Bus Driver, CBT/FST/QS/5C/B Series, 4-Func, 10-Bit, True Output, CMOS, PBGA96, 5.50 X 13.50 MM, LFBGA-96
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Pericom Semiconductor Corporation (Diodes Incorporated) |
| 零件包装代码 | BGA |
| 包装说明 | LFBGA, |
| 针数 | 96 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 系列 | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-PBGA-B96 |
| JESD-609代码 | e1 |
| 长度 | 13.5 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 湿度敏感等级 | 3 |
| 位数 | 10 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 96 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 5.5 mm |
| PI5C34EX2484NEX | 206-125ESP | PI5C34X2484NX | PI5C34EX484NEX | |
|---|---|---|---|---|
| 描述 | Bus Driver, CBT/FST/QS/5C/B Series, 4-Func, 10-Bit, True Output, CMOS, PBGA96, 5.50 X 13.50 MM, LFBGA-96 | Multifunctional Through Hole Through Hole | Bus Driver, CBT/FST/QS/5C/B Series, 4-Func, 10-Bit, True Output, CMOS, PBGA96, 5.50 X 13.50 MM, LFBGA-96 | Bus Driver, CBT/FST/QS/5C/B Series, 4-Func, 10-Bit, True Output, CMOS, PBGA96, 5.50 X 13.50 MM, LFBGA-96 |
| 是否无铅 | 不含铅 | - | 含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | 不符合 | 符合 |
| 厂商名称 | Pericom Semiconductor Corporation (Diodes Incorporated) | - | Pericom Semiconductor Corporation (Diodes Incorporated) | Pericom Semiconductor Corporation (Diodes Incorporated) |
| 零件包装代码 | BGA | - | BGA | BGA |
| 包装说明 | LFBGA, | - | LFBGA, | LFBGA, |
| 针数 | 96 | - | 96 | 96 |
| Reach Compliance Code | compli | - | compliant | compliant |
| ECCN代码 | EAR99 | - | EAR99 | EAR99 |
| 系列 | CBT/FST/QS/5C/B | - | CBT/FST/QS/5C/B | CBT/FST/QS/5C/B |
| JESD-30 代码 | R-PBGA-B96 | - | R-PBGA-B96 | R-PBGA-B96 |
| JESD-609代码 | e1 | - | e0 | e1 |
| 长度 | 13.5 mm | - | 13.5 mm | 13.5 mm |
| 逻辑集成电路类型 | BUS DRIVER | - | BUS DRIVER | BUS DRIVER |
| 位数 | 10 | - | 10 | 10 |
| 功能数量 | 4 | - | 4 | 4 |
| 端口数量 | 2 | - | 2 | 2 |
| 端子数量 | 96 | - | 96 | 96 |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C |
| 输出特性 | 3-STATE WITH SERIES RESISTOR | - | 3-STATE WITH SERIES RESISTOR | 3-STATE |
| 输出极性 | TRUE | - | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | - | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度（摄氏度） | 260 | - | 240 | 260 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | - | 1.4 mm | 1.4 mm |
| 最大供电电压 (Vsup) | 5.25 V | - | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | - | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | - | YES | YES |
| 技术 | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN SILVER COPPER | - | TIN LEAD | TIN SILVER COPPER |
| 端子形式 | BALL | - | BALL | BALL |
| 端子节距 | 0.8 mm | - | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | - | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 | - | NOT SPECIFIED | 40 |
| 宽度 | 5.5 mm | - | 5.5 mm | 5.5 mm |
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