Programmable Logic Device, 25ns, PAL-Type, CMOS, PDIP24,
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Atmel (Microchip) |
| 包装说明 | DIP, DIP24,.3 |
| Reach Compliance Code | compli |
| ECCN代码 | 3A001.A.2.C |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 33.3 MHz |
| JESD-30 代码 | R-PDIP-T24 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 132 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 传播延迟 | 25 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 5962-01-426-0095 | 5962-01-419-2277 | 5962-01-307-5787 | 5962-01-418-5829 | 5962-01-303-6132 | |
|---|---|---|---|---|---|
| 描述 | Programmable Logic Device, 25ns, PAL-Type, CMOS, PDIP24, | Programmable Logic Device, 15ns, PAL-Type, CMOS, CDIP24, | Programmable Logic Device, 25ns, PAL-Type, CMOS, CQCC28, | Programmable Logic Device, 25ns, PAL-Type, CMOS, CDIP24, | Programmable Logic Device, 25ns, PAL-Type, CMOS, CDIP24, |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | QCCN, LCC28,.45SQ | DIP, DIP24,.3 | DIP, DIP24,.3 |
| Reach Compliance Code | compli | compli | compliant | compliant | compli |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE |
| 最大时钟频率 | 33.3 MHz | 50 MHz | 30.3 MHz | 30.3 MHz | 30.3 MHz |
| JESD-30 代码 | R-PDIP-T24 | R-XDIP-T24 | S-XQCC-N28 | R-XDIP-T24 | R-XDIP-T24 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 132 | 132 | 132 | 132 | 132 |
| 端子数量 | 24 | 24 | 28 | 24 | 24 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DIP | DIP | QCCN | DIP | DIP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | LCC28,.45SQ | DIP24,.3 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 传播延迟 | 25 ns | 15 ns | 25 ns | 25 ns | 25 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
| 筛选级别 | - | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved