TC55V1325FF,TC55V1325FF pdf中文资料,TC55V1325FF引脚图,TC55V1325FF电路-Datasheet-电子工程世界

TC55V1325FF: 产品描述32,768-WORD BY 32-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM; 文件大小1MB，共18页; 制造商Toshiba(东芝); 官网地址http://toshiba-semicon-storage.com/

下载文档选型对比全文预览

TC55V1325FF概述

32,768-WORD BY 32-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM

TC55V1325FF相似产品对比

	TC55V1325FF	TC55V1325FF-8	TC55V1325FF-7	TC55V1325FF-12	TC55V1325FF-10
描述	32,768-WORD BY 32-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM	32,768-WORD BY 32-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM	32,768-WORD BY 32-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM	32,768-WORD BY 32-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM	32,768-WORD BY 32-BIT SYNCHRONOUS PIPELINED BURST STATIC RAM
是否Rohs认证	-	不符合	不符合	-	不符合
厂商名称	-	Toshiba(东芝)	Toshiba(东芝)	Toshiba(东芝)	Toshiba(东芝)
零件包装代码	-	QFP	QFP	QFP	QFP
包装说明	-	14 X 20 MM, 1.6 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100	14 X 20 MM, 1.6 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100	14 X 20 MM, 1.6 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100	14 X 20 MM, 1.6 MM HEIGHT, 0.65 MM PITCH, PLASTIC, LQFP-100
针数	-	100	100	100	100
Reach Compliance Code	-	unknow	unknow	unknow	unknow
最长访问时间	-	8 ns	7 ns	12 ns	10 ns
其他特性	-	SYNCHRONOUS SELF-TIMED WRITE	SYNCHRONOUS SELF-TIMED WRITE	SYNCHRONOUS SELF-TIMED WRITE	SYNCHRONOUS SELF-TIMED WRITE
JESD-30 代码	-	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609代码	-	e0	e0	-	e0
长度	-	20 mm	20 mm	20 mm	20 mm
内存密度	-	1048576 bi	1048576 bi	1048576 bi	1048576 bi
内存集成电路类型	-	CACHE SRAM	CACHE SRAM	CACHE SRAM	CACHE SRAM
内存宽度	-	32	32	32	32
功能数量	-	1	1	1	1
端口数量	-	1	-	1	1
端子数量	-	100	100	100	100
字数	-	32768 words	32768 words	32768 words	32768 words
字数代码	-	32000	32000	32000	32000
工作模式	-	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	-	70 °C	70 °C	70 °C	70 °C
组织	-	32KX32	32KX32	32KX32	32KX32
输出特性	-	3-STATE	-	3-STATE	3-STATE
可输出	-	YES	-	YES	YES
封装主体材料	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	-	LQFP	LQFP	LQFP	LQFP
封装形状	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	-	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
并行/串行	-	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	-	NOT SPECIFIED	240	-	NOT SPECIFIED
认证状态	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	-	1.7 mm	1.7 mm	1.7 mm	1.7 mm
最大供电电压 (Vsup)	-	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	-	3.1 V	3.1 V	3.1 V	3.1 V
标称供电电压 (Vsup)	-	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	-	YES	YES	YES	YES
技术	-	CMOS	CMOS	CMOS	CMOS
温度等级	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	-	TIN LEAD	TIN LEAD	-	TIN LEAD
端子形式	-	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	-	0.65 mm	0.65 mm	0.65 mm	0.65 mm
端子位置	-	QUAD	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	-	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED
宽度	-	14 mm	14 mm	14 mm	14 mm

推荐资源

器件捷径: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多