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2-KIS223-210GG

产品描述IC Socket, PGA223, 223 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder
产品类别连接器    插座   
文件大小179KB,共2页
制造商Advanced Interconnections Corp
标准
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2-KIS223-210GG概述

IC Socket, PGA223, 223 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder

2-KIS223-210GG规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Advanced Interconnections Corp
Reach Compliance Codecompli
ECCN代码EAR99
其他特性1.0 OZ. AVG. INSERTION FORCE
主体宽度1.8 inch
主体深度0.015 inch
主体长度1.8 inch
触点的结构18X18
联系完成配合AU ON NI
联系完成终止Gold (Au) - with Nickel (Ni) barrie
触点材料BE-CU
触点样式RND PIN-SKT
设备插槽类型IC SOCKET
使用的设备类型PGA223
外壳材料POLYAMIDE
JESD-609代码e4
制造商序列号KIS
插接触点节距0.1 inch
安装方式STRAIGHT
触点数223
最高工作温度400 °C
最低工作温度-269 °C
PCB接触模式RECTANGULAR
PCB触点行间距0.1 mm
端子节距2.54 mm
端接类型SOLDER

文档预览

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Low Insertion Force
Peel-A-Way
®
PGA Sockets
5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
Peel-A-Way
®
Low Insertion Force PGA Sockets
Polyimide Film
.005
(.13)
Features:
• Disposable carriers peel away after
soldering.
• Peel-A-Way
®
tabs and full grid wafer
supplied on all Peel-A-Way
®
PGA sockets.
• Maximum air flow under PGA for greater
cooling.
• Better flux rinse and cleaning.
• Allows inspection of solder joints on both
sides of PCB.
• Lowest profile with use of type -210
terminal.
• Peel-A-Way
®
disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
1
Footprint Dash #
If Applicable*
How To Order
KS
068
-85
T
G
Contact Plating
G - Gold
T - Tin-Lead
Terminal Plating
G - Gold
T - Tin-Lead
Terminal Type
See next page
for terminal types
Body Type
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
Number of Pins
004 to 484
*See pages 37 - 64
for PGA footprints
Polyimide Film
Polyimide Film
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
Peel away
after soldering
to PCB.
PCB
Solder fillets visible both sides
for inspection and cleaning.
Solder Preform:
63% Tin, 37% Lead
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Sealant Options
RTV
Seal
Body Material:
KS/KIS -
Polyimide Film
-269˚C to 400˚C (-452˚F to 752˚F)
RTV Sealed
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Peel-A-Way
®
covered by patent rights issued and/or pending.
Tape Sealed
To order: Add 3M to end of part #
Page 34
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
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