IC IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC, Operational Amplifier
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | compli |
| ECCN代码 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK |
| 频率补偿 | YES |
| JESD-30 代码 | R-XDIP-T8 |
| JESD-609代码 | e0 |
| 低-失调 | NO |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 技术 | BIPOLAR |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 标称均一增益带宽 | 3000000 kHz |
| 宽带 | YES |
| LT1023CJ8 | LT1023MH/883 | LT1023MJ8/883 | LT1023CH | LT1023CN8 | |
|---|---|---|---|---|---|
| 描述 | IC IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,SINGLE,BIPOLAR,CAN,8PIN,METAL, Operational Amplifier | IC IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,CERAMIC, Operational Amplifier | IC IC,OP-AMP,SINGLE,BIPOLAR,CAN,8PIN,METAL, Operational Amplifier | IC IC,OP-AMP,SINGLE,BIPOLAR,DIP,8PIN,PLASTIC, Operational Amplifier |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) | Linear ( ADI ) |
| 零件包装代码 | DIP | BCY | DIP | BCY | DIP |
| 包装说明 | DIP, DIP8,.3 | , CAN8,.2 | DIP, DIP8,.3 | , CAN8,.2 | DIP, DIP8,.3 |
| 针数 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compli | compliant | compliant | compli | compli |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 放大器类型 | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| 架构 | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| 频率补偿 | YES | YES | YES | YES | YES |
| JESD-30 代码 | R-XDIP-T8 | O-MBCY-W8 | R-XDIP-T8 | O-MBCY-W8 | R-PDIP-T8 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 低-失调 | NO | NO | NO | NO | NO |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| 封装主体材料 | CERAMIC | METAL | CERAMIC | METAL | PLASTIC/EPOXY |
| 封装等效代码 | DIP8,.3 | CAN8,.2 | DIP8,.3 | CAN8,.2 | DIP8,.3 |
| 封装形状 | RECTANGULAR | ROUND | RECTANGULAR | ROUND | RECTANGULAR |
| 封装形式 | IN-LINE | CYLINDRICAL | IN-LINE | CYLINDRICAL | IN-LINE |
| 电源 | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | WIRE | THROUGH-HOLE | WIRE | THROUGH-HOLE |
| 端子位置 | DUAL | BOTTOM | DUAL | BOTTOM | DUAL |
| 标称均一增益带宽 | 3000000 kHz | 3000000 kHz | 3000000 kHz | 3000000 kHz | 3000000 kHz |
| 宽带 | YES | YES | YES | YES | YES |
| 封装代码 | DIP | - | DIP | - | DIP |
| 表面贴装 | NO | - | NO | - | NO |
| 端子节距 | 2.54 mm | - | 2.54 mm | - | 2.54 mm |
MEMS传感器
NXP MCU
stm32/stm8
模拟电子
PCB设计
单片机
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
