OT PLD, 40ns, 36-Cell, CMOS, PQCC44, PLASTIC, MO-047AC, LCC-44
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | XILINX(赛灵思) |
零件包装代码 | LPCC |
包装说明 | PLASTIC, MO-047AC, LCC-44 |
针数 | 44 |
Reach Compliance Code | not_compliant |
其他特性 | PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V |
最大时钟频率 | 33 MHz |
系统内可编程 | NO |
JESD-30 代码 | S-PQCC-J44 |
JESD-609代码 | e0 |
JTAG BST | NO |
长度 | 16.5862 mm |
湿度敏感等级 | 3 |
专用输入次数 | 2 |
I/O 线路数量 | 30 |
宏单元数 | 36 |
端子数量 | 44 |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 2 DEDICATED INPUTS, 30 I/O |
输出函数 | MACROCELL |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC44,.7SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 3/5 V |
可编程逻辑类型 | OT PLD |
传播延迟 | 40 ns |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 16.5862 mm |
XC7236A-25PC44C | XC7236A-16PC44C | XC7236A-16WC44I | XC7236A-25WC44C | XC7236A-25WC44I | |
---|---|---|---|---|---|
描述 | OT PLD, 40ns, 36-Cell, CMOS, PQCC44, PLASTIC, MO-047AC, LCC-44 | OT PLD, 25ns, 36-Cell, CMOS, PQCC44, PLASTIC, MO-047AC, LCC-44 | UV PLD, 25ns, 36-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, MO-087, LCC-44 | UV PLD, 40ns, 36-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, MO-087, LCC-44 | UV PLD, 40ns, 36-Cell, CMOS, CQCC44, WINDOWED, CERAMIC, MO-087, LCC-44 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) | XILINX(赛灵思) |
零件包装代码 | LPCC | LPCC | QFJ | QFJ | QFJ |
包装说明 | PLASTIC, MO-047AC, LCC-44 | PLASTIC, MO-047AC, LCC-44 | WQCCJ, LDCC44,.7SQ | WQCCJ, LDCC44,.7SQ | WQCCJ, LDCC44,.7SQ |
针数 | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | not_compliant | not_compliant | unknown | unknown | unknown |
其他特性 | PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V | PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V | PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V | PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V | PAL BLOCKS INTERCONNECTED BY PIA; 36 MACROCELLS; CONFIGURABLE I/O OPERATION-3.3V OR 5V |
最大时钟频率 | 33 MHz | 60 MHz | 60 MHz | 33 MHz | 33 MHz |
系统内可编程 | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQCC-J44 | S-PQCC-J44 | S-CQCC-J44 | S-CQCC-J44 | S-CQCC-J44 |
JTAG BST | NO | NO | NO | NO | NO |
长度 | 16.5862 mm | 16.5862 mm | 16.51 mm | 16.51 mm | 16.51 mm |
湿度敏感等级 | 3 | 3 | 1 | 1 | 1 |
专用输入次数 | 2 | 2 | 2 | 2 | 2 |
I/O 线路数量 | 30 | 30 | 30 | 30 | 30 |
宏单元数 | 36 | 36 | 36 | 36 | 36 |
端子数量 | 44 | 44 | 44 | 44 | 44 |
最高工作温度 | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
组织 | 2 DEDICATED INPUTS, 30 I/O | 2 DEDICATED INPUTS, 30 I/O | 2 DEDICATED INPUTS, 30 I/O | 2 DEDICATED INPUTS, 30 I/O | 2 DEDICATED INPUTS, 30 I/O |
输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QCCJ | QCCJ | WQCCJ | WQCCJ | WQCCJ |
封装等效代码 | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ | LDCC44,.7SQ |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
可编程逻辑类型 | OT PLD | OT PLD | UV PLD | UV PLD | UV PLD |
传播延迟 | 40 ns | 25 ns | 25 ns | 40 ns | 40 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.826 mm | 4.826 mm | 4.826 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V |
最小供电电压 | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 16.5862 mm | 16.5862 mm | 16.51 mm | 16.51 mm | 16.51 mm |
峰值回流温度(摄氏度) | - | - | 225 | 225 | 225 |
处于峰值回流温度下的最长时间 | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved