CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Maximum power dissipation, including load conditions, must be designed to maintain the maximum junction temperature below 175°C for the
can packages, and below 150°C for the plastic packages.
2.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
PARAMETER
INPUT CHARACTERISTICS
Offset Voltage
Average Offset Voltage Drift
Bias Current
Input Resistance
Input Noise Voltage
TRANSFER CHARACTERISTICS
Voltage Gain
(V
OUT
=
±10V)
V
SUPPLY
=
±12V
to
±15V,
R
S
= 50Ω, R
L
= 1kΩ, C
L
= 10pF, Unless Otherwise Specified
TEST
CONDITIONS
TEMP
(°C)
25
Full
Full
25
Full
Full
10Hz-1MHz
R
L
= 50Ω
R
L
= 100Ω
R
L
= 1kΩ
R
L
= 1kΩ
25
25
25
25
Full
25
25
R
L
= 100Ω
R
L
= 1kΩ, V
S
=
±15V
R
L
= 1kΩ, V
S
=
±12V
25
Full
Full
25
Full
V
IN
= 1V
RMS
, f = 10kHz
25
25
25
25
25
25
To 0.1%
25
HA-5002-2
MIN
-
-
-
-
-
1.5
-
-
-
-
0.980
-
-
±10
±10
±10
-
-
-
-
-
-
-
1.0
-
TYP
5
10
30
2
3.4
3
18
0.900
0.971
0.995
-
110
40
±10.7
±13.5
±10.5
220
3
<0.005
20.7
3.6
2
30
1.3
50
MAX
20
30
-
7
10
-
-
-
-
-
-
-
-
-
-
-
-
10
-
-
-
-
-
-
-
MIN
-
-
-
-
-
1.5
-
-
-
-
0.980
-
-
±10
±10
±10
-
-
-
-
-
-
-
1.0
-
HA-5002-5, -9
TYP
5
10
30
2
2.4
3
18
0.900
0.971
0.995
-
110
40
±11.2
±13.9
±10.5
220
3
<0.005
20.7
3.6
2
30
1.3
50
MAX
20
30
-
7
10
-
-
-
-
-
-
-
-
-
-
-
-
10
-
-
-
-
-
-
-
UNITS
mV
mV
µV/°C
µA
µA
MΩ
µV
P-P
V/V
V/V
V/V
V/V
MHz
A/mA
V
V
V
mA
Ω
%
MHz
ns
ns
%
V/ns
ns
-3dB Bandwidth
AC Current Gain
OUTPUT CHARACTERISTICS
Output Voltage Swing
V
IN
= 1V
P-P
Output Current
Output Resistance
Harmonic Distortion
TRANSIENT RESPONSE
Full Power Bandwidth (Note 3)
Rise Time
Propagation Delay
Overshoot
Slew Rate
Settling Time
V
IN
=
±10V,
R
L
= 40Ω
3
FN2921.11
March 8, 2006
HA-5002
Electrical Specifications
PARAMETER
Differential Gain
Differential Phase
POWER REQUIREMENTS
Supply Current
Power Supply Rejection Ratio
NOTE:
Slew Rate
3.
FPBW
=
--------------------------
; V = 10V
.
-
2πV P
EAK
P
A
V
= 10V
25
Full
Full
-
-
54
8.3
-
64
-
10
-
-
-
54
8.3
-
64
-
10
-
mA
mA
dB
V
SUPPLY
=
±12V
to
±15V,
R
S
= 50Ω, R
L
= 1kΩ, C
L
= 10pF, Unless Otherwise Specified
(Continued)
TEST
CONDITIONS
R
L
= 500Ω
R
L
= 500Ω
TEMP
(°C)
25
25
HA-5002-2
MIN
-
-
TYP
0.06
0.22
MAX
-
-
MIN
-
-
HA-5002-5, -9
TYP
0.06
0.22
MAX
-
-
UNITS
%
Degrees
Test Circuit and Waveforms
+15V
V
1
+
R
S
IN
V
1
-
-15V
V
2
-
OUT
V
2
+
R
L
FIGURE 1. LARGE AND SMALL SIGNAL RESPONSE
V
IN
V
IN
V
OUT
V
OUT
R
S
= 50Ω, R
L
= 100Ω
SMALL SIGNAL WAVEFORMS
R
S
= 50Ω, R
L
= 1kΩ
SMALL SIGNAL WAVEFORMS
4
FN2921.11
March 8, 2006
HA-5002
Test Circuit and Waveforms
(Continued)
V
IN
V
IN
V
OUT
V
OUT
R
S
= 50Ω, R
L
= 100Ω
LARGE SIGNAL WAVEFORMS
R
S
= 50Ω, R
L
= 1kΩ
LARGE SIGNAL WAVEFORMS
Schematic Diagram
V
1
+
R
8
Q
19
R
4
Q
25
R
10
Q
9
Q
10
R
5
Q
21
Q
11
Q
15
Q
23
Q
24
Q
17
Q
16
R
7
R
12
R
3
V
1
-
IN
Q
7
Q
4
Q
27
Q
6
R
11
OUT
R
N2
Q
5
Q
22
Q
8
R
6
Q
14
R
2
Q
13
R
N3
V
2
-
Q
2
Q
26
Q
20
Q
18
Q
3
Q
1
R
1
Q
12
V
2
+
R
9
R
N1
Application Information
Layout Considerations
The wide bandwidth of the HA-5002 necessitates that high
frequency circuit layout procedures be followed. Failure to
follow these guidelines can result in marginal performance.
Probably the most crucial of the RF/video layout rules is the
use of a ground plane. A ground plane provides isolation and
minimizes distributed circuit capacitance and inductance
which will degrade high frequency performance.
Other considerations are proper power supply bypassing
and keeping the input and output connections as short as
possible which minimizes distributed capacitance and
reduces board space.
Power Supply Decoupling
For optimal device performance, it is recommended that the
positive and negative power supplies be bypassed with
capacitors to ground. Ceramic capacitors ranging in value
from 0.01 to 0.1µF will minimize high frequency variations in
supply voltage, while low frequency bypassing requires
当今的计算机外部设备，都在追求高速度和高通用性。为了满足用户的需求，以Intel为首的七家公司于1994年推出了USB（Universal Serial Bus，通用串行总线）总线协议，专用于低、中速的计算机外设。目前，USB端口已成为微机主板的标准端口；而在不久的将来，所有的微机外设，包括键盘、鼠标、显示器、打印机、数字相机、扫描仪和游戏柄等等，都将通过USB与主机相连。
...[详细]
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