SN74LS261JP4
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | _compli |
JESD-30 代码 | R-XDIP-T16 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER |
SN74LS261JP4 | SN74LS261D3 | SN74LS261NP3 | SN74LS261N3 | SN74LS261N1 | SN74LS261NP1 | SN74LS261FN3 | SN74LS261J4 | SNC54LS261J | |
---|---|---|---|---|---|---|---|---|---|
描述 | SN74LS261JP4 | SN74LS261D3 | SN74LS261NP3 | SN74LS261N3 | IC,MULTIPLIER,LS-TTL,DIP,16PIN,PLASTIC | IC,MULTIPLIER,LS-TTL,DIP,16PIN,PLASTIC | SN74LS261FN3 | SN74LS261J4 | IC,MULTIPLIER,LS-TTL,DIP,16PIN,CERAMIC |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
包装说明 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli | _compli | _compli |
JESD-30 代码 | R-XDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | S-PQCC-J20 | R-XDIP-T16 | R-XDIP-T16 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 20 | 16 | 16 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C |
封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC |
封装代码 | DIP | SOP | DIP | DIP | DIP | DIP | QCCJ | DIP | DIP |
封装等效代码 | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | LDCC20,.4SQ | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
表面贴装 | NO | YES | NO | NO | NO | NO | YES | NO | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | DUAL |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - | - |
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