IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder,
参数名称 | 属性值 |
厂商名称 | SAMTEC |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 2 weeks |
其他特性 | LOW PROFILE |
主体深度 | 0.132 inch |
主体长度 | 0.65 inch |
联系完成配合 | GOLD (30) OVER NICKEL |
联系完成终止 | GOLD (30) OVER NICKEL |
触点材料 | BE-CU |
触点样式 | RND PIN-SKT |
目前评级 | 1 A |
设备插槽类型 | IC SOCKET |
使用的设备类型 | DIP14 |
外壳材料 | BRASS |
JESD-609代码 | e4 |
插接触点节距 | 0.1 inch |
安装方式 | STRAIGHT |
触点数 | 14 |
PCB接触模式 | RECTANGULAR |
PCB触点行间距 | 0.3 mm |
端子节距 | 2.54 mm |
端接类型 | SOLDER |
ALC-314-MGT | ALC-314-MTT | ALC-314-LGT | ALC-314-LTT | ALC-314-NGG | ALC-314-NGT | ALC-314-LGG | |
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描述 | IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, | IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, | IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, | IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, | IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, | IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, | IC Socket, DIP14, 14 Contact(s), 2.54mm Term Pitch, 0.3inch Row Spacing, Solder, |
Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | LOW PROFILE | LOW PROFILE | LOW PROFILE | LOW PROFILE | LOW PROFILE | LOW PROFILE | LOW PROFILE |
主体深度 | 0.132 inch | 0.132 inch | 0.122 inch | 0.122 inch | 0.095 inch | 0.095 inch | 0.122 inch |
主体长度 | 0.65 inch | 0.65 inch | 0.65 inch | 0.65 inch | 0.65 inch | 0.65 inch | 0.65 inch |
联系完成配合 | GOLD (30) OVER NICKEL | TIN OVER COPPER/TIN OVER NICKEL | GOLD (30) OVER NICKEL | TIN OVER COPPER/TIN OVER NICKEL | GOLD (30) OVER NICKEL | GOLD (30) OVER NICKEL | GOLD (30) OVER NICKEL |
联系完成终止 | GOLD (30) OVER NICKEL | TIN OVER COPPER/TIN OVER NICKEL | GOLD (30) OVER NICKEL | TIN OVER COPPER/TIN OVER NICKEL | GOLD (30) OVER NICKEL | GOLD (30) OVER NICKEL | GOLD (30) OVER NICKEL |
触点材料 | BE-CU | BE-CU | BE-CU | BE-CU | BE-CU | BE-CU | BE-CU |
触点样式 | RND PIN-SKT | RND PIN-SKT | RND PIN-SKT | RND PIN-SKT | RND PIN-SKT | RND PIN-SKT | RND PIN-SKT |
目前评级 | 1 A | 1 A | 1 A | 1 A | 1 A | 1 A | 1 A |
设备插槽类型 | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET | IC SOCKET |
使用的设备类型 | DIP14 | DIP14 | DIP14 | DIP14 | DIP14 | DIP14 | DIP14 |
外壳材料 | BRASS | BRASS | BRASS | BRASS | BRASS | BRASS | BRASS |
插接触点节距 | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch | 0.1 inch |
安装方式 | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT | STRAIGHT |
触点数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
PCB接触模式 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
PCB触点行间距 | 0.3 mm | 0.3 mm | 0.3 mm | 0.3 mm | 0.3 mm | 0.3 mm | 0.3 mm |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端接类型 | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER | SOLDER |
Factory Lead Time | 2 weeks | 2 weeks | 2 weeks | - | 2 weeks | 2 weeks | 2 weeks |
JESD-609代码 | e4 | - | e4 | - | e4 | e4 | e4 |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - |
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