AC Plasma Driver, 32-Segment, BICMOS, CDIP40, CERAMIC, DIP-40
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | DIP, |
| Reach Compliance Code | unknow |
| ECCN代码 | EAR99 |
| 其他特性 | OPTEMP_MAX SPECIFIED AS TC |
| 数据输入模式 | SERIAL |
| 显示模式 | DOT MATRIX |
| 接口集成电路类型 | AC PLASMA DISPLAY DRIVER |
| JESD-30 代码 | R-CDIP-T40 |
| JESD-609代码 | e0 |
| 复用显示功能 | YES |
| 功能数量 | 1 |
| 区段数 | 32 |
| 端子数量 | 40 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 最大供电电压 | 13.2 V |
| 最小供电电压 | 10.8 V |
| 标称供电电压 | 12 V |
| 电源电压1-最大 | 100 V |
| 电源电压1-分钟 | |
| 电源电压1-Nom | 60 V |
| 表面贴装 | NO |
| 技术 | BICMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 最小 fmax | 8 MHz |
| SN55500EJ | SN75500AN | SN75500DN | SN55500EFJ | SNJ55500EJ | |
|---|---|---|---|---|---|
| 描述 | AC Plasma Driver, 32-Segment, BICMOS, CDIP40, CERAMIC, DIP-40 | AC Plasma Driver | AC Plasma Driver | AC Plasma Driver, 32-Segment, BICMOS, CQCC44, CERAMIC, PACKAGE-44 | AC Plasma Driver, 32-Segment, BICMOS, CDIP40, CERAMIC, DIP-40 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | DIP, | , | , | QCCJ, | DIP, |
| Reach Compliance Code | unknow | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 接口集成电路类型 | AC PLASMA DISPLAY DRIVER | AC PLASMA DISPLAY DRIVER | AC PLASMA DISPLAY DRIVER | AC PLASMA DISPLAY DRIVER | AC PLASMA DISPLAY DRIVER |
| 数据输入模式 | SERIAL | - | - | SERIAL | SERIAL |
| 显示模式 | DOT MATRIX | - | - | DOT MATRIX | DOT MATRIX |
| JESD-30 代码 | R-CDIP-T40 | - | - | S-CQCC-J44 | R-CDIP-T40 |
| JESD-609代码 | e0 | - | - | e0 | e0 |
| 复用显示功能 | YES | - | - | YES | YES |
| 功能数量 | 1 | - | - | 1 | 1 |
| 区段数 | 32 | - | - | 32 | 32 |
| 端子数量 | 40 | - | - | 44 | 40 |
| 最高工作温度 | 125 °C | - | - | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | - | - | QCCJ | DIP |
| 封装形状 | RECTANGULAR | - | - | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | - | - | CHIP CARRIER | IN-LINE |
| 最大供电电压 | 13.2 V | - | - | 13.2 V | 13.2 V |
| 最小供电电压 | 10.8 V | - | - | 10.8 V | 10.8 V |
| 标称供电电压 | 12 V | - | - | 12 V | 12 V |
| 电源电压1-最大 | 100 V | - | - | 100 V | 100 V |
| 电源电压1-Nom | 60 V | - | - | 60 V | 60 V |
| 表面贴装 | NO | - | - | YES | NO |
| 技术 | BICMOS | - | - | BICMOS | BICMOS |
| 温度等级 | MILITARY | - | - | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | - | - | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | - | - | J BEND | THROUGH-HOLE |
| 端子位置 | DUAL | - | - | QUAD | DUAL |
| 最小 fmax | 8 MHz | - | - | 8 MHz | 8 MHz |
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