using a filter
composed of line-to-line capacitors (X caps) and series
inductance, provided by either a discrete inductor or
the leakage inductance of a common-mode choke. In
addition to the differential filtering provided by the filter
module, it is recommended that an electrolytic capaci-
tor be located at the converter side of the filter to pro-
vide additional attenuation of low-frequency differential
noise and to provide a low source impedance for the
converter, preventing input filter oscillations and load-
transient induced input voltage dips.
Common-mode noise is best attenuated by capacitors
from power module input to power module output,
capacitors from each input line to a shield plane
(Y caps), and common-mode chokes. It is recom-
mended that ceramic capacitors be added around each
power module from each input and output pin to a
shield plane under the module. The shield plane should
be connected to the CASE pin.
5
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