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TS68C000MC1B/C12A

产品描述Microprocessor, 32-Bit, 12.5MHz, HCMOS, CDIP64, TIN DIPPED, SIDE BRAZED, CERAMIC, DIP-64
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小668KB,共52页
制造商e2v technologies
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TS68C000MC1B/C12A概述

Microprocessor, 32-Bit, 12.5MHz, HCMOS, CDIP64, TIN DIPPED, SIDE BRAZED, CERAMIC, DIP-64

TS68C000MC1B/C12A规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称e2v technologies
零件包装代码DIP
包装说明DIP, DIP64,.9
针数64
Reach Compliance Codeunknow
ECCN代码3A001.A.2.C
地址总线宽度24
位大小32
边界扫描NO
最大时钟频率12.5 MHz
外部数据总线宽度16
格式FIXED POINT
集成缓存NO
JESD-30 代码R-CDIP-T64
长度81.28 mm
低功率模式NO
端子数量64
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装等效代码DIP64,.9
封装形状RECTANGULAR
封装形式IN-LINE
电源5 V
认证状态Not Qualified
筛选级别MIL-STD-883 Class B
座面最大高度4.83 mm
速度12.5 MHz
最大压摆率50 mA
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装NO
技术HCMOS
温度等级MILITARY
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度22.86 mm
uPs/uCs/外围集成电路类型MICROPROCESSOR

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Features
16-/32-bit Data and Address Register
16-Mbyte Direct Addressing Range
56 Powerful Instruction Types
Operations on Five Main Data Types
Memory Mapped Input/Output
14 Addressing Modes
Three Available Versions: 8 MHz/10 MHz and 12.5 MHz
Military Temperature Range: -55/+125°C
Power Supply: 5V
DC
± 10%
Description
The TS68C000 reduced power consumption device dissipates an order of magnitude
less power than the HMOS TS68000. The TS68C000 is an implementation of the
TS68000 16/32 microprocessor architecture. The TS68C000 has a 16-bit data bus
and 24-bit address bus while the full architecture provides for 32-bit address and data-
buses. It is completely code-compatible with the HMOS TS68000, TS68008 8-bit data
bus implementation of the TS68000 and the TS68020 32-bit implementation of the
architecture. Any user-mode programs written using the TS68C000 instruction set will
run unchanged on the TS68000, TS68008 and TS68020. This is possible because the
user programming model is identical for all processors and the instruction sets are
proper sub-sets of the complete architecture.
Low Power
HCMOS
16-/32-bit
Hi-Rel
Microprocessor
TS68C000
Screening/Quality
This product is manufactured in full compliance with:
MIL-STD-883 class B
DESC drawing 5962-89462
Atmel standards
C Suffix
DIL 64
Ceramic Package
F Suffix
CQFP 68
Ceramic Quad Flat Pack (on request)
E Suffix
LCCC 68
Leadless Ceramic Chip Carrier
R Suffix
PGA 68
Pin Grid Array
Rev. 2170A–HIREL–09/05

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