160W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24, PLASTIC, SOT566-3, HSOP-24
参数名称 | 属性值 |
厂商名称 | NXP(恩智浦) |
包装说明 | PLASTIC, SOT566-3, HSOP-24 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
标称带宽 | 20 kHz |
商用集成电路类型 | AUDIO AMPLIFIER |
增益 | 27 dB |
谐波失真 | 10% |
JESD-30 代码 | R-PDSO-G24 |
长度 | 15.9 mm |
信道数量 | 2 |
功能数量 | 1 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
标称输出功率 | 160 W |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
座面最大高度 | 3.5 mm |
最大供电电压 (Vsup) | 29 V |
最小供电电压 (Vsup) | 14 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | GULL WING |
端子节距 | 1 mm |
端子位置 | DUAL |
宽度 | 11 mm |
935289143118 | 935278835518 | TDF8590TH/N1,118 | TDF8590TH/N1S,118 | 935298692118 | |
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描述 | 160W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24, PLASTIC, SOT566-3, HSOP-24 | 160W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24, PLASTIC, SOT566-3, HSOP-24 | IC AMP AUDIO PWR 160W D 24HSOP | IC PWR AMP AUDIO CLASS D 24HSOP | 160W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO24 |
包装说明 | PLASTIC, SOT566-3, HSOP-24 | PLASTIC, SOT566-3, HSOP-24 | SSOP, SOP24,.56,40 | PLASTIC, SOT566-3, HSOP-24 | PLASTIC, SOT566-3, HSOP-24 |
Reach Compliance Code | unknow | unknow | unknown | unknown | unknown |
标称带宽 | 20 kHz | 20 kHz | 20 kHz | 20 kHz | 20 kHz |
商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
增益 | 27 dB | 27 dB | 27 dB | 27 dB | 27 dB |
谐波失真 | 10% | 10% | 10% | 10% | 10% |
JESD-30 代码 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
长度 | 15.9 mm | 15.9 mm | 15.9 mm | 15.9 mm | 15.9 mm |
信道数量 | 2 | 2 | 2 | 2 | 2 |
功能数量 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
标称输出功率 | 160 W | 160 W | 160 W | 160 W | 160 W |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HSSOP | HSSOP | SSOP | SSOP | HSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH |
座面最大高度 | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm | 3.5 mm |
最大供电电压 (Vsup) | 29 V | 29 V | 29 V | 29 V | 29 V |
最小供电电压 (Vsup) | 14 V | 14 V | 14 V | 14 V | 14 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm |
厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) |
ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
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