Material Content Data Sheet
Sales Product Name
MA#
Package
Construction Element
chip
leadframe
IPW60R045CP
MA000849064
PG-TO247-3-41
Material Group
inorganic material
non noble metal
inorganic material
non noble metal
non noble metal
organic material
plastics
inorganic material
non noble metal
non noble metal
non noble metal
noble metal
non noble metal
< 10%
Substances
silicon
iron
phosphorus
copper
aluminium
carbon black
epoxy resin
silicondioxide
tin
nickel
antimony
silver
tin
CAS#
if applicable
7440-21-3
7439-89-6
7723-14-0
7440-50-8
7429-90-5
1333-86-4
-
60676-86-0
7440-31-5
7440-02-0
7440-36-0
7440-22-4
7440-31-5
Issued
Weight*
Weight
[mg]
35.449
3.972
1.192
3967.074
13.036
19.661
373.566
1572.908
31.874
29.065
1.247
3.118
8.106
Average
Mass
[%]
0.58
0.07
0.02
65.47
0.22
0.32
6.16
25.95
0.53
0.48
0.02
0.05
0.13
29. August 2013
6060.27 mg
Sum
[%]
0.58
Average
Mass
[ppm]
5849
655
197
65.56
0.22
654604
2151
3244
61642
32.43
0.53
0.48
259544
5260
4796
206
514
0.20
1338
2058
1000000
324430
5260
4796
655456
2151
Sum
[ppm]
5849
wire
encapsulation
leadfinish
plating
solder
*deviation
Sum in total: 100,00
Important Remarks:
1.
2.
3.
Infineon Technologies AG provides full material declaration based on information provided by third parties and
has taken and continues to take reasonable steps to provide representative and accurate information.
Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited information may not be available for release.
All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any
time due to technical requirements and development without notification.
Company
Address
Internet
Infineon Technologies AG
81726 München
www.infineon.com