Microcontroller, 8-Bit, OTPROM, Z8 CPU, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Zilog, Inc. |
零件包装代码 | DIP |
包装说明 | DIP, DIP40,.6 |
针数 | 40 |
Reach Compliance Code | unknown |
具有ADC | NO |
地址总线宽度 | 12 |
位大小 | 8 |
CPU系列 | Z8 |
最大时钟频率 | 12 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | 8 |
JESD-30 代码 | R-PDIP-T40 |
JESD-609代码 | e0 |
长度 | 52.325 mm |
I/O 线路数量 | 32 |
端子数量 | 40 |
最高工作温度 | 105 °C |
最低工作温度 | -40 °C |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP40,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 240 |
电源 | 5 V |
认证状态 | Not Qualified |
RAM(字节) | 236 |
ROM(单词) | 4096 |
ROM可编程性 | OTPROM |
座面最大高度 | 4.96 mm |
速度 | 12 MHz |
最大压摆率 | 20 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 15.24 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
Z86E4312PEC | Z86E3312VEC | Z86E3312SEC | Z86E4312FEC | Z86E4312VEC | Z86E3412VEC | Z86E4412PEC | |
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描述 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 12MHz, CMOS, PDIP40, PLASTIC, DIP-40 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 12MHz, CMOS, PQCC28, PLASTIC, LCC-28 | IC 8-BIT, OTPROM, 12 MHz, MICROCONTROLLER, PDSO28, SOIC-28, Microcontroller | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 12MHz, CMOS, PQFP44, PLASTIC, QFP-44 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 12MHz, CMOS, PQCC44, PLASTIC, LCC-44 | Microcontroller, 8-Bit, OTPROM, Z8 CPU, 12MHz, CMOS, PQCC28, PLASTIC, LCC-28 | IC 8-BIT, OTPROM, 12 MHz, MICROCONTROLLER, PDIP40, PLASTIC, DIP-40, Microcontroller |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. | Zilog, Inc. |
零件包装代码 | DIP | QLCC | SOIC | QFP | LCC | QLCC | DIP |
包装说明 | DIP, DIP40,.6 | QCCJ, LDCC28,.5SQ | SOP, SOP28,.4 | QFP, QFP44,.57SQ,32 | QCCJ, LDCC44,.7SQ | QCCJ, LDCC28,.5SQ | DIP, DIP40,.6 |
针数 | 40 | 28 | 28 | 44 | 44 | 28 | 40 |
Reach Compliance Code | unknown | unknown | unknow | unknow | unknow | unknown | unknown |
具有ADC | NO | NO | NO | NO | NO | NO | NO |
地址总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
CPU系列 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 | Z8 |
最大时钟频率 | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | R-PDIP-T40 | S-PQCC-J28 | R-PDSO-G28 | S-PQFP-G44 | S-PQCC-J44 | S-PQCC-J28 | R-PDIP-T40 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 52.325 mm | 11.505 mm | 17.9 mm | 10 mm | 16.5862 mm | 11.505 mm | 52.325 mm |
I/O 线路数量 | 32 | 24 | 24 | 32 | 32 | 24 | 32 |
端子数量 | 40 | 28 | 28 | 44 | 44 | 28 | 40 |
最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
PWM 通道 | NO | NO | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | QCCJ | SOP | QFP | QCCJ | QCCJ | DIP |
封装等效代码 | DIP40,.6 | LDCC28,.5SQ | SOP28,.4 | QFP44,.57SQ,32 | LDCC44,.7SQ | LDCC28,.5SQ | DIP40,.6 |
封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
封装形式 | IN-LINE | CHIP CARRIER | SMALL OUTLINE | FLATPACK | CHIP CARRIER | CHIP CARRIER | IN-LINE |
峰值回流温度(摄氏度) | 240 | 240 | 225 | 240 | 240 | 240 | NOT SPECIFIED |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
RAM(字节) | 236 | 237 | 237 | 236 | 236 | 237 | 236 |
ROM(单词) | 4096 | 4096 | 4096 | 4096 | 4096 | 16384 | 16384 |
ROM可编程性 | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM | OTPROM |
座面最大高度 | 4.96 mm | 4.57 mm | 2.65 mm | 2.5 mm | 4.57 mm | 4.57 mm | 4.24 mm |
速度 | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz | 12 MHz |
最大压摆率 | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA | 20 mA |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | YES | YES | YES | YES | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | J BEND | GULL WING | GULL WING | J BEND | J BEND | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | QUAD | DUAL | QUAD | QUAD | QUAD | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 15.24 mm | 11.505 mm | 7.5 mm | 10 mm | 16.5862 mm | 11.505 mm | 15.24 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
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