0.5 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | TelCom Semiconductor, Inc. (Microchip Technology) |
| 包装说明 | SOP, SOP16,.4 |
| Reach Compliance Code | unknow |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION |
| 最大输入电压 | 18 V |
| 最小输入电压 | 8 V |
| 标称输入电压 | 16 V |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 最大输出电流 | 0.5 A |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP16,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 最大供电电流 (Isup) | 2.5 mA |
| 表面贴装 | YES |
| 切换器配置 | PUSH-PULL |
| 最大切换频率 | 500 kHz |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| TC28C46EOE | TC38C46 | TC38C46COE | TC28C46EPE | TC28C46 | TC18C46-1 | TC18C46MJE | |
|---|---|---|---|---|---|---|---|
| 描述 | 0.5 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO16 | 0.5 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO16 | 0.5 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO16 | 0.5 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO16 | 0.5 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO16 | 0.5 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO16 | 0.5 A SWITCHING CONTROLLER, 500 kHz SWITCHING FREQ-MAX, PDSO16 |
| 是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | - | - | 不符合 |
| 厂商名称 | TelCom Semiconductor, Inc. (Microchip Technology) | - | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | - | - | TelCom Semiconductor, Inc. (Microchip Technology) |
| 包装说明 | SOP, SOP16,.4 | - | SOP, SOP16,.4 | DIP, DIP16,.3 | - | - | DIP, DIP16,.3 |
| Reach Compliance Code | unknow | - | unknow | unknow | - | - | unknow |
| 模拟集成电路 - 其他类型 | SWITCHING CONTROLLER | - | SWITCHING CONTROLLER | SWITCHING CONTROLLER | - | - | SWITCHING CONTROLLER |
| 控制模式 | CURRENT-MODE | - | CURRENT-MODE | CURRENT-MODE | - | - | CURRENT-MODE |
| 控制技术 | PULSE WIDTH MODULATION | - | PULSE WIDTH MODULATION | PULSE WIDTH MODULATION | - | - | PULSE WIDTH MODULATION |
| 最大输入电压 | 18 V | - | 18 V | 18 V | - | - | 18 V |
| 最小输入电压 | 8 V | - | 8 V | 8 V | - | - | 8 V |
| 标称输入电压 | 16 V | - | 16 V | 16 V | - | - | 16 V |
| JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDIP-T16 | - | - | R-GDIP-T16 |
| JESD-609代码 | e0 | - | e0 | e0 | - | - | e0 |
| 功能数量 | 1 | - | 1 | 1 | - | - | 1 |
| 端子数量 | 16 | - | 16 | 16 | - | - | 16 |
| 最高工作温度 | 85 °C | - | 70 °C | 85 °C | - | - | 125 °C |
| 最大输出电流 | 0.5 A | - | 0.5 A | 0.5 A | - | - | 0.5 A |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | CERAMIC, GLASS-SEALED |
| 封装代码 | SOP | - | SOP | DIP | - | - | DIP |
| 封装等效代码 | SOP16,.4 | - | SOP16,.4 | DIP16,.3 | - | - | DIP16,.3 |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | - | - | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | - | SMALL OUTLINE | IN-LINE | - | - | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | - | - | Not Qualified |
| 最大供电电流 (Isup) | 2.5 mA | - | 2 mA | 2.5 mA | - | - | 2.5 mA |
| 表面贴装 | YES | - | YES | NO | - | - | NO |
| 切换器配置 | PUSH-PULL | - | PUSH-PULL | PUSH-PULL | - | - | PUSH-PULL |
| 最大切换频率 | 500 kHz | - | 500 kHz | 500 kHz | - | - | 500 kHz |
| 技术 | CMOS | - | CMOS | CMOS | - | - | CMOS |
| 温度等级 | INDUSTRIAL | - | COMMERCIAL | INDUSTRIAL | - | - | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | - | GULL WING | THROUGH-HOLE | - | - | THROUGH-HOLE |
| 端子节距 | 1.27 mm | - | 1.27 mm | 2.54 mm | - | - | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | - | - | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
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