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M58WT064KB70ZAQ6E

产品描述Flash, 4MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88
产品类别存储    存储   
文件大小2MB,共117页
制造商Numonyx ( Micron )
官网地址https://www.micron.com
标准  
下载文档 详细参数 选型对比 全文预览

M58WT064KB70ZAQ6E概述

Flash, 4MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88

M58WT064KB70ZAQ6E规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Numonyx ( Micron )
零件包装代码BGA
包装说明TFBGA, BGA88,8X12,32
针数88
Reach Compliance Codeunknow
ECCN代码EAR99
最长访问时间70 ns
其他特性SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
启动块BOTTOM
命令用户界面YES
通用闪存接口YES
数据轮询NO
JESD-30 代码R-PBGA-B88
长度10 mm
内存密度67108864 bi
内存集成电路类型FLASH
内存宽度16
功能数量1
部门数/规模8,127
端子数量88
字数4194304 words
字数代码4000000
工作模式ASYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织4MX16
封装主体材料PLASTIC/EPOXY
封装代码TFBGA
封装等效代码BGA88,8X12,32
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE, FINE PITCH
页面大小4 words
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源1.8,3 V
编程电压1.8 V
认证状态Not Qualified
座面最大高度1.2 mm
部门规模4K,32K
最大待机电流0.00005 A
最大压摆率0.07 mA
最大供电电压 (Vsup)2 V
最小供电电压 (Vsup)1.7 V
标称供电电压 (Vsup)1.8 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
切换位NO
类型NOR TYPE
宽度8 mm

文档预览

下载PDF文档
M58WT032KT M58WT064KT
M58WT032KB M58WT064KB
32- and 64-Mbit (×16, multiple bank, burst)
1.8 V core, 3.0 V I/O supply Flash memories
Features
Supply voltage
– V
DD
= 1.7 V to 2 V for program, erase and
read
– V
DDQ
= 2.7 V to 3.3 V for I/O buffers
– V
PP
= 9 V for fast program
Synchronous/asynchronous read
– Synchronous burst read mode: 52 MHz
– Asynchronous/synchronous page read
mode
– Random access times: 70 ns
Synchronous burst read suspend
Programming time
– 10 µs by word typical for fast factory
program
– Double/quadruple word program option
– Enhanced factory program options
Memory blocks
– Multiple bank memory array: 4 Mbit banks
– Parameter blocks (top or bottom location)
Dual operations
– Program erase in one bank while read in
others
– No delay between read and write
operations
Block locking
– All blocks locked at power-up
– Any combination of blocks can be locked
– WP for block lock-down
FBGA
TFBGA88 (ZAQ)
8 × 10 mm
Security
– 128-bit user programmable OTP cells
– 64-bit unique device number
Common Flash interface (CFI)
100 000 program/erase cycles per block
Electronic signature
– Manufacturer code: 20h
– Device codes:
M58WT032KT (top): 8866h
M58WT032KB (bottom): 8867h
– M58WT064KT (top): 8810h
M58WT064KB (bottom): 8811h
ECOPACK® package available
March 2008
Rev 2
1/117
www.numonyx.com
1

M58WT064KB70ZAQ6E相似产品对比

M58WT064KB70ZAQ6E M58WT032KT70ZAQ6E M58WT064KT70ZAQ6F M58WT032KB70ZAQ6F M58WT032KT70ZAQ6F M58WT032KB70ZAQ6E M58WT064KB70ZAQ6F
描述 Flash, 4MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 Flash, 2MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 Flash, 4MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 Flash, 2MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 Flash, 2MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 Flash, 2MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 Flash, 4MX16, 70ns, PBGA88, 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88
是否无铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
厂商名称 Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron ) Numonyx ( Micron )
零件包装代码 BGA BGA BGA BGA BGA BGA BGA
包装说明 TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 TFBGA, BGA88,8X12,32 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 TFBGA, BGA88,8X12,32 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 TFBGA, BGA88,8X12,32
针数 88 88 88 88 88 88 88
Reach Compliance Code unknow unknown unknown unknown unknown unknow unknow
ECCN代码 EAR99 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A 3A991.B.1.A
最长访问时间 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns 70 ns
其他特性 SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
启动块 BOTTOM TOP TOP BOTTOM TOP BOTTOM BOTTOM
命令用户界面 YES YES YES YES YES YES YES
通用闪存接口 YES YES YES YES YES YES YES
数据轮询 NO NO NO NO NO NO NO
JESD-30 代码 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88 R-PBGA-B88
长度 10 mm 10 mm 10 mm 10 mm 10 mm 10 mm 10 mm
内存密度 67108864 bi 33554432 bit 67108864 bit 33554432 bit 33554432 bit 33554432 bi 67108864 bi
内存集成电路类型 FLASH FLASH FLASH FLASH FLASH FLASH FLASH
内存宽度 16 16 16 16 16 16 16
功能数量 1 1 1 1 1 1 1
部门数/规模 8,127 8,63 8,127 8,63 8,63 8,63 8,127
端子数量 88 88 88 88 88 88 88
字数 4194304 words 2097152 words 4194304 words 2097152 words 2097152 words 2097152 words 4194304 words
字数代码 4000000 2000000 4000000 2000000 2000000 2000000 4000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
组织 4MX16 2MX16 4MX16 2MX16 2MX16 2MX16 4MX16
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA TFBGA
封装等效代码 BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32 BGA88,8X12,32
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
页面大小 4 words 4 words 4 words 4 words 4 words 4 words 4 words
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 1.8,3 V 1.8,3 V 1.8,3 V 1.8,3 V 1.8,3 V 1.8,3 V 1.8,3 V
编程电压 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
部门规模 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K 4K,32K
最大待机电流 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A 0.00005 A
最大压摆率 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA 0.07 mA
最大供电电压 (Vsup) 2 V 2 V 2 V 2 V 2 V 2 V 2 V
最小供电电压 (Vsup) 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V 1.7 V
标称供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V 1.8 V
表面贴装 YES YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL BALL BALL BALL BALL BALL
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
切换位 NO NO NO NO NO NO NO
类型 NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE NOR TYPE
宽度 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm 8 mm
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