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HM23C1025A: 产品描述MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32; 产品类别存储存储; 文件大小346KB，共6页; 制造商Hualon Microelectronics Corp

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HM23C1025A概述

MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

HM23C1025A规格参数

参数名称	属性值
厂商名称	Hualon Microelectronics Corp
零件包装代码	DIP
包装说明	DIP,
针数	32
Reach Compliance Code	unknow
ECCN代码	EAR99
最长访问时间	150 ns
其他特性	AUTOMATIC POWER-DOWN
JESD-30 代码	R-PDIP-T32
内存密度	1048576 bi
内存集成电路类型	MASK ROM
内存宽度	8
功能数量	1
端子数量	32
字数	131072 words
字数代码	128000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	128KX8
输出特性	3-STATE
封装主体材料	PLASTIC/EPOXY
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
并行/串行	PARALLEL
认证状态	Not Qualified
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子形式	THROUGH-HOLE
端子位置	DUAL

HM23C1025A相似产品对比

	HM23C1025A	HM23C1025AEM	HM23C1025AM	HM23C1025EM	HM23C1025M	HM23C1025	HM23C1025AE	HM23C1025E
描述	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32	MASK ROM, 128KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
厂商名称	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp	Hualon Microelectronics Corp
零件包装代码	DIP	SOIC	SOIC	SOIC	SOIC	DIP	DIP	DIP
包装说明	DIP,	SOP,	SOP,	SOP,	SOP,	DIP,	DIP,	DIP,
针数	32	32	32	32	32	32	32	32
Reach Compliance Code	unknow	unknow	unknow	unknow	unknow	unknow	unknow	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	150 ns	150 ns	150 ns	150 ns	150 ns	150 ns	150 ns	150 ns
JESD-30 代码	R-PDIP-T32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32	R-PDIP-T32	R-PDIP-T32
内存密度	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi	1048576 bi
内存集成电路类型	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
端子数量	32	32	32	32	32	32	32	32
字数	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
字数代码	128000	128000	128000	128000	128000	128000	128000	128000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8	128KX8
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	DIP	SOP	SOP	SOP	SOP	DIP	DIP	DIP
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	IN-LINE	IN-LINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	YES	YES	YES	YES	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	THROUGH-HOLE	THROUGH-HOLE	THROUGH-HOLE
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
其他特性	AUTOMATIC POWER-DOWN	AUTOMATIC POWER-DOWN; PIN COMPATIBLE WITH 27C010	AUTOMATIC POWER-DOWN	PIN COMPATIBLE WITH 27C010	-	-	AUTOMATIC POWER-DOWN; PIN COMPATIBLE WITH 27C010	PIN COMPATIBLE WITH 27C010

HM23C1025A

HM23C1025A概述

HM23C1025A规格参数

HM23C1025A相似产品对比

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