M
ulti
-l
ayer
H
igH
-Q C
apaCitors
These lines of multilayer capacitors have been developed for
High-Q and microwave applications.
•
The
S-Series
(R03S, R07S, R14S, R15S) capacitors give an
ultra-high Q performance, and exhibit NP0 temperature char-
acteristics.
•
The
L-Series
(R05L) capacitors give mid-high Q performance,
and exhibit NP0 temperature characteristics.
•
The
E-Series
(S42E, S48E, S58E) capacitors give excellent
high-Q performance from HF to Microwave frequencies.
Typical uses are high voltage, high current applications. They
are offered in chip (Ni barrier or Non-Magnetic Pt.-Ag) or in
Non-Magnetic leaded form.
•
The
W-Series
(R05W) capacitors offer a large capacitance
value in an ultra-small 0201 package size. These exhibit a X7R
temperature characteristic.
•
RoHS compliance is standard for all unleaded parts (see
termination options box).
H
ow To
o
rder
252
VOLTAGE (DC)
6R3 = 6 .3 V
101 = 100 V
160 = 16 V
250 = 25 V
500 = 50 V
201 = 200 V
251 = 250 V
301 = 300 V
501 = 500 V
102 = 1000 V
152 = 1500 V
202 = 2000 V
252 = 2500 V
362 = 3600 V
502 = 5000 V
722 = 7200 V
S48
CASE SIZE
R03 (01005)
R05 (0201)
R07 (0402)
R14 (0603)
R15 (0805)
S42 (1111)
S48 (2525)
S58 (3838)
E
470
CAPACITANCE (pF)
1st two digits are
significant; third digit
denotes number of
zeros, R = decimal .
100 = 10 pF
101 = 100 pF
K
TOLERANCE
A = ± 0 .05 pF
B = ± 0 .10 pF
C = ± 0 .25 pF
D = ± 0 .50 pF
F = ±1 %
G = ±2%
J = ±5%
K = ± 10%
For tolerance
availability, see chart .
V
TERMINATION
Nickel Barrier
V = Ni/Sn (Green)
T = Ni/SnPb
G = Ni/Au (Green)
Non-Mag*
U = Cu/Sn (Green)
C = Cu/SnPb
Leaded (All Non-Mag)*
1 = Microstrip
2 = Axial Ribbon
3 = Axial Wire
4 = Radial Ribbon
5 = Radial Wire
4
E
PACKAGING
S = Bulk
W = Waffle Pack
01005 - 0603
Y = Paper 5” Reel
T = Paper 7” Reel
*R = Paper 13” Reel
*J = Paper 5” Reel -
Horizontally Oriented Electrodes
*N = Paper 5” Reel -
Vertically Oriented Electrodes
DIELECTRIC
S = Ultra High Q NPO
L = High Q NPO
E = Ultra High Q NPO,
High Voltage, High Power,
*T = High Temp (175C)
Ultra High Q NPO
W= X7R
*L = Paper 7” Reel -
Horizontally Oriented Electrodes
*V = Paper 7” Reel -
Vertically Oriented Electrodes
Part Number written:
252S48E470KV4E
MARKING
3 = Cap Code
& Tolerance
4 = No Marking
6 = EIA Code
(Marking on
0805 and
larger only)
0805 - 3838
Z = Embossed 5” Reel
E = Embossed 7” Reel
*U = Embossed 13” Reel
*M = Embossed 5” Reel -
Horizontally Oriented Electrodes
*Q = Embossed 5” Reel -
Vertically Oriented Electrodes
*G = Embossed 7” Reel -
Horizontally Oriented Electrodes
*P = Embossed 7” Reel -
Vertically Oriented Electrodes
Tape specifications
conform to EIA RS481
“*” - Not available for all MLCC - Call factory for info.
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7
D
ieleCTRiC
C
HaRaCTeRiSTiCS
TEMPERATURE COEFFICIENT:
QUALITy FACTOR / DF:
INSULATION RESISTANCE:
npo
0 ± 30ppm /°C, -55 to 125°C
Q
>1,000 @ 1 MHz, Typical 10,000
x7R
± 15%, -55 to 125°C
16VDC DF
≤
3.5% @ 1 KHz, 25°C
10VDC DF
≤
5.0% @ 1 KHz, 25°C
>10 GΩ @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
2.5 X WVDC Min., 25°C, 50 mA max
1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
DIELECTRIC STRENGTH:
TEST PARAMETERS:
AVAILABLE CAPACITANCE:
>500
ΩF*
or 10 GΩ* @ 25°C,WVDC;
125°C IR is 10% of 25°C rating
* whichever is less
2.5 X WVDC Min., 25°C, 50 mA max
1KHz ±50Hz, 1.0±0.2 VRMS, 25°C
100 - 10,000 pF
Size 01005:
Size 0201:
Size 0402:
Size 0603:
Size 0805:
Size 1111:
Size 2525:
Size 3838:
0.2 - 10 pF
0.2 - 100 pF
0.2 - 33 pF
0.2 - 100 pF
0.3 - 220 pF
0.2 - 1000 pF
1.0 - 2700 pF
1.0 - 5100 pF
m
eCHaniCal
& e
nvironmenTal
C
HaraCTerisTiCs
SPECIFICATION
SOLDERABILITy:
RESISTANCE TO
SOLDERING HEAT:
Solder coverage
≥
90% of metalized areas
No termination degradation
No mechanical damage
Capacitance change: ±2.5% or 0.25pF
Q>500 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
Capacitance change: 2% or 0.5pF Max
No mechanical damage
Capacitance change: ±3.0% or 0.3 pF
Q>500 I.R. >1 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>2000 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R.
≥
1 G-Ohm
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R. = 1 G-Ohm min.
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>1000 I.R.
≥
10 G-Ohm
Breakdown voltage: 2.5 x WVDC
TEST PARAMETERS
Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux
then dip in Sn62 solder @ 240°±5°C for 5±1 sec
Preheat device to 80°-100°C for 60 sec.
followed by 150°-180°C for 60 sec.
Dip in 260°±5°C solder for 10±1 sec.
Measure after 24±2 hour cooling period
Linear pull force* exerted on axial leads soldered to each terminal.
*0402
≥
2.0lbs, 0603
≥
2.0lbs (min.)
Glass epoxy PCB: 0.5 mm deflection
Applied voltage: 200% rated voltage, 50 mA max.
Temperature: 125°±3°C
Test time: 1000+48-0 hours
5 cycles of: 30±3 minutes @ -55°+0/-3°C,
2-3 min. @ 25°C, 30±3 min. @ +125°+3/-0°C,
2-3 min. @ 25°C
Measure after 24±2 hour cooling period
Relative humidity: 90-95%
Temperature: 40°±2°C
Test time: 500 +12/-0 Hours
Measure after 24±2 hour cooling period
Applied voltage: 1.5 VDC, 50 mA max.
Relative humidity: 85±2% Temperature: 40°±2°C
Test time: 240 +12/-0 Hours
Measure after 24±2 hour cooling period
Cycle performed for 2 hours in each of three perpendicular directions
Frequency range 10Hz to 55 Hz to 10 Hz traversed
in 1 minute. Harmonic motion amplitude: 1.5mm
TERMINAL
ADHESION:
PCB DEFLECTION:
LIFE TEST:
THERMAL CyCLE:
HUMIDITy,
STEADy STATE:
HUMIDITy,
LOW VOLTAGE:
VIBRATION:
10
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NXP MCU
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