SPECIALTY CONSUMER CIRCUIT, PQFP208, PLASTIC, MQFP-208
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | QFP |
| 包装说明 | PLASTIC, MQFP-208 |
| 针数 | 208 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.A.2 |
| 商用集成电路类型 | CONSUMER CIRCUIT |
| JESD-30 代码 | S-PQFP-G208 |
| JESD-609代码 | e0 |
| 长度 | 28 mm |
| 功能数量 | 1 |
| 端子数量 | 208 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FQFP |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | 220 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.1 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3.13 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 28 mm |
| ADSST-21065LCS-240 | ADSST-21065LKCA-240 | ADSST-21065LKCA-264 | ADSST-21065LKS-240 | ADSST-21065LKS-264 | |
|---|---|---|---|---|---|
| 描述 | SPECIALTY CONSUMER CIRCUIT, PQFP208, PLASTIC, MQFP-208 | SPECIALTY CONSUMER CIRCUIT, PBGA196, PLASTIC, BGA-196 | IC SPECIALTY CONSUMER CIRCUIT, PBGA196, PLASTIC, BGA-196, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PQFP208, PLASTIC, MQFP-208, Consumer IC:Other | IC SPECIALTY CONSUMER CIRCUIT, PQFP208, PLASTIC, MQFP-208, Consumer IC:Other |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | QFP | BGA | BGA | QFP | QFP |
| 包装说明 | PLASTIC, MQFP-208 | PLASTIC, BGA-196 | PLASTIC, BGA-196 | PLASTIC, MQFP-208 | PLASTIC, MQFP-208 |
| 针数 | 208 | 196 | 196 | 208 | 208 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | compliant |
| 商用集成电路类型 | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
| JESD-30 代码 | S-PQFP-G208 | S-PBGA-B196 | S-PBGA-B196 | S-PQFP-G208 | S-PQFP-G208 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 28 mm | 15 mm | 15 mm | 28 mm | 28 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 208 | 196 | 196 | 208 | 208 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FQFP | LBGA | LBGA | FQFP | FQFP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | FLATPACK, FINE PITCH | FLATPACK, FINE PITCH |
| 峰值回流温度（摄氏度） | 220 | 220 | 220 | 220 | 220 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.1 mm | 1.7 mm | 1.7 mm | 4.1 mm | 4.1 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | GULL WING | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 1 mm | 1 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | BOTTOM | BOTTOM | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 28 mm | 15 mm | 15 mm | 28 mm | 28 mm |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 温度等级 | - | OTHER | OTHER | OTHER | OTHER |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
