Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Everspin Technologies |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| JESD-30 代码 | S-PBGA-B48 |
| 长度 | 8 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 131072 words |
| 字数代码 | 128000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 128KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.35 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 0.75 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 8 mm |
| MR1A16AMA35 | MR1A16ACMA35 | MR1A16ACYS35 | MR1A16ACYS35R | MR1A16AVYS35 | MR1A16AVYS35R | MR1A16AVMA35 | MR1A16AYS35 | MR1A16AYS35R | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48 | Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48 | Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | Memory Circuit, 128KX16, CMOS, PBGA48, 8 X 8 MM, ROHS COMPLIANT, FBGA-48 | Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 | Memory Circuit, 128KX16, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, PLASTIC, TSOP2-44 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | BGA | BGA | TSOP2 | TSOP2 | TSOP2 | TSOP2 | BGA | TSOP2 | TSOP2 |
| 包装说明 | LFBGA, | LFBGA, | TSOP2, TSOP44,.46,32 | TSOP2, | TSOP2, TSOP44,.46,32 | TSOP2, | LFBGA, | TSOP2, TSOP44,.46,32 | TSOP2, |
| 针数 | 48 | 48 | 44 | 44 | 44 | 44 | 48 | 44 | 44 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-30 代码 | S-PBGA-B48 | S-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-G44 | S-PBGA-B48 | R-PDSO-G44 | R-PDSO-G44 |
| 长度 | 8 mm | 8 mm | 18.41 mm | 18.41 mm | 18.41 mm | 18.41 mm | 8 mm | 18.41 mm | 18.41 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 44 | 44 | 44 | 44 | 48 | 44 | 44 |
| 字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
| 字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 105 °C | 105 °C | 105 °C | 70 °C | 70 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - | - |
| 组织 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 | 128KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | TSOP2 | TSOP2 | TSOP2 | TSOP2 | LFBGA | TSOP2 | TSOP2 |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 260 | NOT SPECIFIED | 260 | 260 | NOT SPECIFIED | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.35 mm | 1.35 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.35 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | GULL WING | GULL WING | GULL WING | GULL WING | BALL | GULL WING | GULL WING |
| 端子节距 | 0.75 mm | 0.75 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | DUAL | DUAL | DUAL | DUAL | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | NOT SPECIFIED | 40 | NOT SPECIFIED | 40 | 40 | NOT SPECIFIED | 40 |
| 宽度 | 8 mm | 8 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 8 mm | 10.16 mm | 10.16 mm |
| 厂商名称 | Everspin Technologies | - | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies | Everspin Technologies |
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