HIGH-SPEED 3.3V 256K x 36

SYNCHRONOUS

BANK-SWITCHABLE

DUAL-PORT STATIC RAM

WITH 3.3V OR 2.5V INTERFACE

Features:

x

IDT70V7519S

x

256K x 36 Synchronous Bank-Switchable Dual-ported

SRAM Architecture

–

64 independent 4K x 36 banks

– 9 megabits of memory on chip

Bank access controlled via bank address pins

High-speed data access

– Commercial: 3.4ns(200MHz)/3.6ns (166MHz)/4.2ns

(133MHz) (max.)

– Industrial: 3.6ns (166MHz)/4.2ns (133MHz) (max.)

Selectable Pipelined or Flow-Through output mode

Counter enable and repeat features

Dual chip enables allow for depth expansion without

additional logic

Full synchronous operation on both ports

– 5ns cycle time, 200MHz operation (14Gbps bandwidth)

– Fast 3.4ns clock to data out

x

– 1.5ns setup to clock and 0.5ns hold on all control, data, and

address inputs @ 200MHz

– Data input, address, byte enable and control registers

– Self-timed write allows fast cycle time

Separate byte controls for multiplexed bus and bus

matching compatibility

LVTTL- compatible, 3.3V (±150mV) power supply

for core

LVTTL compatible, selectable 3.3V (±150mV) or 2.5V

(±100mV) power supply for I/Os and control signals on

each port

Industrial temperature range (-40°C to +85°C) is

available at 166MHz and 133MHz

Available in a 208-pin Plastic Quad Flatpack (PQFP),

208-pin fine pitch Ball Grid Array (fpBGA), and 256-pin Ball

Grid Array (BGA)

Supports JTAG features compliant with IEEE 1149.1

Functional Block Diagram

PL/FT

L

OPT

L

CLK

L

ADS

L

CNTEN

L

REPEAT

L

R/W

L

CE

0L

CE

1L

BE

3L

BE

2L

BE

1L

BE

0L

OE

L

PL/FT

R

OPT

R

CLK

R

ADS

R

CNTEN

R

REPEAT

R

R/W

R

CE

0R

CE

1R

BE

3R

BE

2R

BE

1R

BE

0R

OE

R

CONTROL

LOGIC

MUX

4Kx36

MEMORY

ARRAY

(BANK 0)

MUX

CONTROL

LOGIC

I/O

0L-35L

I/O

CONTROL

MUX

4Kx36

MEMORY

ARRAY

(BANK 1)

MUX

I/O

CONTROL

I/O

0R-35R

A

11L

A

0L

BA

5L

BA

4L

BA

3L

BA

2L

BA

1L

BA

0L

ADDRESS

DECODE

ADDRESS

DECODE

A

11R

A

0R

BA

5R

BA

4R

BA

3R

BA

2R

BA

1R

BA

0R

BANK

DECODE

MUX

4Kx36

MEMORY

ARRAY

(BANK 63)

BANK

DECODE

NOTE:

1. The Bank-Switchable dual-port uses a true SRAM

core instead of the traditional dual-port SRAM core.

As a result, it has unique operating characteristics.

Please refer to the functional description on page 19

for details.

MUX

,

TDI

TDO

JTAG

TMS

TCK

TRST

5618 drw 01

DECEMBER 2002

1

DSC 5618/5

IDT70V7519S

High-Speed 256K x 36 Synchronous Bank-Switchable Dual-Port Static RAM

Industrial and Commercial Temperature Ranges

Description:

The IDT70V7519 is a high-speed 256Kx36 (9Mbit) synchronous

Bank-Switchable Dual-Ported SRAM organized into 64 independent

4Kx36 banks. The device has two independent ports with separate

control, address, and I/O pins for each port, allowing each port to access

any 4Kx36 memory block not already accessed by the other port.

Accesses by the ports into specific banks are controlled via the bank

address pins under the user's direct control.

Registers on control, data, and address inputs provide minimal setup

and hold times. The timing latitude provided by this approach allows

systems to be designed with very short cycle times. With an input data

register, the IDT70V7519 has been optimized for applications having

unidirectional or bidirectional data flow in bursts. An automatic power down

feature, controlled by CE

0

and CE

1

, permits the on-chip circuitry of each

port to enter a very low standby power mode. The dual chip enables also

facilitate depth expansion.

The 70V7519 can support an operating voltage of either 3.3V or 2.5V

on one or both ports, controllable by the OPT pins. The power supply for

the core of the device(V

DD

) remains at 3.3V. Please refer also to the

functional description on page 19.

Pin Configuration

(1,2,3,4)

01/11/02

A1

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

A12

A13

A14

A15

A16

A17

IO

19L

B1

IO

18L

B2

V

SS

B3

TDO

B4

NC

B5

BA

4L

B6

BA

0L

B7

A

8L

B8

BE

1L

B9

V

DD

B10

CLK

L

B11

CNTEN

L

B12

A

4L

B13

A

0L

B14

OPT

L

I/O

17L

B15

B16

V

SS

B17

I/O

20R

C1

V

SS

C2

I/O

18R

C3

TDI

C4

BA

5L

C5

BA

1L

C6

A

9L

C7

BE

2L

C8

CE

0L

C9

V

SS

C10

ADS

L

C11

A

5L

C12

A

1L

C13

V

SS

C14

V

DDQR

C15

I/O

16L

C16

I/O

15R

C17

V

DDQL

I/O

19R

V

DDQR

PL/

FT

L

D1

D2

D3

D4

NC

D5

BA

2L

D6

A

10L

D7

BE

3L

D8

CE

1L

D9

V

SS

D10

R/

W

L

D11

A

6L

D12

A

2L

D13

V

DD

D14

I/O

16R

I/O

15L

D15

D16

V

SS

D17

I/O

22L

E1

V

SS

E2

I/O

21L

E3

I/O

20L

E4

BA

3L

A

11L

A

7L

BE

0L

V

DD

OE

L

REPEAT

L

A

3L

V

DD

I/O

17R

E14

V

DDQL

E15

I/O

14L

E16

I/O

14R

E17

I/O

23L

I/O

22R

V

DDQR

I/O

21R

F1

F2

F3

F4

I/O

12L

I/O

13R

F14

F15

V

SS

F16

I/O

13L

F17

V

DDQL

I/O

23R

I/O

24L

G1

G2

G3

V

SS

G4

V

SS

G14

I/O

12R

I/O

11L

V

DDQR

G15

G16

G17

I/O

26L

H1

V

SS

H2

I/O

25L

H3

I/O

24R

H4

I/O

9L

V

DDQL

I/O

10L

I/O

11R

V

DD

J1

I/O

26R

V

DDQR

I/O

25R

J2

J3

J4

70V7519BF

BF-208

(5)

208-Pin fpBGA

Top View

(6)

H14

H15

H16

H17

V

DD

J14

IO

9R

J15

V

SS

J16

I/O

10R

J17

V

DDQL

K1

V

DD

K2

V

SS

K3

V

SS

K4

V

SS

K14

V

DD

K15

V

SS

K16

V

DDQR

K17

I/O

28R

L1

V

SS

L2

I/O

27R

L3

V

SS

L4

I/O

7R

V

DDQL

I/O

8R

L14

L15

L16

V

SS

L17

I/O

29R

I/O

28L

V

DDQR

I/O

27L

M1

M2

M3

M4

I/O

6R

M14

I/O

7L

M15

V

SS

M16

I/O

8L

M17

V

DDQL

I/O

29L

I/O

30R

N1

N2

N3

V

SS

N4

V

SS

N14

I/O

6L

I/O

5R

V

DDQR

N15

N16

N17

I/O

31L

P1

V

SS

P2

I/O

31R

I/O

30L

P3

P4

P5

P6

P7

P8

P9

P10

P11

P12

P13

I/O

3R

V

DDQL

I/O

4R

P14

P15

P16

I/O

5L

P17

I/O

32R

I/O

32L

V

DDQR

I/O

35R

TRST

BA

4R

BA

0R

R1

R2

R3

R4

R5

R6

R7

A

8R

R8

BE

1R

R9

V

DD

R10

CLK

R

CNTEN

R

A

4R

R11

R12

R13

I/O

2L

R14

I/O

3L

R15

V

SS

R16

I/O

4L

R17

V

SS

T1

I/O

33L

T2

I/O

34R

T3

TCK

T4

BA

5R

BA

1R

T5

T6

A

9R

T7

BE

2R

CE

0R

T8

T9

V

SS

T10

ADS

R

T11

A

5R

T12

A

1R

T13

V

SS

T14

V

DDQL

T15

I/O

1R

V

DDQR

T16

T17

I/O

33R

U1

I/O

34L

V

DDQL

TMS

U2

U3

U4

NC

U5

BA

2R

U6

A

10R

U7

BE

3R

U8

CE

1R

U9

V

SS

U10

R/W

R

A

6R

U12

A

2R

U13

V

SS

U14

I/O

0R

U15

V

SS

U16

I/O

2R

U17

V

SS

I/O

35L

PL/

FT

R

NC

BA

3R

A

11R

A

7R

BE

0R

V

DD

OE

R

A

3R

A

0R

V

DD

OPT

R

I/O

0L

I/O

1L

,

5618 drw 02c

NOTES:

1. All V

DD

pins must be connected to 3.3V power supply.

2. All V

DDQ

pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V

IH

(3.3V), and 2.5V if OPT pin for that port is

set to V

IL

(0V).

3. All V

SS

pins must be connected to ground supply.

4. Package body is approximately 15mm x 15mm x 1.4mm with 0.8mm ball pitch.

5. This package code is used to reference the package diagram.

6. This text does not indicate orientation of the actual part-marking.

6.42

2

IDT70V7519S

High-Speed 256K x 36 Synchronous Bank-Switchable Dual-Port Static RAM

Industrial and Commercial Temperature Ranges

Pin Configuration

(1,2,3,4)

(con't.)

70V7519BC

BC-256

(5)

256-Pin BGA

Top View

(6)

A2

A3

A4

A5

A6

A7

A8

A9

A10

A11

A12

A13

A14

A15

A16

11/08/01

A1

NC

B1

TDI

B2

NC

B3

BA

5L

B4

BA

2L

B5

A

11L

B6

A

8L

B7

BE

2L

B8

CE

1L

B9

OE

L

CNTEN

L

B10

B11

A

5L

B12

A

2L

B13

A

0L

B14

NC

B15

NC

B16

I/O

18L

C1

NC

C2

TDO

C3

NC

C4

BA

3L

C5

BA

0L

C6

A

9L

C7

BE

3L

C8

CE

0L

R/W

L

REPEAT

L

C9

C10

C11

A

4L

C12

A

1L

C13

V

DD

C14

I/O

17L

C15

NC

C16

I/O

18R

I/O

19L

D1

D2

V

SS

D3

BA

4L

D4

BA

1L

D5

A

10L

D6

A

7L

D7

BE

1L

D8

BE

0L

CLK

L

ADS

L

D9

D10

D11

A

6L

D12

A

3L

D13

OPT

L

I/O

17R

I/O

16L

D14

D15

D16

I/O

20R

I/O

19R

I/O

20L

PL/FT

L

V

DDQL

V

DDQL

V

DDQR

V

DDQR

V

DDQL

V

DDQL

V

DDQR

V

DDQR

V

DD

I/O

15R

I/O

15L

I/O

16R

E1

E2

E3

E4

E5

E6

E7

E8

E9

E10

E11

E12

E13

E14

E15

E16

I/O

21R

I/O

21L

I/O

22L

V

DDQL

F1

F2

F3

F4

V

DD

F5

V

DD

F6

V

SS

F7

V

SS

F8

V

SS

F9

V

SS

F10

V

DD

F11

V

DD

V

DDQR

I/O

13L

I/O

14L

I/O

14R

F12

F13

F14

F15

F16

I/O

23L

I/O

22R

I/O

23R

V

DDQL

G1

G2

G3

G4

V

DD

G5

V

SS

G6

V

SS

G7

V

SS

G8

V

SS

G9

V

SS

G10

V

SS

G11

V

DD

V

DDQR

I/O

12R

I/O

13R

I/O

12L

G12

G13

G14

G15

G16

I/O

24R

I/O

24L

I/O

25L

V

DDQR

H1

H2

H3

H4

V

SS

H5

V

SS

H6

V

SS

H7

V

SS

H8

V

SS

H9

V

SS

H10

V

SS

H11

V

SS

H12

V

DDQL

I/O

10L

I/O

11L

I/O

11R

H13

H14

H15

H16

I/O

26L

I/O

25R

I/O

26R

V

DDQR

V

SS

J1

J2

J3

J4

J5

V

SS

J6

V

SS

J7

V

SS

J8

V

SS

J9

V

SS

J10

V

SS

J11

V

SS

J12

V

DDQL

I/O

9R

J13

J14

IO

9L

I/O

10R

J15

J16

I/O

27L

I/O

28R

I/O

27R

V

DDQL

K1

K2

K3

K4

V

SS

K5

V

SS

K6

V

SS

K7

V

SS

K8

V

SS

K9

V

SS

K10

V

SS

K11

V

SS

K12

V

DDQR

I/O

8R

I/O

7R

K13

K14

K15

I/O

8L

K16

I/O

29R

I/O

29L

I/O

28L

V

DDQL

L1

L2

L3

L4

V

SS

L5

V

SS

L6

V

SS

L7

V

SS

L8

V

SS

L9

V

SS

L10

V

SS

L11

V

SS

L12

V

DDQR

I/O

6R

L13

L14

I/O

6L

L15

I/O

7L

L16

I/O

30L

I/O

31R

M1

M2

I/O

30R

V

DDQR

M3

M4

V

DD

M5

V

SS

M6

V

SS

M7

V

SS

M8

V

SS

M9

V

SS

M10

V

SS

M11

V

DD

M12

V

DDQL

I/O

5L

M13

M14

I/O

4R

I/O

5R

M15

M16

I/O

32R

I/O

32L

I/O

31L

V

DDQR

N1

N2

N3

N4

V

DD

N5

V

DD

N6

V

SS

N7

V

SS

N8

V

SS

N9

V

SS

N10

V

DD

N11

V

DD

N12

V

DDQL

I/O

3R

N13

N14

I/O

3L

N15

I/O

4L

N16

I/O

33L

I/O

34R

I/O

33R

P1

P2

P3

PL/FT

R

V

DDQR

V

DDQR

V

DDQL

V

DDQL

V

DDQR

V

DDQR

V

DDQL

V

DDQL

P4

P5

P6

P7

P8

P9

P10

P11

P12

V

DD

P13

I/O

2L

P14

I/O

1R

I/O

2R

P15

P16

I/O

35R

I/O

34L

TMS

R1

R2

R3

BA

4R

BA

1R

R4

R5

A

10R

R6

A

7R

R7

BE

1R

R8

BE

0R

R9

CLK

R

ADS

R

R10

R11

A

6R

R12

A

3R

R13

I/O

0L

I/O

0R

R14

R15

I/O

1L

R16

I/O

35L

T1

NC

T2

TRST

T3

NC

T4

BA

3R

BA

0R

T5

T6

A

9R

T7

BE

3R

CE

0R

R/W

R

REPEAT

R

T8

T9

T10

T11

A

4R

T12

A

1R

T13

OPT

R

T14

NC

T15

NC

T16

,

NC

TCK

NC

BA

5R

BA

2R

A

11R

A

8R

BE

2R

CE

1R

OE

R

CNTEN

R

A

5R

A

2R

A

0R

NC

5618 drw 02d

,

NOTES:

1. All V

DD

pins must be connected to 3.3V power supply.

2. All V

DDQ

pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V

IH

(3.3V), and 2.5V if OPT pin for that port is

set to V

IL

(0V).

3. All V

SS

pins must be connected to ground supply.

4. Package body is approximately 17mm x 17mm x 1.4mm, with 1.0mm ball-pitch.

5. This package code is used to reference the package diagram.

6. This text does not indicate orientation of the actual part-marking.

6.42

3

IDT70V7519S

High-Speed 256K x 36 Synchronous Bank-Switchable Dual-Port Static RAM

Industrial and Commercial Temperature Ranges

Pin Configuration

(1,2,3,4)

(con't.)

11/08/01

208

207

206

205

204

203

202

201

200

199

198

197

196

195

194

193

192

191

190

189

188

187

186

185

184

183

182

181

180

179

178

177

176

175

174

173

172

171

170

169

168

167

166

165

164

163

162

161

160

159

158

157

V

SS

V

DDQR

I/O

18R

I/O

18L

V

SS

PL/FT

L

TDI

TDO

NC

BA

5L

BA

4L

BA

3L

BA

2L

BA

1L

BA

0L

A

11L

A

10L

A

9L

A

8L

A

7L

BE

3L

BE

2L

BE

1L

BE

0L

CE

1L

CE

0L

V

DD

V

DD

V

SS

V

SS

CLK

L

OE

L

R/W

L

ADS

L

CNTEN

L

REPEAT

L

A

6L

A

5L

A

4L

A

3L

A

2L

A

1L

A

0L

V

DD

V

DD

V

SS

OPT

L

I/O

17L

I/O

17R

V

DDQR

V

SS

53

54

55

56

57

58

59

60

61

62

63

64

65

66

67

68

69

70

71

72

73

74

75

76

77

78

79

80

81

82

83

84

85

86

87

88

89

90

91

92

93

94

95

96

97

98

99

100

101

102

103

104

I/O

19L

I/O

19R

I/O

20L

I/O

20R

V

DDQL

V

SS

I/O

21L

I/O

21R

I/O

22L

I/O

22R

V

DDQR

V

SS

I/O

23L

I/O

23R

I/O

24L

I/O

24R

V

DDQL

V

SS

I/O

25L

I/O

25R

I/O

26L

I/O

26R

V

DDQR

V

SS

V

DD

V

DD

V

SS

V

SS

V

DDQL

V

SS

I/O

27R

I/O

27L

I/O

28R

I/O

28L

V

DDQR

V

SS

I/O

29R

I/O

29L

I/O

30R

I/O

30L

V

DDQL

V

SS

I/O

31R

I/O

31L

I/O

32R

I/O

32L

V

DDQR

V

SS

I/O

33R

I/O

33L

I/O

34R

I/O

34L

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

32

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

50

51

52

70V7519DR

DR-208

(5)

208-Pin PQFP

Top View

(6)

156

155

154

153

152

151

150

149

148

147

146

145

144

143

142

141

140

139

138

137

136

135

134

133

132

131

130

129

128

127

126

125

124

123

122

121

120

119

118

117

116

115

114

113

112

111

110

109

108

107

106

105

I/O

16L

I/O

16R

I/O

15L

I/O

15R

V

SS

V

DDQL

I/O

14L

I/O

14R

I/O

13L

I/O

13R

V

SS

V

DDQR

I/O

12L

I/O

12R

I/O

11L

I/O

11R

V

SS

V

DDQL

I/O

10L

I/O

10R

I/O

9L

I/O

9R

V

SS

V

DDQR

V

DD

V

DD

V

SS

V

SS

V

SS

V

DDQL

I/O

8R

I/O

8L

I/O

7R

I/O

7L

V

SS

V

DDQR

I/O

6R

I/O

6L

I/O

5R

I/O

5L

V

SS

V

DDQL

I/O

4R

I/O

4L

I/O

3R

I/O

3L

V

SS

V

DDQR

I/O

2R

I/O

2L

I/O

1R

I/O

1L

,

NOTES:

1. All V

DD

pins must be connected to 3.3V power supply.

2. All V

DDQ

pins must be connected to appropriate power supply: 3.3V if OPT pin for that port is set to V

IH

(3.3V), and 2.5V if OPT pin for that port is set to V

IL

(0V).

3. All V

SS

pins must be connected to ground supply.

4. Package body is approximately 28mm x 28mm x 3.5mm.

5. This package code is used to reference the package diagram.

6. This text does not indicate orientation of the actual part-marking.

V

SS

V

DDQL

I/O

35R

I/O

35L

PL/FT

R

TMS

TCK

TRST

NC

BA

5R

BA

4R

BA

3R

BA

2R

BA

1R

BA

0R

A

11R

A

10R

A

9R

A

8R

A

7R

BE

3R

BE

2R

BE

1R

BE

0R

CE

1R

CE

0R

V

DD

V

DD

V

SS

V

SS

CLK

R

OE

R

R/W

R

ADS

R

CNTEN

R

REPEAT

R

A

6R

A

5R

A

4R

A

3R

A

2R

A

1R

A

0R

V

DD

V

SS

V

SS

OPT

R

I/O

0L

I/O

0R

V

DDQL

V

SS

5618 drw 02a

6.42

4

IDT70V7519S

High-Speed 256K x 36 Synchronous Bank-Switchable Dual-Port Static RAM

Industrial and Commercial Temperature Ranges

Pin Names

Left Port

CE

0L

,

CE

1L

R/W

L

OE

L

BA

0L

- BA

5L

A

0L

- A

11L

I/O

0L

- I/O

35L

CLK

L

PL/FT

L

ADS

L

CNTEN

L

REPEAT

L

BE

0L

-

BE

3L

V

DDQL

OPT

L

V

DD

V

SS

TDI

TDO

TCK

TMS

TRST

Right Port

CE

0R

,

CE

1R

R/W

R

OE

R

BA

0R

- BA

5R

A

0R

- A

11R

I/O

0R

- I/O

35R

CLK

R

PL/FT

R

ADS

R

CNTEN

R

REPEAT

R

BE

0R

-

BE

3R

V

DDQR

OPT

R

Chip Enables

Read/Write Enable

Output Enable

Bank Address

(4)

Address

Data Input/Output

Clock

Pipeline/Flow-Through

Address Strobe Enable

Counter Enable

Counter Repeat

(3)

Byte Enables (9-bit bytes)

Power (I/O Bus) (3.3V or 2.5V)

(1)

Option for selecting V

DDQX

(1,2)

Power (3.3V)

(1)

Ground (0V)

Test Data Input

Test Data Output

Test Logic Clock (10MHz)

Test Mode Select

Reset (Initialize TAP Controller)

5618 tbl 01

Names

NOTES:

1. V

DD

, OPT

X

, and V

DDQX

must be set to appropriate operating levels prior to

applying inputs on the I/Os and controls for that port.

2. OPT

X

selects the operating voltage levels for the I/Os and controls on that port.

If OPT

X

is set to VIH (3.3V), then that port's I/Os and controls will operate at 3.3V

levels and V

DDQX

must be supplied at 3.3V. If OPT

X

is set to VIL (0V), then that

port's I/Os and address controls will operate at 2.5V levels and V

DDQX

must be

supplied at 2.5V. The OPT pins are independent of one another—both ports can

operate at 3.3V levels, both can operate at 2.5V levels, or either can operate

at 3.3V with the other at 2.5V.

3. When

REPEAT

X

is asserted, the counter will reset to the last valid address loaded

via

ADS

X

.

4. Accesses by the ports into specific banks are controlled by the bank address

pins under the user's direct control: each port can access any bank of memory

with the shared array that is not currently being accessed by the opposite port

(i.e., BA

0L

- BA

5L

≠

BA

0R

- BA

5R

). In the event that both ports try to access the

same bank at the same time, neither access will be valid, and data at the two

specific addresses targeted by the ports within that bank may be corrupted (in

the case that either or both ports are writing) or may result in invalid output (in

the case that both ports are trying to read).

6.42

5

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	BGA
包装说明	TFBGA,
针数	208
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.A
最长访问时间	15 ns
其他特性	FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码	S-PBGA-B208
JESD-609代码	e1
长度	15 mm
内存密度	9437184 bit
内存集成电路类型	DUAL-PORT SRAM
内存宽度	36
湿度敏感等级	3
功能数量	1
端子数量	208
字数	262144 words
字数代码	256000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	256KX36
封装主体材料	PLASTIC/EPOXY
封装代码	TFBGA
封装形状	SQUARE
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
认证状态	Not Qualified
座面最大高度	1.2 mm
最大供电电压 (Vsup)	3.45 V
最小供电电压 (Vsup)	3.15 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL
端子节距	0.8 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	30
宽度	15 mm

	IDT70V7519S133BFG8	IDT70V7519S166BFG8	IDT70V7519S133BCG8	IDT70V7519S133BFGI8	IDT70V7519S133BCGI8	IDT70V7519S166BCG8	IDT70V7519S166BCGI8
描述	Dual-Port SRAM, 256KX36, 15ns, PBGA208, FBGA-208	Dual-Port SRAM, 256KX36, 12ns, PBGA208, FBGA-208	Dual-Port SRAM, 256KX36, 15ns, PBGA256, BGA-256	Dual-Port SRAM, 256KX36, 15ns, PBGA208, FBGA-208	Dual-Port SRAM, 256KX36, 15ns, PBGA256, BGA-256	Dual-Port SRAM, 256KX36, 12ns, PBGA256, BGA-256	Dual-Port SRAM, 256KX36, 12ns, PBGA256, BGA-256
是否无铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	TFBGA,	TFBGA,	LBGA,	TFBGA,	LBGA,	LBGA,	LBGA,
针数	208	208	256	208	256	256	256
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	15 ns	12 ns	15 ns	15 ns	15 ns	12 ns	12 ns
其他特性	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE	FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码	S-PBGA-B208	S-PBGA-B208	S-PBGA-B256	S-PBGA-B208	S-PBGA-B256	S-PBGA-B256	S-PBGA-B256
JESD-609代码	e1	e1	e1	e1	e1	e1	e1
长度	15 mm	15 mm	17 mm	15 mm	17 mm	17 mm	17 mm
内存密度	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit	9437184 bit
内存集成电路类型	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
内存宽度	36	36	36	36	36	36	36
湿度敏感等级	3	3	3	3	3	3	3
功能数量	1	1	1	1	1	1	1
端子数量	208	208	256	208	256	256	256
字数	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words	262144 words
字数代码	256000	256000	256000	256000	256000	256000	256000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C
组织	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36	256KX36
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TFBGA	TFBGA	LBGA	TFBGA	LBGA	LBGA	LBGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	260	260	260	260	260	260
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.5 mm	1.2 mm	1.5 mm	1.5 mm	1.5 mm
最大供电电压 (Vsup)	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V	3.45 V
最小供电电压 (Vsup)	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V	3.15 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)	Tin/Silver/Copper (Sn/Ag/Cu)
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	0.8 mm	0.8 mm	1 mm	0.8 mm	1 mm	1 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
处于峰值回流温度下的最长时间	30	30	30	30	30	30	30
宽度	15 mm	15 mm	17 mm	15 mm	17 mm	17 mm	17 mm

IDT70V7519S133BFG8

IDT70V7519S133BFG8概述

IDT70V7519S133BFG8规格参数

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