LTC2250 - 10-Bit, 105Msps Low Noise 3V ADCs; Package: QFN; Pins: 32; Temperature Range: -40°C to 85°C
参数名称 | 属性值 |
Brand Name | Linear Technology |
是否Rohs认证 | 不符合 |
厂商名称 | Linear ( ADI ) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC32,.2SQ,20 |
针数 | 32 |
制造商包装代码 | UH |
Reach Compliance Code | _compli |
ECCN代码 | 3A991.C.1 |
最大模拟输入电压 | 1 V |
最小模拟输入电压 | -1 V |
转换器类型 | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N32 |
JESD-609代码 | e0 |
长度 | 5 mm |
最大线性误差 (EL) | 0.0586% |
湿度敏感等级 | 1 |
模拟输入通道数量 | 1 |
位数 | 10 |
功能数量 | 1 |
端子数量 | 32 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC32,.2SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 235 |
电源 | 3 V |
认证状态 | Not Qualified |
采样速率 | 105 MHz |
采样并保持/跟踪并保持 | SAMPLE |
座面最大高度 | 0.8 mm |
标称供电电压 | 3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 5 mm |
LTC2250IUH#TR | LTC2250CUH#TR | LTC2251CUH#TR | LTC2251IUH#TR | |
---|---|---|---|---|
描述 | LTC2250 - 10-Bit, 105Msps Low Noise 3V ADCs; Package: QFN; Pins: 32; Temperature Range: -40°C to 85°C | LTC2250 - 10-Bit, 105Msps Low Noise 3V ADCs; Package: QFN; Pins: 32; Temperature Range: 0°C to 70°C | LTC2251 - 10-Bit, 125Msps Low Noise 3V ADCs; Package: QFN; Pins: 32; Temperature Range: 0°C to 70°C | LTC2251 - 10-Bit, 125Msps Low Noise 3V ADCs; Package: QFN; Pins: 32; Temperature Range: -40°C to 85°C |
Brand Name | Linear Technology | Linear Technology | Linear Technology | Linear Technology |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
零件包装代码 | QFN | QFN | QFN | QFN |
包装说明 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 | HVQCCN, LCC32,.2SQ,20 |
针数 | 32 | 32 | 32 | 32 |
制造商包装代码 | UH | UH | UH | UH |
Reach Compliance Code | _compli | _compli | _compli | _compli |
ECCN代码 | 3A991.C.1 | 3A991.C.1 | 3A991.C.1 | 3A991.C.1 |
最大模拟输入电压 | 1 V | 1 V | 1 V | 1 V |
最小模拟输入电压 | -1 V | -1 V | -1 V | -1 V |
转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
JESD-30 代码 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 | S-PQCC-N32 |
JESD-609代码 | e0 | e0 | e0 | e0 |
长度 | 5 mm | 5 mm | 5 mm | 5 mm |
最大线性误差 (EL) | 0.0586% | 0.0586% | 0.0586% | 0.0586% |
湿度敏感等级 | 1 | 1 | 1 | 1 |
模拟输入通道数量 | 1 | 1 | 1 | 1 |
位数 | 10 | 10 | 10 | 10 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 |
最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C |
输出位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输出格式 | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
封装等效代码 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 | LCC32,.2SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 235 | 235 | 235 | 235 |
电源 | 3 V | 3 V | 3 V | 3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
采样速率 | 105 MHz | 105 MHz | 125 MHz | 125 MHz |
采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
标称供电电压 | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 |
宽度 | 5 mm | 5 mm | 5 mm | 5 mm |
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