3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CDIP8
参数名称 | 属性值 |
功能数量 | 2 |
端子数量 | 8 |
最小工作温度 | -55 Cel |
最大工作温度 | 125 Cel |
加工封装描述 | CERDIP-8 |
状态 | Transferred |
接口类型 | BUFFER OR INVERTER BASED MOSFET DRIVER |
高端驱动器 | NO |
输入特性 | SCHMITT TRIGGER |
jesd_30_code | R-GDIP-T8 |
输出特性 | TOTEM-POLE |
额定输出峰值电流限制 | 3 A |
输出极性 | TRUE AND INVERTED |
包装材料 | CERAMIC, GLASS-SEALED |
ckage_code | DIP |
ckage_equivalence_code | DIP8,.3 |
包装形状 | RECTANGULAR |
包装尺寸 | IN-LINE |
wer_supplies__v_ | 4.5/18 |
qualification_status | COMMERCIAL |
sub_category | MOSFET Drivers |
表面贴装 | NO |
工艺 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子间距 | 2.54 mm |
端子位置 | DUAL |
urn_off_time | 0.1000 µs |
urn_on_time | 0.1000 µs |
TC4423 | TC4423MJA | TC4423EPA | TC4423EOE | TC4423CPA | |
---|---|---|---|---|---|
描述 | 3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CDIP8 | 3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CDIP8 | 3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CDIP8 | 3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, CDIP8 | 3 A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDIP8 |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 | 16 | 8 |
输入特性 | SCHMITT TRIGGER | SCHMITT TRIGGER | SCHMITT TRIGGER | SCHMITT TRIGGER | SCHMITT TRIGGER |
输出特性 | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE | TOTEM-POLE |
输出极性 | TRUE AND INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
表面贴装 | NO | NO | NO | YES | NO |
温度等级 | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | - | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) | TelCom Semiconductor, Inc. (Microchip Technology) |
包装说明 | - | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP16,.4 | DIP, DIP8,.3 |
Reach Compliance Code | - | unknow | unknow | unknow | unknow |
高边驱动器 | - | NO | NO | NO | NO |
接口集成电路类型 | - | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
JESD-30 代码 | - | R-GDIP-T8 | R-PDIP-T8 | R-PDSO-G16 | R-PDIP-T8 |
JESD-609代码 | - | e0 | e0 | e0 | e0 |
最高工作温度 | - | 125 °C | 85 °C | 85 °C | 70 °C |
最低工作温度 | - | -55 °C | -40 °C | -40 °C | - |
标称输出峰值电流 | - | 3 A | 3 A | 3 A | 3 A |
封装主体材料 | - | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | DIP | DIP | SOP | DIP |
封装等效代码 | - | DIP8,.3 | DIP8,.3 | SOP16,.4 | DIP8,.3 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | - | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
技术 | - | CMOS | CMOS | CMOS | CMOS |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子节距 | - | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
断开时间 | - | 0.1 µs | 0.1 µs | 0.1 µs | 0.1 µs |
接通时间 | - | 0.1 µs | 0.1 µs | 0.1 µs | 0.1 µs |
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