DRIVER
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Renesas(瑞萨电子) |
包装说明 | DIP, DIP20,.3 |
Reach Compliance Code | _compli |
系列 | HCT |
JESD-30 代码 | R-PDIP-T20 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | BUS DRIVER |
最大I(ol) | 0.006 A |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 20 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP20,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5 V |
Prop。Delay @ Nom-Su | 51 ns |
传播延迟(tpd) | 57 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
CD74HCT533E | CD74HC533E | CD74HC563E | CD74HCT563E | CD74HCT563M | |
---|---|---|---|---|---|
描述 | DRIVER | DRIVER | HC/UH SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20 | HCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20 | DRIVER |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | DIP, DIP20,.3 | SOP, SOP20,.4 |
Reach Compliance Code | _compli | not_compliant | not_compliant | not_compliant | not_compliant |
系列 | HCT | HC/UH | HC/UH | HCT | HCT |
JESD-30 代码 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
最大I(ol) | 0.006 A | 0.006 A | 0.006 A | 0.006 A | 0.006 A |
位数 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 20 | 20 | 20 | 20 | 20 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | DIP | SOP |
封装等效代码 | DIP20,.3 | DIP20,.3 | DIP20,.3 | DIP20,.3 | SOP20,.4 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE |
电源 | 5 V | 2/6 V | 2/6 V | 5 V | 5 V |
传播延迟(tpd) | 57 ns | 265 ns | 250 ns | 53 ns | 53 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 6 V | 6 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 2 V | 2 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 4.5 V | 4.5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
Prop。Delay @ Nom-Sup | - | 50 ns | 45 ns | 45 ns | 45 ns |
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