Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
SAK-XC2734X-40F80L AA
MA001026362
PG-LQFP-64-6
Material Group
inorganic material
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
organic material
plastics
inorganic material
non noble metal
noble metal
plastics
noble metal
< 10%
Substances
silicon
phosphorus
zinc
iron
copper
gold
carbon black
epoxy resin
silicondioxide
tin
silver
epoxy resin
silver
CAS#
if applicable
7440-21-3
7723-14-0
7440-66-6
7439-89-6
7440-50-8
7440-57-5
1333-86-4
-
60676-86-0
7440-31-5
7440-22-4
-
7440-22-4
Issued
Weight*
Weight
[mg]
28.688
0.032
0.130
2.600
105.558
1.862
1.096
29.600
188.562
4.066
1.611
2.161
6.482
Average
Mass
[%]
7.70
0.01
0.03
0.70
28.34
0.50
0.29
7.95
50.64
1.09
0.43
0.58
1.74
29. August 2013
372.45 mg
Sum
[%]
7.70
Average
Mass
[ppm]
77025
87
349
6980
29.08
0.50
283417
4999
2943
79474
58.88
1.09
0.43
506278
10916
4325
5802
2.32
17405
23207
1000000
588695
10916
4325
290833
4999
Sum
[ppm]
77025
wire
encapsulation
leadfinish
plating
glue
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com
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