Low Power, Rail-to-Rail Output, Video Op Amp with Ultralow Power
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, |
| 针数 | 14 |
| 制造商包装代码 | RU-14 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 最大平均偏置电流 (IIB) | 1.7 µA |
| 标称共模抑制比 | 85 dB |
| 最大输入失调电压 | 4000 µV |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e3 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 端子数量 | 14 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 标称压摆率 | 100 V/us |
| 供电电压上限 | 5.5 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.4 mm |
| ADA4853-3YRUZ-R7 | ADA4853-1AKSZ-R2 | ADA4853-3YCPZ-R7 | ADA4853-3YCPZ-RL | |
|---|---|---|---|---|
| 描述 | Low Power, Rail-to-Rail Output, Video Op Amp with Ultralow Power | Low Power, Rail-to-Rail Output, Video Op Amps with Ultralow Power | Low Power, Rail-to-Rail Output, Video Op Amp with Ultralow Power | Low Power, Rail-to-Rail Output, Video Op Amp with Ultralow Power |
| Brand Name | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | TSSOP | TSSOP | QFN | QFN |
| 包装说明 | TSSOP, | TSSOP, | HVQCCN, | 3 X 3 MM, ROHS COMPLIANT, MO-220VEED-2, LFCSP-16 |
| 针数 | 14 | 6 | 16 | 16 |
| 制造商包装代码 | RU-14 | KS-6 | CP-16-27 | CP-16-27 |
| Reach Compliance Code | compliant | compliant | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G6 | S-XQCC-N16 | S-XQCC-N16 |
| JESD-609代码 | e3 | e4 | e3 | e3 |
| 长度 | 5 mm | 2 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | 3 | 3 |
| 功能数量 | 3 | 1 | 3 | 3 |
| 端子数量 | 14 | 6 | 16 | 16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | TSSOP | TSSOP | HVQCCN | HVQCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.1 mm | 0.8 mm | 0.9 mm |
| 表面贴装 | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Nickel/Palladium/Gold (Ni/Pd/Au) | Matte Tin (Sn) | Matte Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | NO LEAD | NO LEAD |
| 端子节距 | 0.65 mm | 0.65 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 40 | 30 | 30 |
| 宽度 | 4.4 mm | 1.25 mm | 3 mm | 3 mm |
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