Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, TSOP2-44
| 参数名称 | 属性值 |
| 厂商名称 | Winbond(华邦电子) |
| 零件包装代码 | TSOP2 |
| 包装说明 | TSOP2, |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 12 ns |
| JESD-30 代码 | R-PDSO-G44 |
| JESD-609代码 | e3 |
| 长度 | 18.41 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 44 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP2 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| W26L04AH-12 | W26L04AJ-10I | W26L04AJ-12 | W26L04AJ-12I | W26L04AH-10 | W26L04AH-12I | W26L04AJ-10 | W26L04AH-10I | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 256KX16, 12ns, CMOS, PDSO44, TSOP2-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, SOJ-44 | Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, TSOP2-44 |
| 厂商名称 | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
| 零件包装代码 | TSOP2 | SOJ | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | TSOP2 |
| 包装说明 | TSOP2, | SOJ, | SOJ, | SOJ, | TSOP2, | TSOP2, | SOJ, | TSOP2, |
| 针数 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 12 ns | 10 ns | 12 ns | 12 ns | 10 ns | 12 ns | 10 ns | 10 ns |
| JESD-30 代码 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-G44 | R-PDSO-G44 | R-PDSO-J44 | R-PDSO-G44 |
| 长度 | 18.41 mm | 28.58 mm | 28.58 mm | 28.58 mm | 18.41 mm | 18.41 mm | 28.58 mm | 18.41 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP2 | SOJ | SOJ | SOJ | TSOP2 | TSOP2 | SOJ | TSOP2 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 3.759 mm | 3.759 mm | 3.759 mm | 1.2 mm | 1.2 mm | 3.759 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 (Vsup) | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
| 端子形式 | GULL WING | J BEND | J BEND | J BEND | GULL WING | GULL WING | J BEND | GULL WING |
| 端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm | 0.8 mm | 1.27 mm | 0.8 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
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