DC-DC Regulated Power Supply Module, 1 Output, 75W, Hybrid, HALF-BRICK PACKAGE-9
| 参数名称 | 属性值 |
| 厂商名称 | API Technologies |
| 包装说明 | , |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 75 V |
| 最小输入电压 | 18 V |
| JESD-30 代码 | R-XDMA-X9 |
| 最大负载调整率 | 0.5% |
| 功能数量 | 1 |
| 输出次数 | 1 |
| 端子数量 | 9 |
| 最高工作温度 | 60 °C |
| 最低工作温度 | -40 °C |
| 标称输出电压 | 12 V |
| 封装主体材料 | UNSPECIFIED |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | HYBRID |
| 温度等级 | OTHER |
| 端子形式 | UNSPECIFIED |
| 端子位置 | DUAL |
| 最大总功率输出 | 75 W |
| 微调/可调输出 | YES |
| SC75A12-625-48 | SC75A14-300-48 | SC75A11-1500-48 | SC75A13-500-48 | SC75A17-1500-48 | |
|---|---|---|---|---|---|
| 描述 | DC-DC Regulated Power Supply Module, 1 Output, 75W, Hybrid, HALF-BRICK PACKAGE-9 | DC-DC Regulated Power Supply Module, 1 Output, 75W, Hybrid, HALF-BRICK PACKAGE-9 | DC-DC Regulated Power Supply Module, 1 Output, 75W, Hybrid, HALF-BRICK PACKAGE-9 | DC-DC Regulated Power Supply Module, 1 Output, 75W, Hybrid, HALF-BRICK PACKAGE-9 | DC-DC Regulated Power Supply Module, 1 Output, 75W, Hybrid, HALF-BRICK PACKAGE-9 |
| Reach Compliance Code | compli | compli | compli | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 模拟集成电路 - 其他类型 | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE | DC-DC REGULATED POWER SUPPLY MODULE |
| 最大输入电压 | 75 V | 75 V | 75 V | 75 V | 75 V |
| 最小输入电压 | 18 V | 18 V | 18 V | 18 V | 18 V |
| JESD-30 代码 | R-XDMA-X9 | R-XDMA-X9 | R-XDMA-X9 | R-XDMA-X9 | R-XDMA-X9 |
| 最大负载调整率 | 0.5% | 0.5% | 0.5% | 0.5% | 0.5% |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 输出次数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 9 | 9 | 9 | 9 | 9 |
| 最高工作温度 | 60 °C | 60 °C | 60 °C | 60 °C | 60 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出电压 | 12 V | 24 V | 5 V | 15 V | 3.3 V |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | NO | NO | NO | NO |
| 技术 | HYBRID | HYBRID | HYBRID | HYBRID | HYBRID |
| 温度等级 | OTHER | OTHER | OTHER | OTHER | OTHER |
| 端子形式 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 最大总功率输出 | 75 W | 75 W | 75 W | 75 W | 75 W |
| 微调/可调输出 | YES | YES | YES | YES | YES |
| 厂商名称 | API Technologies | - | - | API Technologies | API Technologies |
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