Video DRAM, 256KX4, 100ns, CMOS, CDIP28, 0.400 INCH, CERAMIC, DIP-28
| 参数名称 | 属性值 |
| 厂商名称 | Micross |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 28 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 访问模式 | FAST PAGE |
| 最长访问时间 | 100 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 代码 | R-CDIP-T28 |
| JESD-609代码 | e4 |
| 长度 | 35.687 mm |
| 内存密度 | 1048576 bi |
| 内存集成电路类型 | VIDEO DRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 28 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 256KX4 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 4.445 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | PALLADIUM GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 10.16 mm |
| SMJ44C251B-10JDM883C | SMJ44C251B-10HMM883C | SMJ44C251B-12HMM883C | SMJ44C251B-10HJM883C | SMJ44C251B-12JDM883C | SMJ44C251B-10SVM883C | SMJ44C251B-12HJM883C | SMJ44C251B-12SVM883C | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Video DRAM, 256KX4, 100ns, CMOS, CDIP28, 0.400 INCH, CERAMIC, DIP-28 | Video DRAM, 256KX4, 100ns, CMOS, CDSO28, CERAMIC, LCC-28 | Video DRAM, 256KX4, 120ns, CMOS, CDSO28, CERAMIC, LCC-28 | Video DRAM, 256KX4, 100ns, CMOS, CDSO28, CERAMIC, LCC-28 | Video DRAM, 256KX4, 120ns, CMOS, CDIP28, 0.400 INCH, CERAMIC, DIP-28 | Video DRAM, 256KX4, 100ns, CMOS, CZIP28, CERAMIC, ZIP-28 | Video DRAM, 256KX4, 120ns, CMOS, CDSO28, CERAMIC, LCC-28 | Video DRAM, 256KX4, 120ns, CMOS, CZIP28, CERAMIC, ZIP-28 |
| 零件包装代码 | DIP | DLCC | DLCC | DLCC | DIP | ZIP | DLCC | ZIP |
| 包装说明 | DIP, | SON, | SON, | SON, | DIP, | ZIP, | SON, | ZIP, |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compli | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE | FAST PAGE |
| 最长访问时间 | 100 ns | 100 ns | 120 ns | 100 ns | 120 ns | 100 ns | 120 ns | 120 ns |
| 其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
| JESD-30 代码 | R-CDIP-T28 | R-CDSO-N28 | R-CDSO-N28 | R-CDSO-N28 | R-CDIP-T28 | R-CZIP-T28 | R-CDSO-N28 | R-CZIP-T28 |
| 长度 | 35.687 mm | 18.29 mm | 18.29 mm | 18.29 mm | 35.687 mm | 36.83 mm | 18.29 mm | 36.83 mm |
| 内存密度 | 1048576 bi | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| 内存集成电路类型 | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM | VIDEO DRAM |
| 内存宽度 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | SON | SON | SON | DIP | ZIP | SON | ZIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 4.445 mm | 2.54 mm | 2.54 mm | 2.54 mm | 4.445 mm | 13.08 mm | 2.54 mm | 13.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | ZIG-ZAG |
| 宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 2.92 mm | 10.16 mm | 2.92 mm |
| 厂商名称 | Micross | - | - | - | Micross | Micross | Micross | Micross |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - | e4 | - |
| 端子面层 | PALLADIUM GOLD | PALLADIUM GOLD | PALLADIUM GOLD | PALLADIUM GOLD | PALLADIUM GOLD | - | PALLADIUM GOLD | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
