New Features
–
–
–
–
–
–
Battery backup mode
Hardshort retry
Over current Filter
Insertion Limits
Selectable Gate Current
Voltage Regulator Output
X80070/71/72/73
Hot Swap Controller with
Advanced Fault Protection and
Voltage Regulator Output
DESCRIPTION
The X80070 is a hot swap controller that allows a board to be
safely inserted and removed from a live backplane without
turning off the main power supply.
During insertion, the gate of an external power MOSFET is
clamped low to suppress contact bounce. The under-voltage/
over-voltage circuits and the power on reset circuitry suppress
the gate turn on until the mechanical bounce has ended. The
X80070 turns on the gate with a slew rate to limit the inrush
current and incorporates an electronic circuit breaker set by a
sense resistor. After the load is successfully charged, the
PWRGD signal is asserted; indicating that the device is ready to
power sequence the DC-DC power bricks.
At all times, the X80070 monitors for undervoltage, overvoltage,
and overcurrent conditions. If any fault occurs, the gate will be
immediately shut off and the PWRGD will be returned to the
inactive state. The X80070 contains overvoltage, undervoltage
and overcurrent detection, hardshort retry, gate control slew rate
and power good control.
FEATURES
• Hot swap controller
— Overvoltage and undervoltage protection
— Undervoltage lockout for battery/redundant supplies
— Electronic circuit breaker
— Slew Rate for External FET Gate Control
— Overcurrent Detection and Gate Shut-off
— 3X overcurrent limit on insertion
— 5µs overcurrent filter
— Hardshort Retry and Indicator
— Typically operates from -30V to -80V. Tolerates transients
to -200V (limited by external components)
— Positive Voltages (low side switching) from 12V to 60V
— Soft Re-insertion
— Soft extraction
• Voltage Regulator Output for Supervisory Functions
• Debounced manual reset input
• Available packages
— 20-lead Quad No-Lead Frame (QFN)
APPLICATIONS
• -48V Hot Swap Power Backplane/Distribution Central
Office, Ethernet for VOIP
• Positive Voltage Hotswap 12V to 60V Applications
(low side switching)
• Card Insertion Detection
• IP Phone Applications
• Databus Power Interfacing
• Custom Industrial Power Backplanes
• Distributed Power Systems
TYPICAL APPLICATION
-48V
Return
*
X80070
V
RGO
DC-DC
Module
1
ON/OFF
R5
30k
1%
R4
182k
1%
PWRGD
UV=43V
V
UV/OV
OV=75V
V
DD
I
GQ1
I
GQ0
Gate
Current
Select
SENSE GATE
100n
Rs
*
*
R6
10k
1%
V
EE
100
22K
3.3n
-48V
0.02Ω
5%
Q1
IRFR120
*
Optional components DC-DC Module
Depends on choice of
Characteristics subject to change without notice
REV 1.22 1/14/03
www.xicor.com
1 of 14
X80070/71/72/73 – Preliminary Information
ORDERING INFORMATION
QFN package
(Top view)
BATT-ON
PWRGD
IGQ0
IGQ1
V
RGO
DNC
DNC
DNC
V
DD
20 19 18 17 16
15
1
14
2
3
5mm x 5mm
13
12
4
5
6 7
V
UV/OV
V
EE
8
SENSE
11
9 10
GATE
DNC
MR
FAR
DNC
NA
NA
DNC
ORDER
NUMBER
X80070Q24I
X80071Q24I
X80072Q24I
X80073Q24I
OV
(V)
74.9
68.0
74.9
68.0
UV1
(V)
42.4
42.4
42.4
42.4
UV2
(V)
33.2
33.2
33.2
33.2
t
NF
(us)
5
5
5
5
V
OC
(mV)
50
50
50
50
Over Retry
V
OCI
Current Delay I
GATE
T
DELAY
(mV) Retry (ms) (uA)
(ms)
150 Always 100
50
100
150 Always 100
50
100
150 5 retries 100
50
100
150 5 retries 100
50
100
t
POR
(ms)
100
100
100
100
Temp
-40
o
C to 85
o
C
-40
o
C to 85
o
C
-40
o
C to 85
o
C
-40
o
C to 85
o
C
PART
MARK
80070I
80071I
80072I
80073I
ABSOLUTE MAXIMUM RATINGS
Temperature under bias ............................. –65°C to +135°C
Storage temperature .................................. –65°C to +150°C
Voltage on given pin (Hot Side Functions):
V
ov / uv pin
............................................................5.5V + V
EE
SENSE pin .......................................................400mV + V
EE
V
EE
pin...........................................................................-80V
PWRGD pin ........................................................... 7 V + V
EE
GATE pin.............................................................. V
DD
+ V
EE
FAR pin ...................................................................7V + V
EE
MR pin..................................................................5.5V + V
EE
BATT-ON pin ........................................................5.5V + V
EE
Voltage on given pin (Cold Side Functions):
IGQ1 and IGQ0 pins ............................................5.5V + V
EE
V
DD
pin .................................................................14V + V
EE
D.C. output current ......................................................... 5mA
Lead temperature (soldering, 10 seconds) ................. 300°C
COMMENT
Stresses above those listed under “Absolute Maximum Ratings”
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device (at these or any
other conditions above those listed in the operational sections
of this specification) is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
RECOMMENDED OPERATING CONDITIONS
Temperature
Industrial
Min.
–40°C
Supply Voltage
V
DD
= 12V
Max.
+85°C
REV 1.22 1/14/03
www.xicor.com
Characteristics subject to change without notice
2 of 14
X80070/71/72/73 – Preliminary Information
ELECTRICAL CHARACTERISTICS
(Standard Settings)
(Over the recommended operating conditions unless otherwise specified).
Symbol
Parameter
Min.
10
4.5
46.2
52.5
Typ.
12
2.5
Max.
14
5
5.5
50
58.8
Unit
V
mA
I
RGO
=10uA
Gate Drive On,
V
GATE
= V
EE
,
V
SENSE
= V
EE
(sourcing)
mA V
GATE
- V
EE
= 3V
V
SENSE
-V
EE
= 0.1V (sinking)
V I
GATE
= 50uA
V
V
V
µA
µA
V
V
I
OL
= 4.0 mA
(V
EE
+ 2.7 to V
EE
+ 5.5V)
I
OL
= 2.0 mA
(V
EE
+ 2.7 to V
EE
+ 3.6V)
pF V
OUT
= 0V
pF V
IN
= 0V
mV V
OC
= V
SENSE
- V
EE
mV V
OC
= V
SENSE
- V
EE
PWRGD = HIGH
Initial Power Up condition
V
Referenced to V
EE
V
Referenced to V
EE
V
UV1
< V
UV/OV
< V
OV
µA
µA
Test Conditions
DC Characteristics
Supply Operating Range
V
DD
Supply Current
I
DD
V
RGO
Regulated 5V output
I
RGO
V
RGO
current output
I
GATE
Gate Pin Current
9
V
GATE
V
PGA
V
IHB
V
ILB
I
LI
I
LO
V
IL
V
IH
V
OL
External Gate Drive (Slew Rate
V
DD
-1
Control)
Power Good Threshold
0.9
(PWRGD High to Low)
Voltage Input High (BATT-ON)
V
EE
+ 4
Voltage Input Low (BATT-ON)
Input Leakage Current (MR, IGQ0,
IGQ1)
Output Leakage Current (PWRGD)
Input LOW Voltage (MR, IGQ0,
-0.5 + V
EE
IGQ1)
Input HIGH Voltage (MR, IGQ0,
(V
EE
+ 5) x 0.7
IGQ1)
Output LOW Voltage
(FAR, PWRGD)
V
DD
1
1.1
V
EE
+ 5
V
EE
+ 2
10
10
(V
EE
+ 5) x 0.3
(V
EE
+ 5) + 0.5
V
IL
= GND to
V
CC
Gate is Off
V
EE
+
0.4
C
OUT
(1)
C
IN
(1)
V
OC
V
OCI
Output Capacitance (FAR)
Input Capacitance (MR)
Over-current threshold
Over-current threshold (Insertion)
45
135
50
150
8
6
55
165
V
OVR
Overvoltage threshold (rising)
X80070, X80072
X80071, X80073
V
OVF
Overvoltage threshold (falling)
3.85
3.49
3.82
3.46
2.19
2.16
1.71
1.68
3.90
3.54
3.87
3.51
2.24
2.21
1.76
1.73
3.95
3.59
3.92
3.56
2.29
2.26
1.81
1.78
X80070, X80072
X80071, X80073
V
UV1R
V
UV1F
V
UV2R
V
UV2F
Undervoltage 1 threshold (rising)
Undervoltage 1 threshold (falling)
Undervoltage 2 threshold (rising)
Undervoltage 2 threshold (falling)
V
V
V
V
V
Referenced to V
EE
Referenced to V
EE
BATT-ON = V
EE
Referenced to V
EE
BATT-ON = V
RGO
REV 1.22 1/14/03
www.xicor.com
Characteristics subject to change without notice
3 of 14
X80070/71/72/73 – Preliminary Information
ELECTRICAL CHARACTERISTICS
(Standard Settings) (Continued)
(Over the recommended operating conditions unless otherwise specified).
Symbol
Parameter
Min.
1.5
0.5
1.0
1.2
Typ.
2.5
1.0
1.5
1.6
100
5
1.0
1.8
1.6
2.4
2.6
1
90
4.5
45
100
5
50
110
5.5
55
Max.
3.5
1.5
2
2
Unit
µs
µs
µs
µs
ns
µs
µs
µs
µs
ms
µs
ms
I
GATE
= 60µA, No Load
I
GATE
= 60µA, No Load
V
DD
does not drop below 3V,
No other failure conditions.
Test Conditions
AC Characteristics
t
FOC
Sense High to Gate Low
t
FUV
Under Voltage conditions to Gate
Low
Overvoltage Conditions to Gate
t
FOV
Low
Overvoltage/undervoltage failure
t
VFR
recovery time to Gate =1V.
t
BATT-ON
Delay BATT-ON Valid
t
MR
Minimum time high for reset valid
on the MR pin
Delay from MR enable to Gate Pin
t
MRE
LOW
Delay from MR disable to GATE
t
MRD
reaching 1V
Delay from IGQ1 and IGQ0 to valid
t
QC
Gate pin current
t
SC_RETRY
Delay between Retries
t
NF
Noise Filter for Overcurrent
t
DPOR
Device Delay before Gate assertion
Notes:
(1) This parameter is based on characterization data.
EQUIVALENT A.C. OUTPUT LOAD CIRCUIT
5V
4.6KΩ
PWRGD
FAR
30pF
A.C. TEST CONDITIONS
Input pulse levels
Input rise and fall times
Input and output timing levels
Output load
V
CC
x 0.1 to
V
CC
x 0.9
10ns
V
CC
x 0.5
Standard output load
REV 1.22 1/14/03
www.xicor.com
Characteristics subject to change without notice
4 of 14
X80070/71/72/73 – Preliminary Information
Figure 1. Overvoltage/Undervoltage GATE Timing
V
TH
V
DD
V
OV
V
UV
V
UV/OV
t
FOV
t
VFR
t
FUV
t
VFR
t
DPOR
MR
V
OCI
V
OC
SENSE
1V
1V
GATE
Figure 2. Overcurrent GATE Timing
V
TH
V
DD
V
OCI
V
OC
SENSE
t
FOC
GATE
t
SC_RETRY
t
FOC
t
SC_RETRY
t
DPOR
Always Retry
V
UV <
V
UV/OV <
V
OV
MR = HIGH
Figure 3. Manual Reset
MR
t
MR
GATE
t
MRE
1V
t
MRD
REV 1.22 1/14/03
www.xicor.com
Characteristics subject to change without notice
5 of 14
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