Voltages ...........................................–0.3V to V
CC
+ 0.3V
Operating Junction Temperature Range .. –40°C to 125°C
Maximum Junction Temperature ......................... 125°C
Storage Temperature Range .................. –65°C to 150°C
Peak Reflow Temperature ..................................... 260°C
pin conFiguraTion
TOP VIEW
NTCBIAS 1
NTC 2
ADJ 3
HBO 4
9
8
7
6
5
V
CC
DRV
LBO
GND
TOP VIEW
NTCBIAS
NTC
ADJ
HBO
1
2
3
4
9
8
7
6
5
V
CC
DRV
LBO
GND
MS8E PACKAGE
8-LEAD PLASTIC MSOP
T
JMAX
= 125°C,
q
JA
= 40°C/W
EXPOSED PAD (PIN 9) IS NOT INTERNALLY CONNECTED,
MUST BE SOLDERED TO PCB, GND TO OBTAIN
q
JA
DDB PACKAGE
8-LEAD (3mm
×
2mm) PLASTIC DFN
T
JMAX
= 125°C,
q
JA
= 76°C/W
EXPOSED PAD (PIN 9) IS NOT INTERNALLY CONNECTED,
MUST BE SOLDERED TO PCB, GND TO OBTAIN
q
JA
orDer inForMaTion
LEAD FREE FINISH
LTC4070EDDB#PBF
LTC4070IDDB#PBF
LTC4070EMS8E#PBF
LTC4070IMS8E#PBF
TAPE AND REEL
LTC4070EDDB#TRPBF
LTC4070IDDB#TRPBF
LTC4070EMS8E#TRPBF
LTC4070IMS8E#TRPBF
PART MARKING*
LFPD
LFPD
LTFMT
LTFMT
PACKAGE DESCRIPTION
8-Lead (3mm × 2mm) Plastic DFN
8-Lead (3mm × 2mm) Plastic DFN
8-Lead Plastic MSOP
8-Lead Plastic MSOP
TEMPERATURE RANGE
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
–40°C to 125°C
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
Consult LTC Marketing for information on non-standard lead based finish parts.
For more information on lead free part marking, go to:
http://www.linear.com/leadfree/
For more information on tape and reel specifications, go to:
http://www.linear.com/tapeandreel/
The
l
denotes the specifications which apply over the full operating
junction temperature range. V
NTC
= V
CC
, T
A
= 25°C unless otherwise specified. Current into a pin is positive and current out of a pin is
negative. All voltages are referenced to GND unless otherwise noted. (Note 2)
SYMBOL
V
FLOAT
I
CCMAX
I
CCQ
I
CCQLB
PARAMETER
Programmable Float Voltage
10µA ≤ I
CC
≤ 50mA
Maximum Shunt Current
V
CC
Operating Current
Low Bat V
CC
Operating Current
CONDITIONS
V
ADJ
= 0V
V
ADJ
= Float
V
ADJ
= V
CC
V
CC
> V
FLOAT
V
HBO
Low
V
CC
= 3.1V
l
l
l
l
l
elecTrical characTerisTics
MIN
3.96
4.06
4.16
50
TYP
4.0
4.1
4.2
450
300
MAX
4.04
4.14
4.24
1040
UNITS
V
V
V
mA
nA
nA
4070fc
2
LTC4070
elecTrical characTerisTics
SYMBOL
V
HBTH
V
HBHY
V
LBTH
V
LBHY
V
OL
V
OH
PARAMETER
HBO Threshold (V
FLOAT
– V
CC
)
Hysteresis
LBO Threshold
Hysteresis
CMOS Output Low
CMOS Output High
I
SINK
= 1mA, V
CC
= 3.7V
V
LBO
: V
CC
= 3.1V, I
SOURCE
= –100µA
V
HBO
: I
CC
= 1.5mA, I
SOURCE
= –500µA
Input Logic Low Level
Input Logic High Level
I
ADJ(Z)
NTC
I
NTC
I
NTCBIAS
∆V
FLOAT(NTC)
NTC Leakage Current
Average NTCBIAS Sink Current
Delta Float Voltage per NTC Comparator
Step
0V< NTC < V
CC
Pulsed Duty Cycle < 0.002%
I
CC
= 1mA, NTC Falling Below One of the
NTC
TH
Thresholds
ADJ = 0V
ADJ = Float
ADJ = V
CC
V
NTC
as % of V
NTCBIAS
Amplitude
35.5
28.0
21.8
16.8
Hysteresis
DRV Output Source Current
DRV Output Sink Current
V
CC
= 3.1V, V
DRV
= 0V
I
CC
= 1mA, R
DRV
= 475k (Note 3)
–50
0
30
50
nA
pA
Allowable ADJ Leakage Current in
Floating State
l
l
The
l
denotes the specifications which apply over the full operating
junction temperature range. V
NTC
= V
CC
, T
A
= 25°C unless otherwise specified. Current into a pin is positive and current out of a pin is
negative. All voltages are referenced to GND unless otherwise noted. (Note 2)
CONDITIONS
V
CC
Rising
l
MIN
15
TYP
40
100
MAX
60
UNITS
mV
mV
High Battery Status
Low Battery Status
V
CC
Falling
l
3.08
220
3.2
290
3.34
350
0.5
V
mV
V
V
Status Outputs HBO/LBO
V
CC
– 0.6
3-State Selection Input: ADJ
V
ADJ
ADJ Input Level
l
l
l
0.3
V
CC
– 0.3
±3
V
V
µA
–50
–75
–100
36.5
29.0
22.8
17.8
30
–1
3
37.5
30.0
23.8
18.8
mV
mV
mV
%
%
%
%
mV
mA
µA
NTC
TH1
NTC
TH2
NTC
TH3
NTC
TH4
NTC
HY
Drive Output
I
DRV(SOURCE)
I
DRV(SINK)
NTC Comparator Falling Thresholds
Note 1:
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2:
The LTC4070 is tested under pulsed load conditions such that
T
J
≈ T
A
. The LTC4070E is guaranteed to meet performance specifications
for junction temperatures from 0°C to 85°C. Specifications over the
–40°C to 125°C operating junction temperature range are assured by
design, characterization and correlation with statistical process controls.
The LTC4070I is guaranteed over the full –40°C to 125°C operating
junction temperature range. Note that the maximum ambient temperature
consistent with these specifications is determined by specific operating
conditions in conjunction with board layout, the rated package thermal
resistance and other environmental factors.
Note 3:
The I
DRV(SNK)
current is tested by pulling the DRV pin up to V
CC
through a 475k resistor, R
DRV
. Pulling the DRV pin up to V
CC
with low
impedance disables the regulator.
4070fc
3
LTC4070
Typical perForMance characTerisTics
Battery Discharge I
CC
vs V
CC
1000
900
800
700
I
CC
(nA)
600
500
400
300
200
100
0
0
T
A
= 25°C, unless otherwise noted.
Load Regulation
DV
FLOAT
vs I
CC
10
9
8
7
∆V
FLOAT
(mV)
V
FLOAT
(V)
6
5
4
3
4.30
4.25
4.20
4.15
4.10
4.05
4.00
3.95
0
V
FLOAT
vs Temperature, I
CC
= 1mA
NO NTC
ADJ = V
CC
ADJ = GND
ADJ = FLOAT
FALLING
RISING
ADJ = GND
2
1
1
2
V
CC
(V)
3
4
4070 G01
0
10
20
30
40
I
CC
(mA)
50
60
4070 G02
3.90
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
4070 G03
I
CCQ
vs Temperature (ADJ = V
CC
)
1000
900
800
700
V
HBTH
(mV)
I
CCQ
(nA)
600
500
400
300
200
100
0
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
100
90
80
70
V
HBTH
V
CC
Rising vs Temperature
(ADJ = V
CC
)
300
250
200
V
HBHY
(mV)
–25
150
100
50
V
HBHY
vs Temperature
(ADJ = V
CC
)
60
50
40
30
20
10
0
–50
0
25
50
75
TEMPERATURE (°C)
100
125
0
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
4070 G04
4070 G05
4070 G06
V
FLOAT
vs NTC Temperature,
I
CC
= 1mA
4.3
4.2
4.1
V
FLOAT
(V)
4.0
3.9
3.8
3.7
ADJ = V
CC
ADJ = FLOAT
ADJ = GND
V
LBTH
(V)
3.250
3.245
3.240
3.235
V
LBTH
V
CC
Falling vs Temperature
320
300
280
V
LBHY
(V)
260
240
220
V
LBHY
vs Temperature
ADJ = V
CC
ADJ = FLOAT
3.230
3.225
3.220
3.215
3.210
3.205
ADJ = GND
ADJ = V
CC
ADJ = GND
ADJ = FLOAT
0
20
40
60
TEMPERATURE (°C)
80
100
4070 G07
3.200
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
200
–50
–25
0
25
50
75
TEMPERATURE (°C)
100
125
4070 G08
4070 G09
4070fc
4
LTC4070
Typical perForMance characTerisTics
V
OH
LBO/HBO vs I
SOURCE
2.5
2.5
T
A
= 25°C, unless otherwise noted.
V
OL
LBO/HBO vs I
SINK
V
CC
= 3.7V
2.0
V
CC
– V
OH
(V)
LBO
V
CC
= 3.1V
V
OL
(V)
HBO
V
CC
= V
F
– 25m
2.0
1.5
1.5
1.0
1.0
0.5
0.5
0
0
0.5
2.0
1.0
1.5
I
SOURCE
(mA)
2.5
3.0
4070 G10
0
0
2
6
4
I
SINK
(mA)
8
10
4070 G11
Power Spectral Density
35
30
25
20
15
10
5
0
0
Hot Plug Transient, C
C
= 330µF
,
R
IN
= 81Ω
CH4 = I
IN
(10mA/DIV)
CH1 = V
IN
(2V/DIV)
Step Response with 800mAHr
Battery, R
IN
= 81Ω
C
C
= 10µF I
CC
= 1mA, 1Hz Res
,
Bandwidth, Noise = 1.0452mV
RMS
from 10Hz to 100kHz
CH4 = I
IN
(10mA/DIV)
CH1 = V
IN
(2V/DIV)
PSD (µV
RMS
/√Hz)
CH2 = V
CC
(2V/DIV)
CH3 = V
HBO
(2V/DIV)
CH2 = V
CC
(2V/DIV)
CH3 = V
HBO
(2V/DIV)
1
10
100 1000 10000 100000
FREQUENCY (Hz)
4070 G12
4ms/DIV
4070 G13
400ns/DIV
4070 G14
pin FuncTions
NTCBIAS (Pin 1):
NTC Bias Pin. Connect a resistor from
NTCBIAS to NTC, and a thermistor from NTC to GND. Float
NTCBIAS when not in use. Minimize parasitic capacitance
on this pin.
NTC (Pin 2):
Input to the Negative Temperature Coefficient
Thermistor Monitoring Circuit. The NTC pin connects to
a negative temperature coefficient thermistor which is
typically co-packaged with the battery to determine the
temperature of the battery. If the battery temperature is too
high, the float voltage is reduced. Connect a low drift bias
resistor from NTCBIAS to NTC and a thermistor from NTC
to GND. When not in use, connect NTC to V
CC
. Minimize
parasitic capacitance on this pin.
ADJ (Pin 3):
Float Voltage Adjust Pin. Connect ADJ to GND
to program 4.0V float voltage. Disconnect ADJ to program
4.1V float voltage. Connect ADJ to V
CC
to program 4.2V
float voltage. The float voltage is also adjusted by the NTC
嵌入式系统
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