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CY7C1463AV25-133AXC

产品描述36-Mbit (1M x 36/2M x 18/512K x 72) Flow-Through SRAM with NoBL™ Architecture
产品类别存储    存储   
文件大小457KB,共29页
制造商Cypress(赛普拉斯)
标准
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CY7C1463AV25-133AXC概述

36-Mbit (1M x 36/2M x 18/512K x 72) Flow-Through SRAM with NoBL™ Architecture

CY7C1463AV25-133AXC规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Cypress(赛普拉斯)
零件包装代码QFP
包装说明14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, MS-026, TQFP-100
针数100
Reach Compliance Codeunknown
ECCN代码3A991.B.2.A
最长访问时间6.5 ns
其他特性FLOW-THROUGH ARCHITECTURE
最大时钟频率 (fCLK)133 MHz
I/O 类型COMMON
JESD-30 代码R-PQFP-G100
JESD-609代码e3
长度20 mm
内存密度37748736 bit
内存集成电路类型ZBT SRAM
内存宽度18
湿度敏感等级3
功能数量1
端子数量100
字数2097152 words
字数代码2000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装等效代码QFP100,.63X.87
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
电源1.8/2.5,2.5 V
认证状态Not Qualified
座面最大高度1.6 mm
最大待机电流0.12 A
最小待机电流2.38 V
最大压摆率0.27 mA
最大供电电压 (Vsup)2.625 V
最小供电电压 (Vsup)2.375 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

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CY7C1461AV25
CY7C1463AV25
CY7C1465AV25
36-Mbit (1M x 36/2M x 18/512K x 72)
Flow-Through SRAM with NoBL™ Architecture
Features
• No Bus Latency™ (NoBL™) architecture eliminates
dead cycles between write and read cycles
• Can support up to 133-MHz bus operations with zero
wait states
— Data is transferred on every clock
• Pin-compatible and functionally equivalent to ZBT™
devices
• Internally self-timed output buffer control to eliminate
the need to use OE
• Registered inputs for flow-through operation
• Byte Write capability
• 2.5V/1.8V I/O power supply
• Fast clock-to-output times
— 6.5 ns (for 133-MHz device)
• Clock Enable (CEN) pin to enable clock and suspend
operation
• Synchronous self-timed writes
• Asynchronous Output Enable
• CY7C1461AV25, CY7C1463AV25 available in
JEDEC-standard lead-free 100-pin TQFP package,
lead-free and non-lead-free 165-ball FBGA package.
CY7C1465AV25 available in lead-free and non-lead-free
209-ball FBGA package.
• Three chip enables for simple depth expansion
• Automatic Power-down feature available using ZZ
mode or CE deselect
• IEEE 1149.1 JTAG-Compatible Boundary Scan
• Burst Capability—linear or interleaved burst order
• Low standby power
Functional Description
[1]
The CY7C1461AV25/CY7C1463AV25/CY7C1465AV25 are
2.5V, 1M
×
36/2M
×
18/512K
×
72 Synchronous Flow-through
Burst SRAMs designed specifically to support unlimited true
back-to-back Read/Write operations without the insertion of
wait
states.
The
CY7C1461AV25/CY7C1463AV25/
CY7C1465AV25 is equipped with the advanced No Bus
Latency (NoBL) logic required to enable consecutive
Read/Write operations with data being transferred on every
clock cycle. This feature dramatically improves the throughput
of data through the SRAM, especially in systems that require
frequent Write-Read transitions.
All synchronous inputs pass through input registers controlled
by the rising edge of the clock. The clock input is qualified by
the Clock Enable (CEN) signal, which when deasserted
suspends operation and extends the previous clock cycle.
Maximum access delay from the clock rise is 6.5 ns (133-MHz
device).
Write operations are controlled by the two or four Byte Write
Select (BW
X
) and a Write Enable (WE) input. All writes are
conducted with on-chip synchronous self-timed write circuitry.
Three synchronous Chip Enables (CE
1
, CE
2
, CE
3
) and an
asynchronous Output Enable (OE) provide for easy bank
selection and output tri-state control. In order to avoid bus
contention, the output drivers are synchronously tri-stated
during the data portion of a write sequence.
Selection Guide
133 MHz
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
6.5
270
120
100 MHz
8.5
250
120
Unit
ns
mA
mA
Note:
1. For best-practices recommendations, please refer to the Cypress application note
System Design Guidelines
on www.cypress.com.
Cypress Semiconductor Corporation
Document #: 38-05355 Rev. *E
198 Champion Court
San Jose
,
CA 95134-1709
408-943-2600
Revised June 22, 2006

 
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